Multilayer Chip Capacitors High Voltage

Transcription

1 FEATURE Ceramic Body Inner Electrode (NiorPd) Outer Electrode Cu or Ag Ni Sn/Pb - Miniature Size - Highly Reliable Performance in High-Voltage - Industry Standard Size - Tape & Reel for Surface Mount Assembly PART NUMBER CODE CL 21 C 101 J D N C (1) (2) (3) (4) (5) (6) (7) (8) (1) SAMSUNG Multilayer Ceramic Chip Capacitor (2) Type(Size) (3) Capacitance Temperature Characteristics (4) Nominal Capacitance (5) Capacitance Tolerance (6) Rated Voltage (7) Chip thickness - NN : sst t aannddaarrdd thhi t iicckknneessss - AA : thhi t iinnnneerr thhaann t NN - BB : thhi t iicckkeerr thhaann t NN (8) Packaging Type

2 CONFIGURATION AND DIMENSIONS L T W BW CODE EIA CODE DIMENSION ( mm ) L W T (MAX) BW / / / / / / / / / / / / / / / / / / / /- 0.3 TEMPERATURE (Temperature Compensation) Temperature Characteristics below 2.0pF 2.2 ~ 3.9pF above 4.0pF above 10pF C CK CJ CH CG/CH K : +/-250 PPM/C J : +/-120 PPM/C H : +/-60 PPM/C G : +/-30 I (High Dielectric Constant) Symble EIA Code Capacitance Change Operation ( C : %) Temperature Range B X7R +/ ~ +125 F Y5V +22 ~ ~ +85 NOMINAL The value of nominal capacitance is expressed in pico-farad(pf) with a three-digit number. The first two digits denote significant figures and the last digit denotes the multiple of 10 in pf. For values below 1pF, the letter "R" is used as the decimal point and the last digit becomes significant. example = 10 x 10^0 = 10pF 222 = 22 x 10^2 = 2200pF 020 = 2 x 10^0 = 2pF 1R5 = 1.5pF

3 TOLERANCE Temperature Characteristics C0G(NPO) or T.C Series B(X7R) Symbol Tolerance Applicable Capacitance & Range B +/- 0.1pF 0.5 ~ 3pF C +/- 0.25pF D +/- 0.5pF F +/- 1.0pF F +/- 1% *G +/- 2% J +/- 5% K +/- 10% J +/- 5% K +/- 10% M +/- 20% 0.5 ~ 10pF E-24 Series for over 10pF E-12 Series Please Consult us for special tolerances. RATED VOLTAGE * : Option Symble D E G H I J K Rated Voltage(Vdc) 200V 250V 500V 630V 0V PACKAGING TYPE Symbol Packaging B Bulk E Embossed Tape, 7" Reel F Embossed Tape, 13" Reel STANDARD STEP Series Capacitance Step E E E E Standard Capacitance is " Each step x 10^n "

4 Vs CHIP THICKNESS STANDARD Description 2012 Type (0805) 3216 Type (1206) 3225 Type (1210) 4532 Type (1812) 5750 Type (2220) L 2.0+/ / / /-0.4 Dimension (mm) W 1.25+/ / /-0.3 T / / / /-0.3 M A X C A P A C I T A N C E ( p F ) C0G X7R 200V V V V V V V V V V

5 RANGE Temperature Characteristics Size Voltage 0.5 Capacitance Range (pf) (0805) (1206) V (1210) 2400 C0G 0V (1812) 0V (2220) 0V

6 I, B(X7R) Temperature Characteristics Size Voltage Capacitance Range (pf) (0805) (1206) V (1210) B(X7R) 0V (1812) 000 0V (2220) V

7 RELIABILITY AND TEST CONDITIONS NO ITEM PERFORMANCE TEST CONDITION 1 NO ABNORMAL EXTERIOR THROUGH MICROSCOPE(x10) 2 10,000Mohm OR 500Mohm.uF PRODUCT WHICHEVER IS SMALLER Rated Voltage R.V<= 500Vdc R.V > 500Vdc Applied Voltage Rated Voltage 500+/-50Vdc MEASUREMENT TIME IS 60 +/-5 SEC. Rated Voltage Applied Voltage 3 WITHSTANDING VOLTAGE NO DIELECTRIC BREAKDOWN OR MECHANICAL BREAKDOWN R.V < 500Vdc 500Vdc<= R.V <0Vdc R.V >= 0Vdc 200% of rated voltage 150% of rated voltage 120% of rated voltage The charge and discharge current is less than 50mA FREUENCY VOLTAGE 4 I WITHIN THE SPECIFIED TOLERANCE 1,000pF AND BELOW MORE THAN 1,000pF 1MHz+/-10% 1KHz+/-10% 0.5 ~ 5 Vrms 1.0Vrms WITHIN THE SPECIFIED FREUENCY VOLTAGE TOLERANCE 1KHz+/-10% 1.0Vrms FREUENCY VOLTAGE 5 I AND OVER 30pF : >=1,000 LESS THAN 30pF: >= C ( C : ) 1,000pF AND BELOW MORE THAN 1,000pF 1MHz+/-10% 1KHz+/-10% 0.5 ~ 5 Vrms 1.0Vrms 6 (D.F) B:2.5%MAX(0.025MAX) 1KHz+/-10% FREUENCY VOLTAGE 1.0Vrms ADHESIVE STRENGTH OF TERMINATION NO INDICATION OF PEELING SHALL OCCUR ON THE TERMINAL ELECTRODE. A 500g.f PULL FORCE SHALL BE APPLIED FOR 10+/-1SECOND g.f

8 NO ITEM PERFORMANCE TEST CONDITION BENDING SHALL BE APPLIED TO THE LIMIT(1mm) WITH 0.3mm/SEC BENDING STRENGTH NO MECHANICAL DAMAGE SHALL OCCUR. 50 R=340 9 SOLDERABILITY MORE THAN 75% OF THE TERMINAL SURFACE IS TO BE SOLERED NEWLY, SO METAL PART(A) DOES NOT COME OUT OR DISSOLVE BENDING 45± 1 45± 1 LIMIT SOLDER TEMPERATURE : 230+/-5C DIPPING : 10 TO 15mm DEPTH DIP TIME : 2+/-0.5SEC. SOLDER : H63A FLUX : ROSIN PRE-HEATING : AT 80~120C FOR 10~30SEC. 10 TO SOLDERING HEAT I WITHSTANDING VOLTAGE NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CAP. CHANGE WITHIN +/-2.5% OR 5pF WHICHEVER IS LARGER I B WITHIN +/-7.5% 30pF AND OVER : >= 0 LESS THAN 30pF : >= xC PASS THE PERFORMANCE NO 3. DIP : SOLDER TEMPERATURE OF 270+/-5C DIP TIME :10+/-1SEC. EACH TERMINATION SHALL BE FULLY IMMERSED AND PREHEATED AS FOLLOWING: TIME STEP TEMP.(C) (SEC.) 1 80~ ~ MEASURE AT ROOM TEMP. AFTER COOLING FOR : 24 +/- 2 HOURS I : 48 +/- 4 HOURS 11 VIBRATION TEST NO MECHANICAL DAMAGE SHALL OCCUR. CHARACTERISTIC CAP. CHANGE WITHIN +/-2.5% OR 5pF WHICHEVER IS LARGER B WITHIN +/-5% THE CAPACITOR SHALL BE SUBJECTED TO A HARMONIC MOTION HAVING A TOTAL AMPLITUDE OF 1.5mm. THE ENTIRE FREUENCY RANGE, FROM 10 TO 55Hz AND RETURN TO 10Hz, SHALL BE TRAVERSED IN 1 MINUTE. 30pF AND OVER : >= 0 LESS THAN 30pF : >= xC THIS CYCLE SHALL BE PERFORMED 2 HOURS IN EACH THERE MUTUALLY I PERPENDICULAR DIRECTION, FOR TOTAL PERIOD OF 6 HOURS.

9 NO ITEM PERFORMANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CHANGE WITHIN +/-5% OR +/-0.5pF WHICHEVER IS LARGER TEMPERATURE : 40+/-2 C RELATIVE HUMIDITY:90~95 %RH TEST TIME : /-0 Hr. 12 HUMIDITY (STEADY STATE) B WITHIN +/-12.5% 30pF AND OVER : >= ~30pF : >= xC LESS THAN 10pF : >= xC MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR : 24+/-2 Hr. I : 48+/-4 Hr. I B : 5% MAX(0.05MAX) MINIMUM : 1,000 Mohm OR 50Mohm uf PRODUCT WHICHEVER IS SMALLER NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC APPLIED VOLTAGE : RATED VOLTAGE CHANGE WITHIN +/-7.5% OR TEMPERATURE : 40+/-2 C +/-0.75pF WHICHEVER IS LARGER RELATIVE HUMIDITY : 90~95%RH B WITHIN +/-12.5% TEST TIME : /-0 Hr. 13 MOISTURE 30pF AND OVER : >= pF AND BELOW : >= + 10/3xC CURRENT APPLIED : 50mA MAX. Char. 25V and over 16V 10V 6.3V MEASURING AT ROOM TEMPERATURE I B 0.05 MAX 0.05 MAX 0.05 MAX MAX AFTER COOLING FOR : 24+/-2 Hr. I : 48+/-4 Hr. MINIMUM : 500 Mohm OR 25Mohm uf PRODUCT, WHICHEVER IS SMALLER.

10 NO ITEM PERFORMANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL OCCUR Rated Voltage Applied Voltage CHARACTERISTIC CAP. CHANGE WITHIN +/-3% OR +/-0.3pF, WHICHEVER IS LARGER I B WITHIN +/-12.5% R.V < 500Vdc 500Vdc<= R.V and R.V <0Vdc R.V >= 0Vdc 200% of rated voltage 120% of rated voltage rated voltage 14 HIGH TEMPERATURE I 30pF AND OVER : >= ~ 30 pf : >= xC LESS THAN 10pF :>= xC B : 5% MAX(0.05MAX) TEST TIME : 0 +48/-0 Hr. CURRENT APPLIED : 50mA MAX. CHAR. TEMP /-3 C B 125 +/-3 C ( MEASUREMENT) THE INITAIL VALUE OF I MINIMUM : 1,000 Mohm OR 50Mohm uf PRODUCT WHICHEVER IS SMALLER SHALL BE MEASURED AFTER THE HEAT TREATMENT OF 150+0/-10, 1HR AND SITTING OF 48+/-4HRS AT ROOM TEMPERATURE AND ROOM HUMIDITY. NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTED TO FIVE CYCLES OF THE CHARACTERISTIC CAP. CHANGE TEMPERATURE CYCLE AS FOLLOWING 15 TEMPERATURE CYCLE WITHIN +/-2.5% OR 5pF WHICHEVER IS LARGER I B WITHIN +/-7.5% 30 pf AND OVER : >= 0 LESS THAN 30pF: >= xC STEP TEMP.(C) TIME (MIN) 1 MIN. RATED TEMP / ~3 3 MAX. RATED TEMP / ~3 I MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR : 24+/-2 Hr. I : 48+/-4 Hr.

11 NO ITEM PERFORMANCE TEST CONDITION Recommend Method of Soldering CONDITION SIZE( mm ) FLOW REFLOW 16 SOLDERING GROUP BY SIZE&CAP When Solderability Is Considered, Capacitors Are Recommended To Be Used In 12 Months.