. HIGH SPEED .LOW POWER DISSIPATION .HIGH NOISE IMMUNITY M54HC4511 M74HC4511 BCD TO 7 SEGMENT LATCH/DECODER DRIVER. tpd = 28 ns (TYP.
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1 M54HC4511 M74HC4511 BCD TO 7 SEGMENT LATCH/DECODER DRIVER. HIGH SPEED tpd = 28 (TYP.) AT VCC =5V.LOW POWER DISSIPATION I CC =4µA (MAX.) AT T A =25 C.HIGH NOISE IMMUNITY VNIH =VNIL =28%VCC (MIN.) OUTPUT DRIVE CAPABILITY 10 LSTTL LOADS HIGH SOURGE CURRENT IOH = 20 ma (MIN.) BALANCED PROPAGATION DELAYS t PLH =t. PHL WIDE OPERATING VOLTAGE RANGE VCC (OPR) = 2 V TO 6 V PIN AND FUNCTION COMPATIBLE WITH 4511B B1R (Plastic Package) M1R (Micro Package) F1R (Ceramic Package) C1R (Chip Carrier) ORDER CODES : M54HC4011F1R M74HC4011M1R M74HC4011B1R M74HC4011C1R PIN CONNECTIONS (top view) DESCRIPTION The M54/74HC4511 is a high speed CMOS BCD- TO-7 SEGMENT LATCH/DECODER/DRIVER fabricated with silicon gate C 2 MOS technology. It enables high speed latch and decode operation with identical pin connection and function to standard CMOS 4511B. The segment output driver, which is CMOS fabricated in silicon gate C 2 MOS technology, has large I OH capability which enables common cathode Leds to be directly driven. When lamp test (LT) is taken L, all segment outputs will go to H, and when blanking (BI) is taken L and LT is taken H all segment outputs will go to L. These functio operate regardless of other inputs and are used to test the display. Input BI is used to pulse-modulate the brightness of the display. When an error input code (over 10) is applied to the BCD input, all segment outputs will go L (turn off). All inputs are equipped with protection circuits agait static discharge and traient excess voltage. NC = No Internal Connection February /13
2 TRUTH TABLE INPUTS OUTPUTD DISPLAY LE BI LT D C B A a b c d e f g MODE X X L X X X X H H H H H H H 8 X L H X X X X L L L L L L L BLANK L H H L L L L H H H H H H L 0 L H H L L L H L H H L L L L 1 L H H L L H L H H L H H L H 2 L H H L L H H H H H H L L H 3 L H H L H L L L H H L L H H 4 L H H L H L H H L H H L H H 5 L H H L H H L L L H H H H H 6 L H H L H H H H H L L L L L 7 L H H H L L L H H H H H H H 8 L H H H L L H H H H L L H H 9 L H H H L H X L L L L L L L BLANK L H H H H X X L L L L L L L BLANK H H H X X X X Hold the stage at the leading edge of LE X: Don t Care LOGIC DIAGRAM 2/13
3 DISPLAY MODE BLOCK DIAGRAM 3/13
4 INPUT AND OUTPUT EQUIVALENT CIRCUIT PIN DESCRIPTION IEC LOGIC SYMBOL PIN No SYMBOL NAME AND FUNCTION 3 LT Lamp Test Input (Active LOW) 4 BI Ripple Blanking Input (Active LOW) 5 LE Latch Enable Input 7, 1, 2, 6 A to D BCD Address Inputs 13, 12, 11, 10, 9, 15, 14 a to g Segment Outputs 8 GND Ground (0V) 16 VCC Positive Supply Voltage ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VCC Supply Voltage -0.5 to +7 V VI DC Input Voltage -0.5 to VCC V V O DC Output Voltage -0.5 to V CC V IIK DC Input Diode Current ± 20 ma IOK DC Output Diode Current ± 20 ma I O DC Output Source Sink Current Per Output Pin -35/25 ma ICC or IGND DC VCC or Ground Current +150/-50 ma PD Power Dissipation 500 (*) mw T stg Storage Temperature -65 to +150 o C TL Lead Temperature (10 sec) 300 o C Absolute MaximumRatings are those values beyond whichdamage tothe device may occur. Functional operation under these condition isnotimplied. (*) 500 mw: 65 o C derate to 300 mw by 10mW/ o C: 65 o Cto85 o C 4/13
5 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Value Unit VCC Supply Voltage 2 to 6 V V I Input Voltage 0 to V CC V VO Output Voltage 0 to VCC V Top Operating Temperature: M54HC Series -55 to +125 M74HC Series -40 to +85 o C C t r,t f Input Rise and Fall Time V CC = 2 V 0 to 1000 V CC = 4.5 V 0 to 500 VCC = 6 V 0 to 400 DC SPECIFICATIONS Symbol V IH V IL V OH VOL II ICC Parameter High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Voltage Input Leakage Current Quiescent Supply Current V CC (V) Test Conditio TA =25 o C 54HC and 74HC Value -40 to 85 o C 74HC -55 to 125 o C 54HC Min. Typ. Max. Min. Max. Min. Max V I = 4.5 I V O =-20 µa IH or VIL I O =-4.0 ma I O =-5.2 ma VI = 4.5 IO= 20µA VIH 6.0 or V IL IO= 4.0 ma I O = 5.2 ma VI =VCC or GND ±0.1 ±1 ±1 µa 6.0 VI = VCC or GND µa Unit V V V V 5/13
6 AC ELECTRICAL CHARACTERISTICS (CL =50pF,Inputtr=tf=6) Symbol t TLH t THL tplh t PHL tplh t PHL tplh t PHL tplh t PHL tw(l) ts Parameter Output Traition Time Output Traition Time Propagation Delay Time (BCD - Seg.) Propagation Delay Time (BI - Seg.) Propagation Delay Time (LT - Seg.) Propagation Delay Time (LE - Seg.) Minimum Pulse Width Minimum Set-up Time VCC (V) Test Conditio TA =25 o C 54HC and 74HC Value -40 to 85 o C 74HC -55 to 125 o C 54HC Min. Typ. Max. Min. Max. Min. Max th Minimum Hold Time CIN Input Capacitance pf C PD (*) Power Dissipation 95 Capacitance pf (*) C PD is defined as the value of the IC s internal equivalent capacitance which is calculated from the operating current coumption without load. (Refer to Test Circuit). Average operting current can be obtained by the following equation. I CC(opr) = C PD V CC f IN +I CC/2 (per FLIP/FLOP) Unit 6/13
7 SWITCHING CHARACTERISTICS TEST WAVEFORM Data Segment Delay Time LE-Segment Delay Time BI-Segment Delay Time LT-Segment Delay Time Data Set-up/Hold Time 7/13
8 TEST CIRCUIT I CC (Opr.) APPLICATION CIRCUIT Static Display Circuit 8/13
9 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z P001C 9/13
10 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E e F G H L M N P Q P053D 10/13
11 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A a a b b C c1 45 (typ.) D E e e F G L M S 8 (max.) P013H 11/13
12 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D d d E e e F G M M P027A 12/13
13 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no respoability for the coequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No licee is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificatiomentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13
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