ITEM :CHIP FERRITE BEADS APPROVAL SHEET CHIP FERRITE BEADS CUSTOMER : DATE :

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Muriel Fleming
5 years ago
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1 ITEM :CHIP FEITE BEADS ESTABLISHMENT APPOVED EVISION Series NO:B94192 APPOVAL SHEET CHIP FEITE BEADS CUSTOME : DATE : You can reapprove only the changed quality request recorded in spec sheet. And, e can decide other changed parts

2 Features 1. Effective for suppressing noise at high frequencies. 2. Suited for preventing the abnormal oscillation from high frequency amplifying circuits. Ordering Information B T 63 1 J T (1) (2) (3) (4) (5) (6) 3. Excellent solder heat resistance for soldering. 4. High reliability in the circuits of highcurrent. 5. Lead Free (ohs Compliant). 6. Halogen free (IPC411B Compliant) Applications 1. Noise suppression in digital equipments. 2. Computers and peripheral devices, VC and camera. 3. Noise suppression in automotive electronic equipment, car stereo, car engine controller. 4. Noise suppression for OA electronic instruments. Features (1) Series B : For Signal line (2) Material & Design S : For high speed M: For high impedance type T : For Low speed (3) Dimension First two digits : length () Last two digits : width () (4) Impedance (at 1) First two digits are impedance values. Last digit is the number of zeros. (5) Termination J : Nickel barrier (6) Packaging B : Bulk package T:Tape & eel (178 [ 7 inches ]) L : Tape & eel (254 [ 1 inches ]) Shape and Dimensions Unit : mm [inches] Type L T C Page 1/9

3 Specifications B Series(For Signal line) B 63 Part No. typ. ll at 1 MHz (Ω) min. DC esistance (mω) max. ated current (ma) max. BT BT BT BT BM BM BM BS BS BS

4 Electrical Characteristics B 63 5 BT631J BT638J BT63121J M 1M 1M 1G Frequency [Hz] 2 1 1M 1M 1M 1G Frequency [Hz] 2 1 1M 1M 1M 1G Frequency[Hz] BT63241J 6 BM638J 6 BM63121J M 1M 1M 1G Frequency[Hz] 1M 1M 1M 1G 1M 1M 1M 1G 6 BM63241J 6 BS6333J 6 BS6356J M 1M 1M 1G 1 1M 1M 1M 1G 1 1M 1M 1M 1G 6 BS638J M 1M 1M 1G Page 3/9

5 PECAUTION FO PODUCT STOAGE The electrical characteristics of products will not change when stored under typical environmental conditions. However, it is possible that the solderability of the terminal electrodes and the characteristics of the tape packaging can change during storage. For this reasons, the following storage guidelines should be followed. 1. STOAGE ENVIONMENT The tape packaging material is designed to withstand longterm storage, but they will degrade more rapidly in the presence of high temperature or high humidity. Therefore, the products shell be stored in an ambient temperature of less than 4 with a relative humidity of less than 7%. The products should be used within 6 months of receipt. To achieve best solderability, the products should be used as soon as possible after unpacking. Leftover products must be stored in dry conditions with desiccant. 2. COOSIVE GASES Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the products in an environment free of these gases. 3. TEMPEATUE FLUCTUATIONS Dew condensation may occur when the product is taken out of storage due to variation of temperature. It is important to maintain a temperaturecontrolled environment. Page 4/9

6 ELIABILITY AND TEST CONDITIONS ITEM Operating temp. range Storage temp. & humidity range esistance to solder heat Solderability eflow soldering Tensile strength (Terminal strength) EQUIEMENTS 4 ~+85 4 max., 7% H max. at packing condition 1.No damage such as cracks should be caused in chip element. 2.More than 75% of the terminal electrode shall be covered with new solder. 1.More than 9% of the terminal electrode shall be covered with new solder. 1.More than 5% of the terminal electrode shall be covered with new solder. S T *.5 S 63 T TEST CONDITION Preheat temperature : 1 to 15 Preheat time : 1min Solder temperature : 26 ±1 Dipping time : 1 ±.5sec. Preheat temperature : 1 to 15 Preheat time : 1min Solder temperature : 23 ±1 Dipping time : 3 ±1sec. Preheat temperature : 15 Preheat time : 1min Solder temperature : 25 Soldering time : 1 sec. Max. (eflow soldering profile) Adhesion of Terminal electrode (Flexure strength) a b c Body strength (Bending strength) Unit : Kgf() Unit : mm (a,b,c), Kgf() 1.The body shall not be damaged by forces applied on the right. a b a (kgf) min c 1.mm Land.5.5 d Unit : mm (d), Kgf() T d Page 5/9

7 Drop ITEM 2. Impedance change : ±within 3% EQUIEMENTS 63 TEST CONDITION Drop 1 times on a concrete Floor from a height of 91cm Vibration Thermal shock (Temperature cycle) 2. Impedance change : ±within 3% 2. Impedance change : ±within 3% Frequency : 1~55~1Hz Amplitude : 1.52mm Direction and time :,Y, directions for 2 hours Step1. 4 ±3 3 ±3min. Step2. 85 ±3 3 ±3min. Number of cycle : 1 times Heat load resistance Low temp. resistance Humidity resistance Humidity load resistance 2. Impedance change : ±within 3% 2. Impedance change : ±within 3% 2. Impedance change : ±within 3% 2. Impedance change : ±within 3% Temperature : 85 ±2 Applied current : rated current Time : 1, hours Measured at room ambient temperature after placing for 24 hours Temperature : 4 ±5 Time : 1, hours Measured at room ambient temperature after placing for 24 hours Temperature : 4 ±2 Humidity : 9~95% H Time : 5 hours Measured at room ambient temperature after placing for 24 hours Temperature : 4 ±2 Humidity : 9~95% H Applied current : rated current Time : 5 hours Measured at room ambient temperature after placing for 24 hours Page 6/9

8 PACKAGING STANDAD QUANTITY EEL DIMENSION Type Q`TY(PCS) EMAKS 63 15, Φ13.±.5 unit : mm 2.±.8 more than 5 1. Φ21.±.8 Φ178±2. Φ254±2. less than 1.5 unit : mm Type [mm] ±.3 TAPING DIMENSION / 8mm wide * Paper Tape unit : mm SPOCKET HOLE Φ , CHIP CAVITY 1.75±.1 3.5±.5 B A 8.±.3 P 2.±.5 4.±.1 T PODUCT Type A B P T(max.) Chip Beads ±.2.68 ±.2 2. ±.5.44 Page 7/9

9 TOP TAPE STENGTH * The force for tearing off top tape is 2 to 7 grams in the arrow direction. 165 to 18 Top cover tape TAPING MATEIAL * Embossed Tape * Paper Tape Top tape Top tape Plastic/thermally activated adhesive Embossment Bottom tape Paper tape Embossed carrier Sprocket hole Chip cavity LEADE AND BLANK POTION Blank Chips Blank Leader 1 to 2 pitches 2 to 4 pitches 21mm to 25 mm Drawing direction * The pitch holes shift within ±.3mm for cumulative 1 pitches. LAND PATTEN DESIGN CHIP BEADS c SIE a b c Unit : mm a b a Page 8/9

10 SOLDEING POFILE FLO SOLDEING EFLO SOLDEING POFILE(Peak 25 ) Preheating 1 sec. max. Dipping 1 sec. max. Cooling 6 sec. min. 25 Soldering 1 sec. max sec. max. 6 sec. min. 1 sec. min MANUAL SOLDEING Solder iron 3 Max. Tc ΔT ΔT 2 /.5sec soldering 2 sec max. Diameter of Solder iron 1.2mm Max. Page 9/9

CHIP FERRITE BEADS. Features. Applications. Ordering Information. Shape and Dimensions

CHIP FERRITE BEADS. Features. Applications. Ordering Information. Shape and Dimensions CHIP FERRITE BEADS Features 1. Effective for suppressing noise at high frequency, from several MHz to several hundreds MHz. 2. Chip type is suited for preventing the abnormal oscillation in high frequency