Ferrite Chip Bead Array(Lead Free)
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1 Ferrie Chip Bead rray(lead Free) FC3216KF4-Series Feaures 1.Monolihic inorganic maerial consrucion. 2.Closed magneic circui avoids crossalk. 3.S.M.T. ype. 4.Suiable for flow and reflow soldering. 5.Shapes and dimensions follow E.I.. spec. 6.vailable in various sizes. 7.Excellen solderabiliy and hea resisance. 8.High reliabiliy. 9.This componen is complian wih ohs legislaion and also suppor lead-free soldering. 2. Dimensions C D2 Size Chip Size (mm) B(mm) C(mm) D1(mm) D2(mm) (mm) ±.2 1.6±.2.9±.2.4±.15.3±.1.8±.1 D1 B 3. ar Numbering FC 3216 KF4-12 T 1 B C D E F : Series B: Dimension L x W C: Maerial Lead Free Maerial D: Impedance 12=1 E: ackaging T=Taping and eel, B=Bulk(Bags) F: aed Curren 1=15m 4.Specificaion ar Number Impedance ( ) Tes Frequency (MHz) DC esisance ( ) max. aed Curren (m) FC3216KF4-3T5 3±25% FC3216KF4-6T4 6±25% FC3216KF4-121T3 12±25% FC3216KF4-31T2 3±25% FC3216KF4-61T2 6±25% FC3216KF4-12T1 1±25%
2 5. eliabiliy and Tes Condiion Iem erformance Tes Condiion 2. Series No. FCB FCM HCB HB HFB FC FCI FHI FCH HCI -- Operaing Temperaure -55~+125 (Including self-emperaure rise) -4~+85 (Including self-emperaurerise) -- Sorage Temperaure -55~+125-4~ Impedance () Inducance (Ls) H4291, H Q Facor efer o sandard elecrical characerisics lis DC esisance aed Curren Temperaure ise Tes Solder hea esisance 3 max. ( T) ppearance: No significan abnormaliy. Impedance change: Wihin 3%. H4338B 1. pplied he allowed DC curren. 2. Temperaure measured by digial surface hermomeer. rehea: 15,6sec. No mechanical damage. Solder: Sn-g3.-Cu.5 emaining erminal elecrode:7% min. Solder amperaure: 26 5 Flux for lead free: rosin Dip ime: 1.5sec. ** reheaing Dipping Naural cooling 26 C 15 C 6 1±.5 Solderabiliy More han 9% of he erminal elecrode should be covered wih solder. 245 C 15 C reheaing Dipping Naural cooling 6 4±1 rehea: 15,6sec. Solder: Sn-g3.-Cu.5 Solder amperaure: 245±5 Flux for lead free: rosin Dip ime: 4±1sec. Terminal srengh The erminal elecrode and he dielecric mus no be damaged by he forces applied on he righ condiions. W W For FCB FCM HCB HB HFB FCI FHI FCH HCI: Size Force (Kfg) Time(sec) > For FC: Size Force (Kfg) Time(sec) >25 2(.787) Flexure srengh The erminal elecrode and he dielecric mus no be damaged by he forces applied on he righ condiions. 45(1.772) 45(1.772) Bending 4(1.575) Solder a chip on a es subsrae, bend he subsrae by 2mm (.79in)and reurn. 1(3.937) Bending Srengh The ferrie should no be damaged by Forces applied on he righ condiion..5(.2) Size mm(inches) -Kgf 168.8(.33) (.55) 1. FC (.79) (.79) (.16) 2.5 andom Vibraion Tes ppearance: Cracking, shipping and any oher defecs harmful o he characerisics should no be allowed. Impedance: wihin 3% Frequency: Hz for 1 min. mpliude: 1.52mm Direcions and imes:, Y, direcions for 2 hours. period of 2 hours in each of 3 muually perpendicular direcions (Toal 6 hours).
3 3. Iem erformance Tes Condiion Loading a High Temperaure Humidiy Thermal shock Low emperaure sorage es Drop ppearance: no damage. Impedance: wihin 3%of iniial value. Inducance: wihin 1%of iniial value. Q: wihin 3%of iniial value. (FCI FHI FCH) Q: wihin 2%of iniial value. (HCI ) ppearance: no damage. a: No mechanical damage b: Impedance change: 3% For Bead hase Temperaure( ) Time(min.) Impedance: wihin 3%of iniial value Inducance: wihin 1%of iniial value Measured: 5 imes Q: wihin 3%of iniial value. (FCI FHI FCH) For Inducor Q: wihin 2%of iniial value. (HCI) hase Temperaure( ) Time(min.) Measured: 1 imes Temperaure: (bead),85 (inducor) pplied curren: raed curren. Duraion: 18 12hrs. Measured a room emperaure afer placing for 2 o 3hrs. Humidiy: 9~95%H. Temperaure: 4 2. Temperaure: 6 2.(HCI) Duraion: 18 12hrs. Measured a room emperaure afer placing for 2 o 3hrs. For FCB FCM HCB HB HFB FC Condiion for 1 cycle Sep1: min. Sep2: min. Number of cycles: 5 For FCI FHI FCH HCI Condiion for 1 cycle Sep1: min. Sep2: min. Number of cycles: 1 Measured a room emperaure afer placing for 2 o 3 hrs. Temperaure: Duraion: 18 12hrs. Measured a room emperaure afer placing for 2 o 3hrs. Drop 1 imes on a concree floor from a heigh of 75cm Deraing **Deraing Curve For he ferrie chip bead which wihsanding curren over 1.5, as he operaing emperaure over 85, he deraing curren informaion is necessary o consider wih. For he deail deraing of curren, please refer o he Deraed Curren vs. Operaing Temperaure curve. Deraed Curren() Soldering and Mouning 6-1. ecommended C Board aern 85 Operaing Temperaure( C) 125 Series Chip Size Land aerns For eflow Soldering Type (mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) FCB FC Land Solder esis FCM HCB HB HFB FCI FHI FCH HCI UHI ich.4 L G H C board should be designed so ha producs are no sufficien under mechanical sress as warping he board. roducs shall be posiioned in he sideway direcion agains he mechanical sress o preven failure Soldering Mildly acivaed rosin fluxes are preferred. The minimum amoun of solder can lead o damage from he sresses caused by he difference in coefficiens of expansion beween solder, chip and subsrae. The erminaions are suiable for all wave and re-flow soldering sysems. If hand soldering canno be avoided, he preferred echnique is he uilizaion of ho air soldering ools.
4 6-2.1 Lead Free Solder re-flow: ecommended emperaure profiles for lead free re-flow soldering in Figure Solder Wave: Wave soldering is perhaps he mos rigorous of surface moun soldering processes due o he seep rise in emperaure seen by he circui when immersed in he molen solder wave, Due o he risk of hermal damage o producs, wave soldering of large size producs is discouraged. ecommended emperaure profile for wave soldering is shown in Figure Soldering Iron(Figure 3): roducs aachmen wih a soldering iron is discouraged due o he inheren process conrol limiaions. In he even ha a soldering iron mus be employed he following precauions are recommended. Noe rehea circui and producs o 15 Never conac he ceramic wih he iron ip Use a 2 wa soldering iron wih ip diameer of 1.mm 35 ip emperaure for Ferrie chip bead (max) 1.mm ip diameer (max) Limi soldering ime o 3 sec. eflow Soldering TEMETUE( C) E-HETING T(26 C / 1s max.) ~18s 48s max. 25 SOLDEING 2~4s 6~15s TIME( sec.) NTUL COOLING TEMETUE C TEMETUE C Figure 1. e-flow Soldering(Lead Free) Figure 2. Wave Soldering Figure 3. Hand Soldering Solder Volume: ccordingly increasing he solder volume, he mechanical sress o produc is also increased. Exceeding solder volume may cause he failure of mechanical or elecrical performance. Solder shall be used no o be exceed as shown in righ side: E-HETING Over 2 min. SOLDEING Wihin 1 sec. NTUL COOLING Gradual Cooling E-HETING Over 1 min. SOLDEING 3s(max.) 1s(max.) NTUL COOLING Gradual Cooling Upper limi ecommendable 7.ackaging Informaion 7-1. eel Dimension 2 ± ± Type (mm) B(mm) C(mm) D(mm) D B C x8mm x12mm "x8mm 7"x12mm Tape Dimension / 8mm Maerial of aping is paper E:1.75±.1 2:2±.1 :4±.1 D: B W:8.±.1 Series Size Bo(mm) o(mm) Ko(mm) (mm) (mm) D1(mm) FCB.FCM.HCB HB.HFB.FCI none none F:3.5 ±.1 Ko FHI.FCH.HCI none Maerial of aping is plasic E:1.75±.1 2:2±.5 o:4±.1 D: W:8. ±.1 Bo Series Size Bo(mm) o(mm) Ko(mm) (mm) (mm) D1(mm) FCB,FCM none HCB,HB HFB.FCI F:3.5±.5 D1:1 ±.1 o Ko FHI.FCH HCI SECTION - FC
5 Tape Dimension / 12mm 1.75 ±.1 o:4 ±.1 2:2.±.5 D: Series Size Bo(mm) o(mm) Ko(mm) (mm) (mm) D1(mm) 5.5±.5 W:12.±.1 Bo FCB, HCB.FCM FCI D1:1.5 ±.1 Ko o 7-3. ackaging Quaniy Chip Size Chip / eel Inner box Middle box Caron Bulk (Bags) Tearing Off Force Top cover ape F 165 o18 The force for earing off cover ape is 15 o 6 grams in he arrow direcion under he following condiions. oom Temp. ( ) oom Humidiy (%) oom am (ha) Tearing Speed mm/min Base ape 5~35 45~85 86~16 3 pplicaion Noice Sorage Condiions To mainain he solderabiliy of erminal elecrodes: 1. Temperaure and humidiy condiions: -1~ 4 and 3~7% H. 2. ecommended producs should be used wihin 6 monhs from he ime of delivery. 3. The packaging maerial should be kep where no chlorine or sulfur exiss in he air. Transporaion 1.roducs should be handled wih care o avoid damage or conaminaion from perspiraion and skin oils. 2. The use of weezers or vacuum pick up is srongly recommended for individual componens. 3. Bulk handling should ensure ha abrasion and mechanical shock are minimized.
6 Impedance Frequency Characerisics(Typical) 6. 5 FC3216KF4-3T5 12 FC3216KF4-6T4 2 FC3216KF4-121T3 IMEDNC E(Ohm) IMEDNCE(Oh m) 8 4 IMEDNCE(Ohm) FEQUENCY(MHz) FEQUENCY(MHz) FEQUEN CY(MH z) 4 FC3216KF4-31T2 1 FC3216KF4-61T2 16 FC3216KF4-12T1 IMEDNCE(Ohm) IMEDNC E(Ohm) IMEDNC E(Ohm) FEQUEN CY(MH z) FEQUEN CY(MHz) FEQUENCY(MHz)
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