MTBF. Parts Stress Prediction

Transcription

1 SUNNY COMPUTER TECHNOLOGY CO., LTD.. Parts Stress Prediction 1. MODEL NO: SYS Test NO.:QC DATE: 2012/1/18 4. CUSTOMER: Sercom 5. (PARTS STRESS) 6. TEST CONDITION: 6.1AC INPUT: 264 Vac 6.2 DC OUTPUT: FULL LOAD 6.3AMBOENT TEMPERATURE:25 7. & STRESS TEST: PAGE: sheet 1 of TOTAL= 7.2 = , Hours 8. TEST DATA SHOW ON PAGE: 1~7 9. REMARK: (Please refer to file SYS part stress ) PRESIDENT R&D. MANAGER Q.C. MANAGER Q.E. REPORTER

2 1.Resistor 1.1Test Data: λ p=λ b *π T * π S * π Q * π E PAGE: sheet 2 of 7 Top ( ) Vop (Volts) Pop (Watts) Pmax (Watts) R (Ω ) S λ b π T π s π Q π E λ P R1 RM Ω ,757,935 R2 RM Ω ,757,935 R3 RM Ω ,491,083 R5 RM Ω ,930,402 R6 RM Ω ,363,944 R7 RM Ω ,363,944 R8 RM Ω ,363,944 R9 RM Ω ,363,944 R10 RM Ω ,930,402 R12 RM Ω ,930,402 R15 RM Ω ,006,348 R16 RM Ω ,930,402 R17 RM Ω ,757,935 R18 RM Ω ,930,402 RT RM ,930,402 TOTAL ,358, Thermistors 1.3 Test Data: λ p=λ b *π T * π S * π Q * π e Top Vop Pop Amax R ( ) (Volts) (Watts) (Amps) (Ω ) S λ b π T π s π Q π E λ P TOTAL

3 2. Capacitors 2.1Test Data: λ p=λ b * π T *π C * π V * π SR *π Q * π E PAGE: sheet 3 of 7 Top Tmax Vop Vmax C S λ b π T π c π v π SR π Q π E λ P ( ) ( ) (Volts) (Volts) ( uf) C2 CDR uf ,707,767 C4 CE uf ,809,245 C5 CDR uf ,061,651 C6 CC uf ,348,618 C7 CE uf ,694,883 C8 CC uf ,845,694 C9 CE uf ,803,809 C10 CE uf ,803,809 C12 CDR uf ,095,218 C13 CE uf ,859,858 C16 CC uf ,845,694 C27 CC uf ,992,226 CY1 CZ uf ,333,462 CX1 CH uf ,083,018 TOTAL ,565.9

4 3.Diode 3.1 Test Data: λ p=λ b*π T*π S*π C*π Q*π E PAGE: sheet4 of 7 Location Parts Top Vop Vmax Iop Imax Heat Parts Type S λ b π T π s π C π Q π E λ P code ( ) (Volts) (Volts) (A) (A) Sink D1 RD IN N ,892,371 D2 RD IN N ,573,388 D3 RD IN N ,892,371 D4 RD IN N ,573,388 D5 RD A N ,573,388 D7 RD IN N ,564,754 D8 RD SB10100F N ,564,754 TOTAL ,224, Zener Diode 3.3 Test Data: λ p=λ b*π T*π S*π C*π Q*π E Parts Top Vop Vmax Iop Imax λ b π T π s π C π Q π E λ P code ( ) (Volts) (Volts) (A) (A) ZD1 ZD ,850,694 TOTAL ,845,987

5 4.MOS-FET 4.1Test Data: λ p=λ b*π T*π A*π Q*π E PAGE: sheet 5 of 7 Top Vop Vmax Iop Imax Power λ b π T π A N\A N\A π Q π E λ P ( ) (Volts) (Volts) (A) (A) (Watts) Q1 DG4N N\A N\A ,380 TOTAL 1 1,000, Microelectronic Devices 4.3 Test Data: λ p=(c1π T + C2π E)π Qπ L Tc θ jc P D T j No. IC 內電 C ( ) ( /W) (W) ( ) 2 π T C 1 π L N\A π Q π E λ Pins P 晶體數 IC1 RT N/A N/A ,315,789 N\A U2 AZ N/A N/A ,631,579 TOTAL ,543, Photocoupler & LED 4.4 Test Data: λ p=λ b*π T *π Q*π E Top Vop Vmax Iop Imax Photo λ b π T N\A N\A N\A π Q π E λ P ( ) ( ) (Volts) (A) (A) or LED U1 LTV817C N/A N/A N/A Photo N\A N\A N\A ,217,631 TOTAL ,211,704.0

6 5. P.C.B. 5.1 Test Data: λ p=λ b*(n1π C + N2 (π C + 13))π Qπ E PAGE: sheet 6 of 7 銅箔層過錫爐手焊焊 λ b π C N 1 N 2 π Q π E λ P 數焊點數點數量 PCB CEM ,589,653 TOTAL ,495, Transformers & Coils 5.3 Test Data: λ p=λ b*π T *π Q*π E Insulation Top Tmax 屬性 T: Transformer λ Class ( ) ( ) T or L b π T π π E λ L: Coil Q P T1 EE-25/19 B T ,617 LF1 30mH 04A0073 B L ,543,209,877 LF2 9*5*3mm uH B L ,322,751,323 L1 0.65φ x6ts B L ,322,751,323 TOTAL ,513.8

7 6. Connector 6.1 Test Data: λ p=λ b*π P *π Q*π E PAGE: sheet 7 of 7 No. Top λ b π P π Q π E λ P Pins ( ) I/P PLUG ,740,741 TOTAL ,279, Fuse 6.3 Test Data: λ p=λ b*π E λ b π E λ P F1 T1A 250V ,000,000 TOTAL ,000, Connetion 6.5 Test Data: λ p=λ b*π E λ b 查表 π E λ P Output 2468#20*2C ,615,385 Input L 20A WG ,615,385 Input N 20A WG ,615,385 TOTAL ,205,128