Coordinate Measurement Machine
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1 Inspection Tools
2 Coordinate Measurement Machine Application: Measure distance, radius, diameter, and Z-height Stage dimensions: Objectives: 0.5X, 2.5X Variable zoom Units: US Standard, Metric Contact: Robert Kurpiela
3 Dage XD7600 X-Ray System Application: Non-destructive internal inspection 70 oblique angle views Automated inspection routines Automatic void measurements Maximum board size: 508mm x 444mm x 50mm Maximum sample weight: 5kg Model Number: XD7600 Contact: Wayne Jones jonesw@uic.com
4 Kohyoung Zenith Inspection System Application: Assembly inspection, missing components, offset, rotation, polarity, upside down, coplanarity, solder fillet, lifted lead, tombstoning, bridging, and billboarding 3D shadow free moiré technology with 8 way projection Camera pixel resolution: 15μm Height resolution: 2μm Maximum board size: 510mm x 490mm x 5mm Maximum board weight: 6kg Model Number: Zenith Contact: Babak Arfaei Babak.Arfaei@uic.com
5 Kohyoung Aspire2 Inspection System Application: 3-D solder paste inspection of volume, area, height, offset, bridging, shape deformity, coplanarity High Speed Mode, High Precision Mode PCB warpage compensation Maximum board size: 510mm x 510mm Minimum board size: 50mm x 50mm Model Number: Aspire2 Contact: Babak Arfaei Babak.Arfaei@uic.com
6 Cyber Optics SE500 3-D Solder Paste Inspection Application: 3-D solder paste inspection Inspection Speed: 80cm 2 /sec Inspect pads down to 150μm x 150μm Measure paste height, area, and volume Model Number: SE500 Contact: Mike Meilunas meilunas@uic.com
7 Akrometrics TherMoire PS200 Application: Component warpage, board bow and twist Maximum sample size: 200mm x 200mm 100 (2.5μm resolution) and 300 (0.8μm resolution) line per inch gratings Infrared oven for insitu warpage measurements up to 260 C 3-D contour images, cord/diagonal measurements. Model Number: PS200 Contact: Harry Schoeller Harry.Schoeller@uic.com
8 Leica Optical Microscope Application: Inspection, process control, microstructure analysis, defect/failure analysis Magnification up to 1000X Bright field, dark field, cross-polarized light Q-capture software for measurements and analysis Contact: Wayne Jones
9 FCI Scanning Electron Microscope w/eds Application: Inspection, process control, microstructure analysis, defect/failure analysis, elemental analysis High Vacuum and Environmental SEM modes Secondary Electron, Backscatter Electron detectors Energy Dispersive Spectrometry (EDS) Contact: Pericles Kondos
10 CyberOptics Laser Profilometer Application: Map surface topography, roughness, and line-scanned profiles. 3 Point Range Sensors, PRS15, PRS40, PRS150 Resolution down to 0.03mils (PRS15) X-Y stepper resolution 0.1mil Air table Contact: Pericles Kondos kondos@uic.com
11 Wetting Balance Tester Application: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires. Solder bath, dab pad, flux pool 10N Load Cell Various sample holders and pins Model Number: KWB-1000 Contact: Wayne Jones
12 Metcal Optical Inspection System Application: Endoscopic optical inspection of wire bonds, BGAs, through-holes, J-legs, gullwings, leaded heel fillets, solder paste and adhesive deposits and height measurements. Inspect standoffs as low as 0.05mm Maximum magnification: 245X MT2 tips fit between 0.7mm pitch Contact: Robert Kurpiela
13 Machine Shop Equipment: Lathe Vertical Milling Machine Drill press Shear press Grinders Various other tools Contact: Robert Kurpiela
14 Wet Lab Equipment: Belt grinder Automatic / manual polishing equipment Wet Saw Diamond Saw Fume hood Ultrasonic cleaner Optical microscopes Various cross sectioning tools Contact: Antoinette Chvatal Antoinette.Chvatal@uic.com
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