CHIP FERRITE INDUCTORS

Transcription

1 CHIP FERRITE INDUCTORS Features. Perfect for high density surface mount applications since magnetic shield dliminates crosstalk. 2. Highly reliable in wide temperature and humidity range. Superior Q characteristics in wide frequency. 3. Terminal electrode has excellent solder heat resistance. Applications. Prevention of eletromagnetic interference to signals on the secondary side of electronic equipment. Ordering Information FI A 86 K J T () (2) (3) (4) (5) (6) (7) () Series (2) Material & Design (3) Diminsions The first two digits : length(mm) The last two digits : width(mm) (4) Inductance (5) Tolerance J : 5 % K : % M : %. (6) Termination J : Nickel barrier (7) Packing B : Bulk Pack T : Tape & Reel (' 78mm [ 7 inches ]) L : Tape & Reel (' 4mm [ inches ]) Shape and Dimensions Type L W T C(max.) Fl8 Fl2 Fl.. [.0606] [ ] 3..2 [ ] 0.. [.0306].2 [ ]..2 [.0608] 0.. [.0306].2 [ ].30.2 [.0508] unit : mm[inches] 0.5 [.09] 0.6 [.024] 0.7 [.028]

2 26 FIA8270 FIA8470 FIA85 FIA86 FIA88 FIA8 FIA82 FIA8 FIA88 FIA822 FIA827 FIA833 FIA839 FIA847 FIA856 FIA868 FIA882 FIB82 FIB822 FIB82 FIB882 FIB8222 FIB Part No. Inductance H Tolerance Q SRF(MHz) DCR(m ) max. typ. L,Q test frequency (MHz) Rated Current (ma) max. % % 5% % % Specifications FI8 SRF : SelfResonant Frequency. DCR : DC Resistance FIA2470 FIA25 FIA26 FIA28 FIA2 FIA22 FIA2 FIA28 FIA222 FIA227 FIA233 FIA239 FIA247 FIA256 FIA268 FIA282 FIB22 FIB222 FIB22 FIB282 FIB2222 FIB2272 FIB2332 FIB2392 FIB Part No. Inductance H Tolerance Q SRF(MHz) DCR(m ) max. typ. L,Q test frequency (MHz) Rated Current (ma) max. % % 5% % % FI2 SRF : SelfResonant Frequency. DCR : DC Resistance

3 27 Specifications FIC2562 FIC2682 FIC2822 FIC23 FIC223 FID23 FID283 FID2223 FID2273 FID Part No. Inductance H Tolerance Q SRF(MHz) DCR(m ) max. typ. L,Q test frequency (MHz) Rated Current (ma) max. 5% % % FI2 SRF : SelfResonant Frequency. DCR : DC Resistance FIA470 FIA5 FIA6 FIA8 FIA FIA2 FIA FIA8 FIA22 FIA27 FIA33 FIA39 FIA47 FIA56 FIA68 FIA82 FIB2 FIB22 FIB2 FIB82 FIB222 FIB272 FIB332 FIB392 FIB472 FIC562 FIC682 FIC822 FIC3 FIC23 FIC3 FIC83 FIC223 FIC273 FIC Part No. Inductance H Tolerance Q SRF(MHz) DCR(m ) max. typ. L,Q test frequency (MHz) Rated Current (ma) max. % % 5% % % 5% % % FI SRF : SelfResonant Frequency. DCR : DC Resistance Test equipment : HP429A + HP692A : HP4295A + HP6334A

4 Electrical Characteristics 8 2 DC bias characteristics DC bias characteristics DC bias characteristics Inductance characteristics Inductance characteristics Inductance characteristics Q characteristics Q characteristics Q characteristics Impedance characteristics Impedance characteristics Impedance characteristics Temperature characteristics Temperature characteristics Temperature characteristics 28

5 RELIABILITY AND TEST CONDITIONS CHIP FERRITE / CERAMIC INDUCTORS ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS ~+ max., 70% RH max.. No damage such as cracks should be caused in chip element. 2. More than % of the terminal electrode shall be covered with new solder. 3. Inductance change : within 5% 4. Quality factor change : within %. More than 90% of the terminal electrode shall be covered with new solder. 2. Inductance change : within 5% 3. Quality factor change : within %. More than % of the terminal electrode shall be covered with new solder. S ª S ˆT*0.5 ª T TEST CONDITION at packing condition Preheat temperature : 0 to Preheat time : min. Solder temperature : 2 Dipping time : 0.5sec. Preheat temperature : 0 to Preheat time : min. Solder temperature : 2 Dipping time : 3 sec. Preheat temperature : Preheat time : min. Solder temperature : 2 Soldering time: sec. max. (Reflow soldering profile) Tensile strength (Terminal strength). No mechanical damage W unit:kgf (W) W(Kgf) min. W Adhension of terminal electrode (Flexure strength) a b c W. No mechanical damage unit: mm (a,b,c), Kgf (W) a b a c Land Pattern RO.5 W Body strength (Bending strength). The body shall not be damaged by forces applied on the right. W mm unit: mm (d), Kgf (W) d W RO.5 T d 62

6 CHIP FERRITE / CERAMIC INDUCTORS Drop ITEM REQUIREMENTS TEST CONDITION. No mechanical damage Drop times on a concrete floor from a height of 9cm. Vibration Thermal shock (Temperature cycle). No mechanical damage. No mechanical damage 2. Inductance change : within 5% 3. Quality factor change : within % Frequency : ~55~Hz Amplitude :.52 mm Direction and time : X,Y,Z directions for 2 hours Step. 3 3min. Step min. Number of cycle : 0 times Heat load resistance. No mechanical damage 2. Inductance change : within 5% 3. Quality factor change : within % Temperature : 85 2 Applied current : rated current Time :,000 hours Measured at room ambient temperature after placing for 24 hours Low temp. resistance. No mechanical damage 2. Inductance change : within 5% 3. Quality factor change : within % Temperature : 5 Time :,000 hours Measured at room ambient temperature after placing for 24 hours Humidity resistance. No mechanical damage 2. Inductance change : within 5% 3. Quality factor change : within % Temperature : 2 Humidity : 90~95% RH Time : 0 hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance. No mechanical damage 2. Inductance change : within 5% 3. Quality factor change : within % Temperature : 2 Humidity : 90~95% RH Applied current : rated current Time : 0 hours Measured at room ambient temperature after placing for 24 hours 63

7 PACKING STANDARD QUANTITY Type Q flty(pcs) REMARKS 03,000, ,000 BULK CASSETTE,000 4,000 4mm pitch 8, ,000 7,000 3,000 7,000 3,000,0,000 4mm 4mm REEL DIMENSION unit:mm R j j4 2.0 Type 03, 05, 8, 2, Array 6, 32, j 0.5 j2 W W[mm] 9.0.] more than less than.5 unit:mm TAPING DIMENSION / 8mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity. 0. B A P T Ko PRODUCT Type A 0. B 0. P 0. Ko 0. T(max.) CHIP BEADS CHIP BEADS ARRAY CHIP FERRITE INDUCTOR CHIP EMI SUPPRESSION FILTER CHIP EMI FILTER ARRAY CHIP LC FILTER CHIP COMMON MODE FILTER CHIP FEEDTHRU CHIP VARISTOR CHIP VARISTOR ARRAY CHIP SURGE ABSORBER

8 Paper Tape unit:mm Sprocket hole j Chip cavity. 0. B A P 0. T PRODUCT Type A 0. B 0. P 0. T(max.) MICRO INDUCTOR CHIP BEADS CHIP INDUCTOR CHIP VARISTOR CHIP SURGE ARRAY TAPING DIMENSION / 2mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity. 0. B A P T Ko PRODUCT Type A 0. B 0. P 0. Ko 0. T(max.) CHIP BEADS CHIP FEEDTHRU unit ; mm 82

9 05 BULK CASSETTE DIMENSION Unit:mm 2 0. Slider Shutter Connecting Port TOP TAPE STRENGTH The force for tearing off top tape is to 70 grams in the arrow direction. Top tape to Embossing tape TAPING MATERIAL Embossed Tape Paper Tape Top tape Top tape Paper tape Plastic/thermally activated adhesive Embossment Bottom tape Sprocket hole Embossed carrier Chip cavity LEADER AND BLANK PORTION Blank Portions Chip Cavity Blank Portions Leader to pitches to pitches 2mm to 2mm Drawing direction The pitch holes shift within mm for cumulative pitches. 83

10 LAND PATTERN DESIGN BEAD, INDUCTOR, VARISTOR, SURGE ABSORBER ARRAY SIZE a b c unit ; mm Land pattern Land pattern <3 array> <4 array> unit ; mm SIZE array a b c d 3 array 4 array EMI SUPPRESSION FILTER, LC FILTER, FEEDTHRU CAPACITOR e f Land pattern f Land pattern <2 size> <, 6 size> unit ; mm SIZE a b c d e f

11 LAND PATTERN DESIGN COMMON MODE FILTER, VARISTOR ARRAY SIZE POLE(Array) a b c d POLE 2 Array 2 POLE 2 Array unit ; mm ÆEMI FILTER ARRAY Land pattern e unit ; mm SIZE POLE(Array) a b c d e 4 Array

12 SOLDERING PROFILE REFLOW SOLERING PROFILE preheating 0 sec. max. soldering sec. max. cooling sec. min. 2 sec. max. sec. min. FLOW SOLDERING PROFILE preheating 0 sec. max. dipping sec. max. cooling sec. min. 2 sec. min. MANUAL SOLDERING solder iron max. W T /0.5 sec. Tc soldering 2 sec. max. Diameter of solder iron.2 mm max. 86