LEAD FREE SURFACE MOUNT REWORK TRAINING CERTIFICATION TEST (DVD-67C)

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1 This test consists of twenty multiple-choice questions. All questions are from the video: Lead Free Surface Mount Rework (DVD-67C). Each question has only one most correct answer. Circle the letter corresponding to your selection for each test item. If you wish to change an answer, erase your choice completely. You should read through the questions and answer those you are sure of first. After your first pass through the test, then go back and answer the questions that you were not sure of. If two answers appear to be correct, pick the answer that seems to be the most correct response. When you are finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (14 correct answers or better). Good luck! 1

2 ANSWER SHEET Name: Date: Circle the letter corresponding to your answer for each test item. 1 A B C D 2 A B C D 3 A B C D 4 A B C D 5 A B C D 6 A B C D 7 A B C D 8 A B C D 9 A B C D 10 A B C D 11 A B C D 12 A B C D 13 A B C D 14 A B C D 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 2

3 1. The reason for the switch to lead free solder is a. Europe s legal mandate to change by July 1, 2006 b. to keep lead out of the landfills c. reduce manufacturing pollution 2. The most common method of absorbing lead into our systems is by a. touching circuit boards b. ingesting lead by touching food or make-up after handling tin-lead solder c. being touched by others who have handled tin-lead solder d. breathing in airborne fumes or particles 3. The melting point for lead free solder is typically a. 20 degrees C higher than tin-lead b. 30 degrees C higher than tin-lead c. 40 degrees C higher than tin-lead d. 50 degrees C higher than tin-lead 4. The most common lead free alloy for surface mount rework is a. tin-silver-copper b. tin-silver-bismuth c. tin-silver d. tin-copper 5. A consideration in implementing a lead free process is a. components and circuit boards need to withstand higher soldering temperatures b. solder defects may increase due to poor wetting c. higher activity fluxes may be required 6. When selecting a soldering iron tip, always select a a. medium size chisel tip b. tip that has the greatest contact area without overhanging the joint c. tip with plenty of oxidation d. heat efficient conical tip 7. Land preparation can be done with a. a soldering iron tip b. vacuum extraction c. a solder braid d. both b and c 3

4 8. During rework, heat transfer is improved by using a. an external flux b. much higher temperatures c. a conical tip d. hot air in addition to the soldering iron LEAD FREE SURFACE MOUNT REWORK 9. When using continuous vacuum extraction for component removal a. make sure not to put any downward pressure on the leads b. activate the vacuum intermittently c. never use an external flux d. use a thinner tip to maintain operating temperatures 10. After the component is properly aligned, it should be a. soldered b. tacked in two corners so that it won t be moved c. cleaned d. checked for moisture 11. Reworked assemblies need to be processed through a cleaning machine whenever a. an aggressive no-clean flux is used b. any external flux is used c. there are any flux residues remaining after hand cleaning d. rework has been completed 12. The fastest method of hand soldering a component is called a. drag soldering b. speed soldering c. offset soldering d. point-to-point soldering 13. Solder bridges can be fixed by a. point-to-point soldering b. using a vacuum extractor to remove all of the solder c. adding flux and drawing off the excess solder onto the tip of the iron 14. The most important consideration for lead free touch up is a. using a compatible lead free solder alloy b. using a compatible external flux c. setting the soldering temperature for the higher lead free melting temperature 4

5 15. The visual appearance of the lead free solder joints is a. smoother than tin-lead b. grainier than tin-lead c. shinier than tin-lead d. wetter than tin-lead 16. The maximum acceptable solder contact angle is a. any angle that doesn t cover the top of the component termination or lead b. 180 degrees c. 90 degrees or less d. 45 degrees or less 17. Non-wetting occurs when a. the solder has not adhered to either the termination or land b. the reflow or wave soldering temperature is too low c. there is poor flux activity 18. A convex fillet with solder flowing over the edge of the land indicates a. excessive solder b. dewetting c. a blowhole d. tombstoning 19. A solder bridge is a. a crossing within the grain structure of the solder alloy b. an unwanted solder connection between two or more conductive features c. a leaching of the solder or flux between two adjacent lands d. an arched connection between opposite sides of the connection 20. Class 2 requirements in the IPC-A-610 are for a. consumer products b. high reliability electronics where failure is not an option c. business and computer products d. none of the above 5

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