MAG.LAYERS G M L B A - N 8

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Blaise Stone
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1 APPLIICATIION GMLB chip beads can be used in a variety of electronic applications including: Computers and Computer Peripherals Cellular Communication Equipment Digital Cameras Digital Televisions Audio Equipment FEATUES The GMLB Series is Mag.Layers line of high quality ferrite chip beads. Using the latest in multilayer technology, we have developed chip beads that are able to resolve all EMI/EMC issues. High quality, reliability, and versatility make the GMLB series chip beads suitable for all your design needs. High eliability The monolithic inorganic materials used to construct GMLB chips restrain magnetic flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely effective with unstable grounding. Small Chip-Shaped Design The chip-shaped design makes GMLB chip beads ideal for automatic mounting. High Soldering Heat esistance High quality termination allows both flow and re-flow soldering methods to be applied. Sharp High Frequency Characteristics The GMLB high frequency chip series has sharp impedance characteristics, which make it suitable for high-speed signal lines. PODUCT IIDENTIIFIICATIION G M L B A - N 8 Product Code Dimension Code Impedance (at 1 MHz) Series Type Design Code Code for Special Specification MAG.LAYES GMLB-1688-A Series

2 PODUCT DIIMENSIION D C B A NOTE:Dimensions in mm PODUCT NO. A B C D GMLB-1688 (63) 1.6±.15 (.63±.6).8±.15 (.31±.6).8±.15 (.31±.6).3±.2 (.12±.8) CUENT DEATIING In operating temperatures exceeding +85, derating of current is necessary for chip ferrite beads for which rated current is 1.5A or over. Please apply the derating curve shown below according to the operating temperature. 7 6 ated Current (A) Operating Temperature( ) MAG.LAYES GMLB-1688-A Series

3 ELECTIICAL EQUIIEMENTS Part Number Impedance (Ω) at 1 MHz DC (Ω) Max. I DC (ma) Max. Operating Temp. ange ( ) GMLB A-N8 3 ± 25% GMLB A-N8 4 ± 25% GMLB A-N8 6 ± 25% GMLB A-N8 8 ± 25% GMLB A-N8 1 ± 25% GMLB A-N8 12 ± 25% GMLB A-N8 18 ± 25% GMLB A-N8 22 ± 25% GMLB A-N8 24 ± 25% GMLB A-N8 3 ± 25% GMLB A-N8 45 ± 25% GMLB A-N8 6 ± 25% GMLB A-N8 1 ± 25% GMLB A-N8 12 ± 25% GMLB A-N8 15 ± 25% ~ +125 Temperature rise should be less than 4 for P-type and less than 25 for other types when rated current is applied. MEASUIING METHOD // CONDIITIION Test Instrument: : Agilent 4291B Impedance Analyzer, Test Fixture: Agilent Osc. Level: 5mV DC : Agilent 3441A Test Condition: < Unless otherwise specified > Temperature: 15 C to 35 C < In case of doubt > Temperature: 25 C ± 2 C Humidity: 25% to 85% H Humidity: 6% to 7% H MAG.LAYES GMLB-1688-A Series

4 TYPIICAL ELECTIICAL CHAACTEIISTIICS (( T=25 )) GMLB A-N8 8 GMLB A-N8 1 GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N GMLB A-N MAG.LAYES GMLB-1688-A Series

5 GMLB A-N GMLB A-N GMLB A-N MAG.LAYES GMLB-1688-A Series

6 PACKAGIING Peel-off Force TOP COVE TAPE 165 TO 18 BASE TAPE The force for peeling off cover tape is 1 grams in the arrow direction. Dimension (Unit: mm) F TYPE A B C D E F A B C D 8 mm 178± ±.2 9 ±.5 12 ±.5 E 12 mm 178±.3 6 ± ± ± ±.1 - TYPE SIE A B W P T CHIPS/EEL GMLB , *.95±.5 4 *: For paper reels MAG.LAYES GMLB-1688-A Series

7 Taping Quantity SEIES 168 PCS/eel 4 Tape Packing Case W No. of eels W L H 2 18±.5 18±.5 2.4±.2 H L 3 18±.5 18±.5 3.6± ±.5 18±.5 4.8±.2 ` 5 18±.5 18±.5 6.±.2 Unit: cm ECOMMENDED PCB LAYOUT Solder-resist Component Land pattern Component C W B A B L Unit: mm Type 168 Size L 1.6 W.8 A.6~.8 B.6~.8 C.6~.8 MAG.LAYES GMLB-1688-A Series

8 ELIIABIILTY TEST Mechanical Performance Test ITEM SPECIFICATION TEST CONDITION More than 9% of the terminal electrode shall Solder: 96.5Sn-3.Ag-.5Cu be covered with fresh solder. Solder Temperature: 245 ± 5 Solderability Flux: osin Dip Time: 3 ± 1 Seconds Soldering Heat esistance Terminal Strength Solder: 96.5Sn-3.Ag-.5Cu The chip shall not crack. Solder temperature : 26 ± 5 More than 75% of the terminal electrode shall Flux: osin be covered with solder. Dip time: 1 ± 1 seconds The terminal electrode shall not be broken off nor the ferrite damaged. W TYPE W(KGF) TIME (SEC) GMLB-1688 GMLB GMLB ± 5 Terminal Strength Bending Strength Bending Test Vibration Drop shock The terminal electrode shall not be broken off nor the ferrite damaged. No mechanical damage. The ferrite shall not be damaged Chip P A Appearance: No damage Impedance shall be within ± 2% of the initial value. There shall be no mechanical damage. No apparent damage W GMLB TYPE W(KGF) TIME (SEC) GMLB-1688 GMLB-2129 GMLB GMLB ± 5 TYPE A(MM) P(KGF) GMLB GMLB GMLB GMLB Substrate: PCB(1mm 4mm 1.6mm) Solder: eflow Speed of Applying Force:.5mm / s Deflection: 2mm Hold Duration: 3 s The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm and a frequency of from 1 to 55Hz/1 minute repeated should be applied to the 3 directions (,Y,) for 2 hours each. Dropped onto printed circuit board from 1cm height three times in x, y, z directions. The terminals shall be protected. MAG.LAYES GMLB-1688-A Series

9 Climatic test ITEM SPECIFICATION TEST CONDITION Thermal Shock Impedance shall be within ± 2% of the initial Temperature: -55 ~125 for 3 minutes (Temperature Cycle) value. each, 1 cycles. Humidity esistance Temperature : 6 Humidity: 95% H Time: 1 ± 12 Hours High Temperature esistance Temperature : 85 ±2 Time: 1 ± 12 Hours Low Temperature esistance Temperature : -4 ±2 Time: 1 ± 12 Hours 1. Operating Temperature ange: -55 TO Storage Condition: The temperature should be within -4 ~85 and humidity should be less than 75% H. The product should be used within 6 months from the time of delivery. MAG.LAYES GMLB-1688-A Series

10 ECOMMENDED EFLOW SOLDEIING POFIILE T P t P Critical one T L to T P Temperature T L T smax T smin amp-up t L t S Preheat amp-down t=25 to Peak Time Profile Feature Sn-Pb Pb-Free t s 6~12 seconds 6~18 seconds Preheat T smin 1 15 T smax 15 2 Average ramp-up rate (T smax to T P ) 3 /second max. 3 /second max. Temperature (T L ) Time main above Time (tl ) 6~15 seconds 6~15 seconds Peak temperature (T P ) 23 25~26 Time within 5 of actual peak temperature (t P ) 1 seconds 1 seconds amp-down rate 6 /sec max. 6 /sec max. Time 25 to peak temperature 6 minutes max. 8 minutes max. NOTES The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. MAG.LAYES GMLB-1688-A Series

SB/PB Series. Multilayer Ferrite Chip Beads. [ PB Series for Large Current ] APPLICATIONS OUTLINE PRODUCT IDENTIFICATION FEATURES

SB/PB Series. Multilayer Ferrite Chip Beads. [ PB Series for Large Current ] APPLICATIONS OUTLINE PRODUCT IDENTIFICATION FEATURES YAGEO COPOATION SMD INDUCTO/BEADS Multilayer Ferrite Chip Beads SB/PB Series [ PB Series for Large Current ] APPLICATIONS Prevention of high frequency EMI form computers, printers, VCs, TVs, wireless telephone