MC14099B. 8 Bit Addressable Latches
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- Milton Clark
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1 MC0B Bi ddressable Laches The MC0B is an bi addressable lach. Daa is enered in serial form when he appropriae lach is addressed (via address pi 0,, ) and wrie disable is in he low sae. For he MC0B he inpu is a unidirecional wrie only por. The daa is presened in parallel a he oupu of he eigh laches independenly of he sae of Wrie Disable, Wrie/Read or Chip Enable. Maser Rese capabiliy is available on boh pars. Feaures Serial Daa Inpu Parallel Oupu Maser Rese Supply olage Range =.0 o Capable of Driving Two Lowpower TTL Loads or One LowPower Schoky TTL Load over he Raed Temperaure Range MC0B pin for pin compaible wih CD0B PbFree Packages are vailable* PDIP6 P SUFFIX CSE 6 SOIC6 DW SUFFIX CSE 5G 6 6 MRKING DIGRMS MC0BCP WLYYWWG 0BG WLYYWW MXIMUM RTINGS olages Referenced o SS ) Symbol Parameer alue Uni DD DC Supply olage Range 0.5 o +.0 in, ou Inpu or Oupu olage Range (DC or Traien) 0.5 o DD SOEIJ6 F SUFFIX CSE 66 6 MC0B LYWG I in, I ou P D Inpu or Oupu Curren (DC or Traien) per Pin Power Dissipaion, per Package (Noe ) ± 0 m 500 mw T mbien Temperaure Range 55 o +5 C T sg Sorage Temperaure Range 65 o +0 C T L Lead Temperaure (Second Soldering) 60 C Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiio) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced.. Temperaure Deraing: Plasic P and D/DW Packages:.0 mw/ C From 65 C To 5 C WL, L YY, Y WW, W G = ssembly Locaion = Wafer Lo = Year = Work Week = PbFree Indicaor ORDERING INFORMTION See deailed ordering and shipping informaion in he package dimeio secion on page of his daa shee. This device conai proecion circuiry o guard agai damage due o high saic volages or elecric fields. However, precauio mus be aken o avoid applicaio of any volage higher han maximum raed volages o his highimpedance circui. For proper operaion, in and ou should be corained o he range SS in or ou ) DD. Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher SS or DD ). Unused oupus mus be lef open. *For addiional informaion on our PbFree sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SOLDERRM/D. Semiconducor Componens Indusries, LLC, 005 Publicaion Order Number: MC0B/D
2 MC0B PIN SSIGNMENT Q RESET 6 DD Q6 MC0B DT WRITE DISBLE Q5 Q Q Q Q WRITE DISBLE DT 0 RESET 5 6 DECODER DD = 6 SS = LTCHES 0 Q0 Q Q Q Q Q5 Q6 Q SS Q0 ORDERING INFORMTION Device Package Shipping MC0BCP PDIP6 500 Unis / Rail MC0BCPG PDIP6 (PbFree) 500 Unis / Rail MC0BDW SOIC6 WB Unis / Rail MC0BDWG SOIC6 WB (PbFree) Unis / Rail MC0BDWR SOIC6 WB 000 Unis / Tape & Reel MC0BDWRG SOIC6 WB (PbFree) 000 Unis / Tape & Reel MC0BFEL SOEIJ6 000 Unis / Tape & Reel For informaion on ape and reel specificaio, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaio Brochure, BRD0/D.
3 MC0B ELECTRICL CHRCTERISTICS olages Referenced o SS ) 55 C 5 C ÎÎ 5 C Characerisic Î Symbol DD Min MaxÎ Min TypÎ Max Min Max Uni (Noe ) Oupu olage 0 Level in = DD Î OL Î or ÎÎ 0.05Î 0 Î Level Î OH Î Î.5 in = 0 or DD Î Inpu olage 0 Level IL Î O =.5 or 0.5 ) 5.0.5Î.5Î.5.5 O =.0 or.0 ) O =.5 or.5 ).0Î 6.5Î.0.0 Level IH Î O = 0.5 or.5 ) Î.5.5Î.5 O =.0 or.0 ) O =.5 or.5 ) Î.5Î Oupu Drive Curren Î I OH Î mdc OH =.5 ) Source Î..Î. OH =.6 ) OH =.5 ) 0.6 Î..5Î 0. OH =.5 )...Î. OL = 0. ) Sink Î I OL Î Î 0.6 mdc OL = 0.5 ) OL =.5 ). Î.. Î. Inpu Curren Î I in ± 0. Î ± Î ± 0. ±.0 dc Inpu Capaciance in = 0) Î C in Î 5.0 Î.5 pf Inpu Capaciance Î C in MC5B Daa (pin ).5 pf in = 0) Quiescen Curren I (Per Package) Î DD dc 0 0Î 0.00Î Toal Supply Curren (Noes & ) I T 5.0 I T = (.5 /khz) f + I DD dc (Dynamic plus Quiescen, 0 I T = (.0 /khz) f + I DD Per Package) Î I T = (.5 /khz) f + I DD (C L = 50 pf on all oupus, all Î buffers swiching). Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he IC s poenial performance.. The formulas given are for he ypical characerisics only a 5 C.. To calculae oal supply curren a loads oher han 50 pf: I T (C L ) = I T (50 pf) + (C L 50) fk where: I T is in (per package), C L in pf, = DD SS ) in vols, f in khz is inpu frequency, and k = 0.00.
4 MC0B SWITCHING CHRCTERISTICS (Noe 5) (C L = 50 pf, T = 5 C) ÎÎ Characerisic Symbol DD Î Min Î Typ Î Max (Noe 6) Uni Oupu Rise and Fall Time ÎÎ TLH, THL = (.5 /pf) C L ÎÎ TLH, + THL Î Î Î ÎÎ TLH, THL = (0.6 /pf) C L + 0 ÎÎ 0 Î Î 50 Î 00 TLH, THL = (0. /pf) C L Propagaion Delay Time ÎÎ Daa o Oupu Q ÎÎ PHL, PLH Î 5.0 Î Î 00 Î 00 ÎÎ 0 Î Î 5 Î Wrie Disable o Oupu Q ÎÎ 0 Î Î 0 Î 60 ÎÎ Î Î 60 Î 0 ÎÎ Rese o Oupu Q ÎÎ 5.0 Î Î 5 Î ÎÎ Î Î 65 Î 0 ÎÎ CE o Oupu Q (MC5B only) ÎÎ 5.0 Î Î 5 Î 50 ÎÎ 0 Î Î 00 Î Propagaion Delay Time, MC5B only ÎÎ Chip Enable, Wrie/Read o Daa ÎÎ PHL, PLH Î 5.0 Î Î 00 Î 00 ÎÎ 0 Î Î 0 Î ddress o Daa ÎÎ 0 Î Î 0 Î Pulse Widhs w(h) Rese w(l) Î Î Î ÎÎ 0 Î 5 Î 0 Î 50 5 Wrie Disable ÎÎ Î 0 Î 60 Î ÎÎ Se Up Time ÎÎ su Î Î Î Daa o Wrie Disable ÎÎ Î 5 Î 0 Î ÎÎ Hold Time ÎÎ h Î Î Î Wrie Disable o Daa ÎÎ 0 Î 5 Î 0 Î ÎÎ Î 50 Î 5 Î ÎÎ Se Up Time ÎÎ su Î 5.0 Î 00 Î 5 Î ddress o Wrie Disable ÎÎ Î 0 Î 0 Î ÎÎ Removal Time ÎÎ rem Î 5.0 Î 0 Î 0 Î ÎÎ Wrie Disable o ddress ÎÎ 0 Î 0 Î 0 Î 5. The formulas given are for he ypical characerisics only a 5 C. 6. Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he IC s poenial performance. 0 0
5 MC0B PCKGE DIMENSIONS PDIP6 P SUFFIX PLSTIC DIP PCKGE CSE 60 ISSUE T 6 B NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.5M,.. CONTROLLING DIMENSION: INCH.. DIMENSION L TO CENTER OF LEDS WHEN FORMED PRLLEL.. DIMENSION B DOES NOT INCLUDE MOLD FLSH. 5. ROUNDED CORNERS OPTIONL. H G F S C K T SETING PLNE D 6 PL 0.5 (0.00) M T M J L M INCHES MILLIMETERS DIM MIN MX MIN MX B C D F G 0.00 BSC.5 BSC H BSC. BSC J K L M S SOIC6 WB DW SUFFIX PLSTIC SOIC PCKGE CSE 5G0 ISSUE C X H 0.5 M B M D 6 E 6X B B 0.5 M T S B S h X 5 NOTES:. DIMENSIONS RE IN MILLIMETERS.. INTERPRET DIMENSIONS ND TOLERNCES PER SME Y.5M,.. DIMENSIONS D ND E DO NOT INLCUDE MOLD PROTRUSION.. MXIMUM MOLD PROTRUSION 0. PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DMBR PROTRUSION. LLOWBLE DMBR PROTRUSION SHLL BE 0. TOTL IN EXCESS OF THE B DIMENSION T MXIMUM MTERIL CONDITION. MILLIMETERS DIM MIN MX B C D E.0.60 e. BSC H h L q 0 X e T SETING PLNE C L
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