This is the summary of changes to MIL-STD-883 for Revision H February 28, 2010

Transcription

1 Item No. Section of Change Paragraph to be Changed Description of Change Justification for Change Page(s) Changed Forward Comment Change the ASSIST web address From: To: DAPS is now using Secure Socket. DAPS Services ii Main Body. Government documents. Change the address From: To: In the Copies of these documents are available... section delete second web address for DAPS. Update information. Required by MIL-STD-96. Main Body. Non-government publications. Change the ASSIST web address From: To: For the ISO documents: Change governing body: From: Institute of Environmental Sciences and Technology To: International Organization for Standardization DAPS is now using Secure Socket. DAPS Services Information for this document s governing body has changed as indicated. Web info: From: To: Contact Address: ISO,, ch. de la Voie-Creuse Case postale 56, CH- Geneva 0, Switzerland.

2 . Main Body. Non-government publications. 5 Main Body. Non-government publications. 6 Main Body. Non-government publications. 7 Main Body. Non-government Publications. Under ANSI listings Change From: ANSI/NCSL Z50- Calibration Laboratories and Measuring and Test Equipment To: ANSI/NCSL Z50. Requirements for the Calibration of Measuring and Test Equipment. Under EIA listings Change Add EIA/JESD-B6, Wire Bond Shear Test Under EIA listings Change From: EIA-557-A To: EIA-557 Under American Society For Testing and Materials (ASTM): This is the correct replacement for the withdrawn document. This document has been added as a reference to TM-0. To allow use of the latest revision document. -5 Change ASTM E 56 to ASTM F 56 Editorial Correction Add: ASTM E 80, Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices. This document is referenced in TM 0 8 Main Body. Order of precedence. Replace referenced thermal expansion document: From: ASTM D 86 To: ASTM E 8 Add these words at the beginning of the section: Unless otherwise noted herein or in the contract, ASTM D 86 has been canceled and is superseded by ASTM E 8. Required by MIL-STD Main Body.. Calibration Change the referenced document From: ANSI/NCSL Z50- To: ANSI/NCSL Z50. 0 Main Body.5. Calibration requirements. Change the referenced document From: ANSI/NCSL Z50- To: ANSI/NCSL Z50. This is the correct replacement for the withdrawn document. This is the correct replacement for the withdrawn document. 7

3 Main Body.7 Recycled, recovered, and environmentally Add this new section to recommend the use of environmentally preferable materials. preferable materials. Main Body Concluding Material Change Custodians List From: Air Force - To: Air Force Change Review activities list as follows: Remove: Navy OS and TD Add: Air Force 0 Remove the Concluding Materials and relocate the information to the last page of document. Main Body Concluding Material Change the ASSIST web address From: To: TM 005 Steady-state Life Figure TM 0 Seal... Test condition A,flexible method. In the NOTE Change connect to connected For the formula for R, the description of variables in the formula, change the M A value From 8.7 To TM 0 Seal Appendix A Add this new appendix for Cumulative Helium Leak Test to be an optional procedure. Required by MIL-STD-96. Air Force letter from 0 SCMS/GUED dated 7 May 008. USAF Current information from SD-. Required by MIL-STD-96. DAPS is now using Secure Socket. DAPS Services Grammer correction Examination of the values shows a difference with MIL-STD-750. This change makes the two documents agree. Confirmation with NIST documentation shows the new value to be correct. This procedure is being used by some to respond to semiconductor device testing. This will allow those already having the equipment to use it for microcircuits

4 7 TM 05 Burnin Test 8 TM 06 Life/Reliability Characterization Tests 9 TM 06 Life/Reliability Characterization Tests 0 TM 08 Internal Gas Analysis TM 09 Ionizating Radiation (Total Dose) Test Procedure TM 0 `Dose Rate Upset Testing of Digital Microcircuits TM 0 Dose Rate Response and Threshold for Upset TM 00 Constant Acceleration. Procedure Change the referenced specification From: MIL-I-855 To: MIL-PRF-855. Purpose Change the failure rate symbol From: ( ) To: (λ).6. Life distribution analysis Entire method..0. Post-irradiation procedure..7 General purpose test equipment... Dosimetry System Change the failure rate symbol From: ( ) To: (σ) Replace this method with the one that has been added to MIL-STD-750 which has just been rewritten. Add provisions for the shipping of test units between manufacturers and test labs using dry ice. Extend the allowed time for the post irradiation exposure electrical test from hour to 7 hours in such a case. Change the referenced document From: ANSI/NCSL Z50- To: ANSI/NCSL Z50. Change referenced document From: ASTM E 56 To: ASTM F 56 Procedure Add a statement or indicator explaining that the table values for Stress Levels (g) are absolute minimums with no lower tolerances. Technical Correction Editorial Correction Editorial Correction Work has been done to revise the test method for MIL-STD-750 to incorporate improvements. personnel believe its accurate and beneficial for MIL-STD-88. Test labs also request a single test method to operate from for ease of application. Is necessary because many manufacturers do not have irradiation facilities and need to send parts out for services. JEDEC JC-. This is the correct replacement for the withdrawn document. Editorial Correction. DSSC Based on customer questions, confusion needs clarified. OEM - 5

5 5 TM 00 Mechanical Shock 6 TM 00 Solderability 7 TM 00 Solderability 8 TM 00 Lead Integrity 9 TM 009 External Visual 0 TM 00 Internal Visual (Monolithic) TM 00 Internal Visual (Monolithic) TM 0 Bond Strength (Destructive Bond Pull Test) Procedure Add a statement or indicator explaining that the table values for g level (peak) are absolute minimums with no lower tolerances.. Test Method Add Section:.. Solder dipping of gold plated terminations.. Test Method Add a Note to clarify that the sampling count required refers only to actual leads used and not to all leads of each device used in the testing... Optional procedure for fine pitch/small leads..6 Ball/column Grid Array leads Procedure Part c, Inspection Control...6 Metallization bridging In the first sentence add a comma (,) after the words by the following formula. In the second sentence change From: grams/lb. Where K is To: grams/lb, where K is Add new section for failure criteria for BGA tests. Renumber the subsequent paragraphs accordingly. Renumber subsequent paragraghs appropriately. Change the symbol in the phrase From: 0.5 xm or greater To: 0.5 µm or greater In places In part b, (Condition A, only) add limits for shooting metal as not greater than.0 mils. Procedure Add a statement at the end of the paragraph saying the following: The stress required to achieve bond failure shall be observed and the physical location of the point of failure shall be recorded as being one of the listed categories (see..). Based on customer questions, confusion needs clarified. OEM J-STD-00 has no provisions for this and is necessary. JEDEC request Based on customer questions, confusion needs clarified. Editorial Correction. G- request. Based on Area Array Packaging Issues being studied by them to generate criteria not currently provided in the method. Task Group #G009 Editorial Correction. Technical correction requested by aerospace. Aerospace The original TM had this statement and is meant to form part of the purpose for testing. The statement is added back in to make this more clearly expressed. OEM - 7 5

6 TM 0 Bond Strength (Destructive Bond Pull Test) TM 0 Bond Strength (Destructive Bond Pull Test).. Test Condition D - Wire pull (double bond).. Test condition D Wire pull (Double Bond) Add direction for hook placement in the bond loop and pulling instructions. Change pull location From: center of the wire... To: between midspan and loop apex... JEDEC JC-.5 Task Group. Letter presented to on Jan 008. Ballot Initiative No. JC JEDEC JC-.5 Task Group. Letter presented to on Jan 008. Ballot Initiative No. JC TM 0 Bond Strength (Destructive Bond Pull Test) 6 TM 0 Bond Strength (Destructive Bond Pull Test) 7 TM 0 Radiography Figure Wire Ball Bond Shear... Non-film techniques, when specified. Add a new Figure 0-. Bond pull hook placement location. Renumber subsequent figures accordingly.. Add a new section for Wire Ball Bond Shear tests with direction to follow the procedures in accordance with EIA/JESD-B6, Wire Bond Shear Test Method. Delete the phrase when specified and allow for the use of Real Time X-ray. JEDEC JC-.5 Task Group. Letter presented to on Jan 008. Ballot Initiative No. JC Current standard lacks direction in this area. This will provide a common method. Federal Agency (NIST) Real Time X-ray is a viable alternative to film techniques when applicable precautions are observed. Manufacturer 5-7 6

7 8 TM 0 Radiography.7 Personnel safety precautions Change the referenced documents. This paragraph refers to the National Institute of Standards and Technology (NIST) Handbook 76 X-ray Protection and to the NIST Handbook 7 Protection Against Radiation From Sealed Gamma Sources. 9 TM 07 Internal Visual (Hybrids) 0 TM 07 Internal Visual (Hybrids) TM 07 Internal Visual (Hybrids) c Inspection control..f () Foreign material. Change the symbol in the phrase From: 0.5 xm or greater To: 0.5 µm or greater In places In the first sentence, change the word of to the word or such that it reads -... any material that is foreign to the microcircuit or any non-foreign material that is displaced General. In part b, (Class K only) add limits for shooting metal as not greater than.0 mils These documents have been superseded by the National Council on Radiation Protection and Measurements: Report Number 0 Medical X- ray, Electron Beam and Gamma Ray Protection for Energies Up to 50MeV and Report Number 00 Protection Against Radiation from Brachytherapy Sources. Editorial Correction. Editorial Correction. Technical Correction Aerospace 6 7

8 TM 08 Scanning Electron Microscope (SEM) Inspections TM 09 Die Shear Strength TM 09 Die Shear Strength 5 TM 00 Particle Impact Noise Detection Test 6 TM 0 Nondestructive Bond Pull 7 TM 0 Nondestructive Bond Pull 8 TM 0 Nondestructive Bond Pull Figure Steep passivation step (MOS) (accept) Rotate this figure by 80 degrees.. Failure criteria In sections.. and.., add further explanation for how to interpret these failures. Figure 09-, Die shear strength criteria (minimum force versus die attach area)..5 Screening lot acceptance In example below the chart, (see example in the Alternately section.) Change the calculated minimum forces required: From. Kg,.5 Kg, and.8 Kg To:.0,.05 and.08 Kg respectively. And From: 6 Kg, 80 kg, and 8 kg To:.6 kg,.80 kg, and.8 kg, respectively. Add a note saying: If the lot count is 00 devices or fewer, or reaches 00 devices or fewer following a run, then no failures are allowed for any subsequent run to be acceptable. Procedure. Add direction for hook placement in the bond loop and pulling instructions. Add reference to view Figure 0- which is a new figure.. Failure criteria. Change the referenced figure From: Figure 0- To: Figure 0-.. Alternative procedure. Change the referenced document: From: EIA-557-A To: EIA-557 Technical Correction; this figure is upside down. Laboratory Attempting to clarify the procedure for determining what constitutes a lot failure and how to count failed devices. Manufacturer Editorial Correction. Numbers shown do not match the physics of the method. Manufacturer Attempting to clarify the procedure for determining what constitutes a lot failure and how to count failed devices. JEDEC JC-.5 Task Group. Letter presented to on Jan 008. Ballot Initiative No. JC A new figure was added to TM 0, other figures were renumbered. To allow use of the latest revision document

9 9 TM 0 Nondestructive Bond Pull Figure 0- Bond pull hook placement location Add this new figure as figure, renumber remaining figures accordingly. JEDEC JC-.5 Task Group. Letter presented to on Jan 008. Ballot Initiative No. JC , 8, and 0 50 TM 00 Ultrasonic Inspection of Die Attach 5 TM 05 Electrostatic Discharge Sensitivity Classification 5 TM 00 Open Loop Performance All. Pin combination to be tested Figure 00-, Test setup for open loop gain, distortion and maximum output voltage swing. Change referenced figure numbers to agree with renumbered figures. Replace this test method with one like that in MIL- STD-750. Add a note that states: As an option, a shunt resistance of 0k ohms or higher may be used to ease the pre-pulse voltage phenomenon that occurs, especially in high-impedance pins. The shunt resistance will be placed between the pin to be stressed (Terminal A) and the system ground (Terminal B) and as long as it does not alter the HBM waveform specifications or the tester qualification, calibration and waveform verification. The shunt resistance can be placed in the HBM simulator or in the test fixturing system. Add labels as follows: For the node connection at the bottom of R L label this as V. For the protruding node connection to the top of R L label this as V. See paragraphs.. - JEDEC G- Task Group -6 JEDEC to modify JESD-A stating that normal HBM events may exhibit a voltage rise pre-pulse phenomenon, especially in highimpedance pins that use ESD protection designs with dv/dt trigger mechanisms. Ballot Initiative No. JC These values are necessary readouts in compliance with paragraph. in the procedures. OEM 9

10 5 TM Qualification and Quality Conformance Procedures Table IV, Group D (Package related tests) Add Subgroup 9 and Note / (as follows) a. Soldering Heat per TM-06 b. Seal per TM-0 as applicable () Fine () Gross c. Visual per TM-009 d. End-point electricals as specified in the applicable specification. To comply with new Test Method 06, and to agree with the latest revision of MIL-PRF-855 (see TABLE V Group D tests on page of MIL-PRF-855)., et al. Quantity (accept number) is (0). 5 TM 5005 Qualification and Quality Conformance Procedures 55 TM 5005 Qualification and Quality Conformance Procedures 56 TM 5007 Wafer Lot Acceptance Table IV, Group D (Package related tests) Table V, Group E (radiation hardness assurance tests) Table I, Wafer lot acceptance tests. Add footnote / stating: This test is performed at qualification/ re-qualification of design changes which may affect this test. The manufacturer shall determine for each package the applicable conditions from test method 06 that are appropriate for the mounting conditions, and assure by testing, or through their assembly processes, that the part is subjected to an equivalent time/temperature stress. For subgroup 5 Single Event Effects (SEE), under Quantity/accept number change From: (0) devices/wafer To: (0) devices Add Note 0/ stating the following: When single event effects (SEE) testing is specified in the purchase order or contract the test shall be performed during qualification and after any design or process change that may affect SEE response. Several changes, in particular to Test, Condition; Test, Limits; Test, Conditions; Test 5, Limits; and Test 6, Conditions. To comply with new Test Method 06, and to agree with the latest revision of MIL-PRF-855 (see TABLE V Group D tests on page of MIL-PRF-855)., et al. SEE testing is performed during initial qualification and after any design or process change that may affect SEE responses, but it is not done per each wafer. JEDEC JC-. JEDEC Task Group JC

11 57 TM 50 Evaluation and acceptance procedures for polymeric adhesives 58 Last page of Document.6.. Test equipment and testing facilities. Concluding Material Change the referenced document From: ANSI/NCSL Z50- To: ANSI/NCSL Z50. Move the Concluding Material from the Main Body, Section 6, page 7 to the back (last page) of the document. This is the correct replacement for the withdrawn document. Required by MIL-STD N/A