HCC/HCF4042B QUAD CLOCKED D LATCH
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1 QUAD CLOCKED D LATCH CLOCK POLARITY CONTROL Q AND Q OUTPUTS COMMON CLOCK LOW POWER TTL COMPATIBLE STANDARDIZED SYMMETRICAL OUTPUT CHARACTERISTICS QUIESCENT CURRENT SPECIFIED TO 20 FOR HCC DEICE 5, 10, AND 15 PARAMETRIC RATINGS INPUT CURRENT OF 100nA AT 18 AND 25 C. FOR HCC DEICE 100% TESTED FOR QUIESCENT CURRENT MEETS ALL REQUIREMENTS OF JEDEC TEN- TATIE STANDARD N 13A, STANDARD SPE- CIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEICES EY (Plastic Package) M1 (Micro Package) F (Ceramic Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC4042BF HCF4042BM1 HCF4042BEY HCF4042BC1 PIN CONNECTIONS DESCRIPTION The HCC4042B (extended temperature range) and HCF4042B (intermediate temperature range) are monolithic integrated circuit, available in 16-lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF4042B types contain four latch circuits, each strobed by a common clock. Complementary buffered outputs are available from each circuit. The impedance of the n- and p-channel output devices is balanced and all outputs are electrically identical. Information present at the data input is transferred to outputs Q and Q during the CLOCK level which is programmed by the POLARITY input. For PO- LARITY = 0 the transfer occurs during the 0 CLOCK level and for POLARITY = 1 the transfer occurs during the 1 CLOCK level. The outputs follow the data input providing the CLOCK and POLARITY levels defined above are present. When a CLOCK transition occurs (positive for POLARITY = 0 and negative for POLARITY = 1) the information present at the input during the CLOCK transition is retained at the outputs until an opposite CLOCK transition occurs. June /13
2 FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter alue Unit DD * Supply oltage : HCC Types HCF Types 0.5 to to + 18 i Input oltage 0.5 to DD I I DC Input Current (any one input) ± 10 ma P tot Total Power Dissipation (per package) Dissipation per Output Transistor for T op = Full Package-temperature Range mw mw T op Operating Temperature : HCC Types HCF Types 55 to to+85 T stg Storage Temperature 65 to C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to SS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol Parameter alue Unit DD Supply oltage : HCC Types HCF Types 3to18 3to15 I Input oltage 0 to DD T op Operating Temperature : HCC Types HCF Types 55to to+85 C C C C 2/13
3 LOGIC BLOCK DIAGRAM AND TRUTH TABLE Clock Polarity Q 0 0 D / 0 Latch 1 1 D \ 1 Latch STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol I L OH OL IH Parameter Quiescent Current Output High oltage Output Low oltage Input High oltage HCC Types HCF Types Test Conditions alue I O I O DD T Low * 25 C T High * () () (µa) () Min. Max. Min. Typ. Max. Min. Max. 0/ / / / / / / / 5 < /10 < /15 < /0 < /0 < /0 < /4.5 < /9 < /13.5 < *T Low = 55 C for HCC device : 40 C forhcf device. *T High = C for HCC device : + 85 C for HCF device. The Noise Margin for both 1 and 0 level is : 1 min. with DD = 5, 2 min. with DD = 10, 2.5 min. with DD = 15. Unit µa 3/13
4 STATIC ELECTRICAL CHARACTERISTICS (continued) Test Conditions alue Symbol Parameter I O I O DD T Low * 25 C T High * Unit () () (µa) () Min. Max. Min. Typ. Max. Min. Max. IL Input Low 4.5/0.5 < oltage 9/1 < /1.5 < I OH Output 0/ Drive HCC 0/ Current Types 0/ / ma 0/ HCF 0/ Types 0/ / I OL Output 0/ Sink HCC 0/ Current Types 0/ ma 0/ HCF Types 0/ / I IH,I IL Input HCC leakage Types 0/18 18 ± 0.1 ±10-5 ± 0.1 ± 1 Any Input Curent HCF Types 0/15 15 ± 0.3 ±10-5 ± 0.3 ± 1 µa C I Input Capacitance Any Input pf * TLow = 55 CforHCC device : 40 C for HCF device. * THigh = C forhcc device : + 85 CforHCF device. The Noise Margin for both 1 and 0 level is : 1 min. with DD = 5, 2 min. with DD = 10, 2.5 min. with DD = 15. DYNAMIC ELECTRICAL CHARACTERISTICS (T amb =25 C, C L = 50pF, R L = 200kΩ, typical temperature coefficient for all DD values is 0.3%/ C, all input rise and fall times = 20ns) Symbol t PLH,t PHL 4/13 Parameter Propagation Delay Time Test Conditions alue DD () Min. Typ. Max. Data in to Q Data in to Q Clock to Q Clock to Q Unit ns
5 DYNAMIC ELECTRICAL CHARACTERISTICS (continued) Test Conditions alue Symbol Parameter DD () Min. Typ. Max. t THL, t TLH Transition Time t W Clock Pulse Width t setup Setup Time t hold Hold Time t r,t f Clock Input Rise or Fall Time 5 10 Not Rise or Fall Time Sensitive 15 Unit ns ns ns ns µs Typical Output Low (sink) Current Characteristics. Minimum Output Low (sink) Current Characteristics. 5/13
6 Typical Output High (source) Current Characteristics. Minimum Output High (source) Current Characteristics. Typical Transition Time vs. Load Capacitance. Typical Propagation Delay Time vs. Load Capacitance (data to Q). Typical Propagation Delay Time vs. Load Capacitance (data to Q). Typical Propagation Delay Time vs. Load Capacitance (clock to Q). 6/13
7 Typical Propagation Delay Time vs. Load Capacitance (clock to Q). Typical Power Dissipation/device vs. Frequency. Dynamic Test Parameters. 7/13
8 TEST CIRCUITS Quiescent Device Current. Noise Immunity. Input Leakage Current. 8/13
9 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z P001C 9/13
10 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E e F G H L M N P Q P053D 10/13
11 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A a a b b C c1 45 (typ.) D E e e F G L M S 8 (max.) P013H 11/13
12 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D d d E e e F G M M P027A 12/13
13 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13
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