GUx. Data Sheet. HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes. Features. Description/Applications

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HSMP-389x Sris, HSMP-89x Sris Surfac Mount RF PIN Switch iods ata Sht scription/pplications Th HSMP-389x sris is optimizd for switching applications whr low rsistanc at low currnt and low capacitanc

1 HSMP-389x Sris, HSMP-89x Sris Surfac Mount RF PIN Switch iods ata Sht scription/pplications Th HSMP-389x sris is optimizd for switching applications whr low rsistanc at low currnt and low capacitanc ar rquird. Th HSMP-89x sris products fatur ultra low parasitic inductanc. Ths products ar spcifically dsignd for us at frquncis which ar much highr than th uppr limit for convntional PIN diods. Pin onnctions and Packag Marking 3 GUx Nots:. Packag marking provids orintation, idntification, and dat cod.. S lctrical Spcifications for appropriat packag marking. 6 5 Faturs Uniqu onfigurations in Surfac Mount Packags dd Flxibility Sav oard Spac Rduc ost Switching ow apacitanc ow Rsistanc at ow urrnt ow Failur in Tim (FIT) Rat [] Matchd iods for onsistnt Prformanc ttr Thrmal onductivity for Highr Powr issipation ad-fr Not:. For mor information s th Surfac Mount PIN Rliability ata Sht.

2 Packag ad od Idntification, SOT-3/3 (Top Viw) Packag ad od Idntification, SOT-33 (Top Viw) Packag ad od Idntification, SOT-363 (Top Viw) SING SRIS SING SRIS UNONNT TRIO 6 5 U SWITH MO 6 5 #0 OMMON NO # OMMON THO OMMON NO OMMON THO 3 OW INUTN SING R SRIS SHUNT PIR 6 5 #3 # F UNONNT PIR #5 U NO 890 U NO 89 3 T HIGH FRQUNY SRIS U RING QU 3 3 V #7 UNR VOPMNT bsolut Maximum Ratings [] T = +5 Symbol Paramtr Unit SOT-3/3 SOT-33/363 I f Forward urrnt ( µs Puls) mp P IV Pak Invrs Voltag V T j Junction Tmpratur T stg Storag Tmpratur -65 to to 50 θ jc Thrmal Rsistanc [] /W Nots:. Opration in xcss of any on of ths conditions may rsult in prmannt damag to th dvic.. T = +5, whr T is dfind to b th tmpratur at th packag pins whr contact is mad to th circuit board. S WRNING: Handling Prcautions Should Takn To void Static ischarg.

3 lctrical Spcifications, T = 5, ach diod Packag Minimum Maximum Maximum Part Numbr Marking ad rakdown Sris Rsistanc Total apacitanc HSMP- od od onfiguration Voltag V R (V) R S (ý) T (pf) 3890 G0 [] 0 Singl G [] Sris 3893 G3 [] 3 ommon nod 389 G [] ommon athod 3895 G5 [] 5 Unconnctd Pair 389 G0 [] Singl 389 G [] Sris 389 G3 [] ommon nod 389F G [] F ommon athod 389 G [] Unconnctd Trio 389R S [] R ual Switch Mod 389T Z [] T ow Inductanc Singl 389U GU [] U Sris-Shunt Pair 389V GV [] V High Frquncy Sris Pair Tst onditions V R = V R I F = 5 m V R = 5 V Masur f = 00 MHz f = MHz I R 0 µ Nots:. Packag marking cod is whit.. Packag is lasr markd. High Frquncy (ow Inductanc, 500 MHz 3 GHz) PIN iods Minimum Maximum Typical Maximum Typical Part Packag rakdown Sris Total Total Total Numbr Marking Voltag Rsistanc apacitanc apacitanc Inductanc HSMP- od [] onfiguration V R (V) R S (ý) T (pf) T (pf) T (nh) 89x G ual nod Tst onditions V R = V R I F = 5 m f = MHz V R = 5 V f=500 MHz Masur V R = 5 V f = MHz 3 GHz I R 0 µ Not:. SOT-3 packag marking cod is whit; SOT-33 is lasr markd. Typical Paramtrs at T = 5 Part Numbr Sris Rsistanc arrir iftim Total apacitanc HSMP- R S (ý) τ (ns) T (pf) 389x V Tst onditions I F = m I F = 0 m f = 00 MHz I R = 6 m 3

4 HSMP-389x Sris Typical Prformanc, T = 5, ach diod RF RSISTN (OHMS) I F FORWR IS URRNT (m) Figur. Total RF Rsistanc at 5 vs. Forward ias urrnt. TOT PITN (pf) MHz 0.5 GHz V R RVRS VOTG (V) Figur. apacitanc vs. Rvrs Voltag. INPUT INTRPT POINT (dm) iod Mountd as a Sris ttnuator in a 50 Ohm Microstrip and Tstd at 3 MHz I F FORWR IS URRNT (m) Figur 3. nd Harmonic Input Intrcpt Point vs. Forward ias urrnt T rr RVRS ROVRY TIM (ns) 60 0 V R = V 80 V R = 5V 0 V R = 0V FORWR URRNT (m) Figur. Typical Rvrs Rcovry Tim vs. Rvrs Voltag. FORWR URRNT (m) IF V F FORWR VOTG (V) Figur 5. Forward urrnt vs. Forward Voltag. Typical pplications for Multipl iod Products 3 3 ON OFF 0 0 +V V b b b3 5 6 RF in RF out Figur 6. HSMP-389 usd in a SP3T Switch. Figur 7. HSMP-389 Unconnctd Trio usd in a ual Voltag, High Isolation Switch.

5 Typical pplications for Multipl iod Products (continud) ON OFF +V 0 0 +V RF out RF in RF out 3 RF in Figur 8. HSMP-389 Unconnctd Trio usd in a Positiv Voltag, High Isolation Switch. Figur 9. HSMP-389T usd in a ow Inductanc Shunt Mountd Switch. Xmtr ias nt λ Rcvr Xmtr ias nt λ Rcvr ias bias Xmtr ntnna P HSMP-389V N HSMP-389U l Rcvr l Figur 0. HSMP-389U Sris/Shunt Pair usd in a 900 MHz Transmit/Rciv Switch. Figur. HSMP-389V Sris/Shunt Pair usd in a.8 GHz Transmit/Rciv Switch. 5

6 Typical pplications for Multipl iod Products (continud) RF OMMON RF OMMON RF RF RF RF IS IS IS IS Figur. Simpl SPT Switch, Using Only Positiv urrnt. Figur 3. High Isolation SPT Switch, ual ias. RF OMMON RF OMMON IS RF RF RF IS RF Figur. Switch Using oth Positiv and Ngativ ias urrnt. Figur 5. Vry High Isolation SPT Switch, ual ias. 6

7 Typical pplications for HSMP-89x ow Inductanc Sris Microstrip Sris onnction for HSMP-89x Sris In ordr to tak full advantag of th low inductanc of th HSMP 89x sris whn using thm in sris applications, both lad and lad should b connctd togthr, as shown in Figur 7. 3 quivalnt ircuit Modl HSMP-389x hip* R s R j 0.5 j HSMP-89x Figur 6. Intrnal onnctions. 0. pf* * Masurd at -0 V R T = R j T = P + j R j = 0 I 0.9 I = Forward ias urrnt in m * S N for packag modls Figur 7. ircuit ayout. Microstrip Shunt onnctions for HSMP-89x Sris In Figur 8, th cntr conductor of th microstrip lin is intrruptd and lads and of th HSMP-89x diod ar placd across th rsulting gap. This forcs th.5 nh lad inductanc of lads and to appar as part of a low pass filtr, rducing th shunt parasitic inductanc and incrasing th maximum availabl attnuation. Th 0.3 nh of shunt inductanc xtrnal to th diod is cratd by th via hols, and is a good stimat for 0.03" thick matrial. 50 OHM MIROSTRIP INS o-planar Wavguid Shunt onnction for HSMP-89x Sris o-planar wavguid, with ground on th top sid of th printd circuit board, is shown in Figur 0. Sinc it liminats th nd for via hols to ground, it offrs lowr shunt parasitic inductanc and highr maximum attnuation whn compard to a microstrip circuit. o-planar Wavguid Groundplan ntr onductor Groundplan Figur 0. ircuit ayout. Figur 8. ircuit ayout. P ONNT TO GROUN Y TWO VI HOS 0.3 pf 0.75 nh.5 nh.5 nh 0.3 pf 0.3 nh 0.3 nh Figur. quivalnt ircuit. SPI modl is not availabl for PIN diods as SPI dos not provid for a ky PIN diod charactristic, carrir liftim. Figur 9. quivalnt ircuit. 7

8 ssmbly Information Figur. P Pad ayout, SOT-363. (dimnsions in inchs) IMNSIONS IN inchs mm Figur. P Pad ayout, SOT Figur 3. P Pad ayout, SOT-33. (dimnsions in inchs) IMNSIONS IN inchs mm Figur 5. P Pad ayout, SOT-3. 8

9 SMT ssmbly Rliabl assmbly of surfac mount componnts is a complx procss that involvs many matrial, procss, and quipmnt factors, including: mthod of hating (.g., IR or vapor phas rflow, wav soldring, tc.) circuit board matrial, conductor thicknss and pattrn, typ of soldr alloy, and th thrmal conductivity and thrmal mass of componnts. omponnts with a low mass, such as th SOT packag, will rach soldr rflow tmpraturs fastr than thos with a gratr mass. vago Tchnologis diods hav bn qualifid to th tim-tmpratur profil shown in Figur 6. This profil is rprsntativ of an IR rflow typ of surfac mount assmbly procss. ftr ramping up from room tmpratur, th circuit board with componnts attachd to it (hld in plac with soldr past) passs through on or mor prhat zons. Th prhat zons incras th tmpratur of th board and componnts to prvnt thrmal shock and bgin vaporating solvnts from th soldr past. Th rflow zon brifly lvats th tmpratur sufficintly to produc a rflow of th soldr. Th rats of chang of tmpratur for th ramp-up and cool-down zons ar chosn to b low nough to not caus dformation of th board or damag to componnts du to thrmal shock. Th maximum tmpratur in th rflow zon (T MX ) should not xcd 60. Ths paramtrs ar typical for a surfac mount assmbly procss for vago Tchnologis diods. s a gnral guidlin, th circuit board and componnts should b xposd only to th minimum tmpraturs and tims ncssary to achiv a uniform rflow of soldr. Tp Ramp-up tp ritical Zon T to Tp Tmpratur T Ts max Ts min ts Prhat t Ramp-down 5 t 5 to Pak Tim Figur 6. Surfac Mount ssmbly Profil. ad-fr Rflow Profil Rcommndation (IP/J J-ST-00) Rflow Paramtr ad-fr ssmbly vrag ramp-up rat (iquidus Tmpratur (T S(max) to Pak) 3 / scond max Prhat Tmpratur Min (T S(min) ) 50 Tmpratur Max (T S(max) ) 00 Tim (min to max) (t S ) sconds Ts(max) to T Ramp-up Rat 3 /scond max Tim maintaind abov: Tmpratur (T ) 7 Tim (t ) sconds Pak Tmpratur (T P ) 60 +0/-5 Tim within 5 of actual Pak tmpratur (t P ) 0-0 sconds Ramp-down Rat 6 /scond max Tim 5 to Pak Tmpratur 8 minuts max Not : ll tmpraturs rfr to topsid of th packag, masurd on th packag body surfac 9

10 Packag imnsions Outlin 3 (SOT-3) Outlin SOT-33 (S-70 3 ad) XXX XXX Nots: XXX-packag marking rawings ar not to scal SYMO IMNSIONS (mm) MIN MX Nots: XXX-packag marking rawings ar not to scal SYMO IMNSIONS (mm) MIN MX typical.30 typical Outlin 3 (SOT-3) Outlin SOT-363 (S-70 6 ad) H XXX c Nots: XXX-packag marking rawings ar not to scal SYMO IMNSIONS (mm) MIN MX b SYMO H b c IMNSIONS (mm) MIN S MX

11 Packag haractristics ad Matrial ad Finish Maximum Soldring Tmpratur Minimum ad Strngth Typical Packag Inductanc Typical Packag apacitanc oppr (SOT-33/363); lloy (SOT-3/3) Ni Pd u 60 for 5 sconds pounds pull nh 0.08 pf (opposit lads) Ordring Information Spcify part numbr followd by option. For xampl: HSMP - 389x - xxx ulk or Tap and Rl Option Part Numbr; x = ad od Surfac Mount PIN Option scriptions -KG = ulk, 00 pcs. pr antistatic bag -TRG = Tap and Rl, 3000 dvics pr 7" rl -TRG = Tap and Rl, 0,000 dvics pr 3" rl Tap and Rling conforms to lctronic Industris RS-8, Taping of Surfac Mountd omponnts for utomatd Placmnt. vic Orintation For Outlins SOT-3, -33 R TOP VIW mm N VIW RRIR TP 8 mm USR F IRTION For Outlin SOT-3 OVR TP For Outlin SOT-363 Not: "" rprsnts packag marking cod. "" rprsnts dat cod. TOP VIW mm N VIW TOP VIW mm N VIW 8 mm 8 mm Not: "" rprsnts packag marking cod. "" r prsnts dat cod. Not: "" rprsnts packag marking cod. "" rprsnts dat cod.

12 Tap imnsions and Product Orintation For Outlin SOT-3 P P P 0 F W t 9 MX Ko 8 MX 3.5 MX 0 0 VITY PRFORTION RRIR TP SRIPTION SYMO SIZ (mm) SIZ (INHS) NGTH WITH PTH PITH OTTOM HO IMTR IMTR PITH POSITION WITH THIKNSS 0 0 K 0 P P 0 W t 3.5 ± ± 0.0. ± ± ± ± ± ± ± ± ± ± ± ± ISTN TWN NTRIN VITY TO PRFORTION (WITH IRTION) VITY TO PRFORTION (NGTH IRTION) F P 3.50 ± ± ± ± 0.00 For Outlin SOT-3 P P0 P F W t 9 MX K 0 9 MX 0 0 VITY PRFORTION SRIPTION SYMO SIZ (mm) SIZ (INHS) NGTH WITH PTH PITH OTTOM HO IMTR IMTR PITH POSITION 0 0 K 0 P P ± ± ± ± ± ± ± ± ± ± ± ± 0.00 RRIR TP WITH THIKNSS W t ± ISTN VITY TO PRFORTION (WITH IRTION) VITY TO PRFORTION (NGTH IRTION) F P 3.50 ± ± ± ± 0.00

13 Tap imnsions and Product Orintation For Outlins SOT-33, -363 P P P 0 F W t (RRIR TP THIKNSS) T t (OVR TP THIKNSS) n K 0 n 0 0 VITY PRFORTION SRIPTION SYMO SIZ (mm) SIZ (INHS) NGTH WITH PTH PITH OTTOM HO IMTR IMTR PITH POSITION 0 0 K 0 P P 0.0 ± ± ± ± ± ± ± ± ± ± ± ± ± ± 0.00 RRIR TP OVR TP ISTN NG WITH THIKNSS WITH TP THIKNSS VITY TO PRFORTION (WITH IRTION) VITY TO PRFORTION (NGTH IRTION) W 8.00 ± 0.30 t 0.5 ± ± 0.0 T t 0.06 ± 0.00 F 3.50 ± 0.05 P.00 ± 0.05 FOR SOT-33 (S70-3 ) n 8 MX FOR SOT-363 (S70-6 ) 0 MX 0.35 ± ± ± ± ± ± 0.00 For product information and a complt list of distributors, plas go to our wb sit: vago, vago Tchnologis, and th logo ar tradmarks of vago Tchnologis in th Unitd Stats and othr countris. ata subjct to chang. opyright vago Tchnologis. ll rights rsrvd. Obsolts N V0-083N - July, 05

GUx. Data Sheet. HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes. Features. Description/Applications

GUx. Data Sheet. HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes. Features. Description/Applications HSMP-389x Sris, HSMP-89x Sris Surfac Mount R PIN Switch iods ata Sht scription/pplications Th HSMP-389x sris is optimizd for switching applications whr low rsistanc at low currnt and low capacitanc ar