CHIP FERRITE BEADS. Features. Applications. Ordering Information. Shape and Dimensions
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- Toby Parsons
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1 CHIP FERRITE BEADS Features 1. Effective for suppressing noise at high frequency, from several MHz to several hundreds MHz. 2. Chip type is suited for preventing the abnormal oscillation in high frequency amplifying circuits. 3. Terminal electrode has excellent solder heat resistance. 4. Frequency Characteristics of the high impedance products for high performance electronic system. 5. High reliability in the circuits of high-current, because internal electrode has low resistivity. Applications 1. Noise suppression in digital equipment. 2. Computers and its peripheral devices, VCR and camera. 3. Noise suppression in automotive electronic equipment, car stereo, car engine controller. 4. Noise suppression for OA electronic instruments. Ordering Information HB-1 M J T (1) (2) (3) (4) (5) (6) (1) Series HB : For signal line HH : For high current(~3.0a) HU : For ultra high current(~6.0a) (2) Material & Design L, Y : For ultra high speed S, B : For high speed H, C : For general purpose M, P : For high impedance type T, V : For Low speed (4) Impedance(at 100MHz) The first two digit are significant. The last digits is the number of zeros following. (5) Termination J : Nickel barrier (6) Packing B : Bulk Pack T : Tape & Reel (' 178mm [ 7 inches ]) L : Tape & Reel (' 254mm [ 10 inches ]) (3) Diminsions The first two digits : length(mm) The last two digits : width(mm) Shape and Dimensions 2 Type L W T C(max.) 1.0 [ ] [ ] [ ] [ ] [ ] 4.5 [ ] 4.5 [ ] H H-118- H-12- H H H H-157- [ ] Only HU Series 0.5 [ ] [ ] [ ] [ ] [ ] [ ] 3.2 [ ] 5.0 [ ] 0.5 [ ] [ ] [ ] [ ] [ ] [ ] 1.3 [ ] [ ] unit : mm[inches] 0.3 [.012] 0.5 [.020] 0.6 [.024] 0.6 [.024] 0.7 [.028] 0.8 [.031] 1.0 [.039] 1.2 [.047]
2 3 Specifications HB-1H18- HB-1M18- HB-1M18-0 HB-1M HB-1M HB-1M HB-1M18-1 HB-1M18-1 HB-1M18-1 HB-1M HB-1S HB-1S18- HB-1S18- HB-1S HB-1S18-5 HB-1S18-0 HB-1S HB-1S HB-1T18-2 HB-1T18- HB-1T18-0 HB-1T HB-1T HB-1T HB-1T Z at 100 ( ) min. HB18 Z at 100 ( ) min. HB series (For signal line) HB1005 HB-1H HB-1M HB-1M1005- HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1T HB-1T HB-1T1005- HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1S HB-1S1005- HB-1S1005- HB-1S HB-1S
3 4 HB-1T18-1 HB-1T HB-1T HB-1B HB-1P HB-1P HB-1P HB-1P18-1 HB-1V HB-1V HB-1V HB-1V Z at 100 ( ) min. HB (at MHz) 0(at 70MHz) HB-1H2012- HB-1H HB-1H2012- HB-1H HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1S2012-5R0 HB-1S2012-8R0 HB-1S HB-1S HB-1S HB-1S HB-1S HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1B HB-1B HB-1B HB-1V HB-1V HB-1V Z at 100 ( ) min. HB2012 2(at MHz) 0(at 70MHz) 1000(at MHz) 0(at 40MHz) 2(at 35MHz)
4 HB2012 HB-1V HB-1V HB-1P HB-1P HB-1P HB-1P HB-1P (at MHz) (at MHz) Z at 100 ( ) min HB3216 HB-1C HB-1H3216- HB-1H HB-1M HB-1M HB-1M HB-1M HB-1M HB-1M HB-1S HB-1S3216- HB-1S HB-1S HB-1S HB-1T HB-1T3216- HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1T HB-1V (at MHz) 1(at MHz) 0(at 30MHz) 70 Z at 100 ( ) min HB4516 HB-1H4516- HB-1H HB-1M HB-1T Z at 100 ( ) min HB4532 HB-1H HB-1H HB-1T HB-1T Z at 100 ( ) min
5 HB57 Z at 100 ( ) HB-1M min. HB series - L Type (For ultra high frequency signal line) HB-1L18-2R0 HB-1L18-4R0 HB-1L18-5R5 HB-1L18-7R0 HB-1L18-9R0 HB-1L HB-1L HB-1L18- HB-1L2012-3R5 HB-1L2012-6R5 HB-1L Z at 100 ( ) Z at 1 ( ) (at MHz) 55(at MHz) 70(at MHz) (at MHz) 30 30(at MHz) (at MHz) HB series - Y Type (For ultra high frequency signal line) HB-1Y18-4R0 HB-1Y18-8R0 HB-1Y HB-1Y18- HB-1Y18- Z at 100 ( ) Z at 1 ( ) (at MHz) HH series (For high current ~3A) HH-1H HH-1T HH-1S HH-1S18-5R0 HH-1M18- HH-1M18- HH-1M18- A HH-1M HH-1M A HH-1M HH-1M2012- HH-1M HH-1M HH-1M HH-1M HH-1T HH-1T HH-1T HH-1T HH-1S2012-8R0 HH-1T HH-1T Z at 100 ( ) Z at 1 ( ) min
6 HH series (For high current ~3A) HH-1H3216- HH-1H HH-1M HH-1M HH-1M HH-1M HH-1H4516- HH-1H HH-1H HH-1T HH-1M HH-1M HH-1B HH-1M HH-1M HH-1M57-1 HH-1T Z at 100 ( ) Z at 1 ( ) (at MHz) 1(at MHz) min HU series (For ultra high current ~6A) HU-1M HU-1M2012- HU-1M HU-1M HU-1T2012- HU-1H3216- HU-1H HU-1H4516- HU-1B HU-1H HU-1M Z at 100 ( ) Z at 1 ( ) min Parts with other electrical characteristics can be provided upon customer fls request. Test equipment : HP4291A + HP16192A
7 Electrical Characteristics HB1005, HB18, HB2012 Z R X HB-1M J HB-1M J HB-1M1005-J HB-1M1005-0J HB-1M J HB-1M J HB-1M J HB-1M1005-1J HB-1M HB-1T J HB-1T J HB-1T1005-J 8
8 HB-1T1005-0J HB-1T J HB-1T J Z R X HB-1T J HB-1S J HB-1S1005-J HB-1S J HB-1H18-J HB-1M18-0J HB-1M18-121J HB-1M18-221J HB-1M18-301J 9
9 HB-1M18-1J HB-1M18-102J Z R X HB-1S18-J HB-1S18-J HB-1S18-400J HB-1S18-5J HB-1S18-0J HB-1S18-121J HB-1S18-221J HB-1T18-2J HB-1T18-0J HB-1T18-121J 10
10 HB-1T18-221J HB-1T18-301J HB-1T18-1J Z R X HB-1T18-102J HB-1B18-222J HB-1V18-301J HB-1H2012-2J HB-1H J HB-1M2012-0J HB-1M J HB-1M J HB-1M J 11
11 HB-1M J HB-1M2012-1J HB-1M J Z R X HB-1M J HB-1M J HB-1S2012-8R0J HB-1S J HB-1S2012-0J HB-1S J HB-1T2012-2J HB-1T J HB-1T2012-0J 12
12 HB-1T J HB-1T J HB-1T J Z R X HB-1T2012-1J HB-1T J HB-1T J HB-1T J HB-1B J HB-1B J HB-1C3216-3J HB-1H J HB-1H3216-J 13
13 HB-1H J HB-1M J Z R X HB-1M J HB-1M J HB-1M J HB-1M3216-1J HB-1M3216-1J HB-1M J HB-1S3216-J HB-1S3216-0J HB-1S J HB-1S3216-1J 14
14 HB-1T3216-3J HB-1T3216-J HB-1T J Z R X HB-1T J HB-1T J HB-1T3216-1J HB-1T J HB-1T J HB-1H J HB-1M J HB-1T J 15
15 HB-1H J HB-1T J Z R X HB-1H J HB series(for ultra high speed signal line) HB18,HB2012 HB-1L18-2R0 HB-1L18-4R0 HB-1L18-5R5 HB-1L18-7R0 HB-1L18-9R0 HB-1L HB-1L18- HB-1Y18-4R0 HB-1Y
16 HB-1L2012-3R5 HB-1L2012-6R5 HB-1L Z R X HH,HU series HH-1M18-J HH-1M18-J HH-1M18-121J HH-1H2012-2J HH-1M2012-J HH-1M J HH-1M J HH-1M J HH-1T2012-2J 17
17 HH-1M2012-1J HH-1T J HH-1S2012-8R0 Z R X HH-1H3216-J HH-1M J HH-1M3216-1J HH-1M3216-1J HH-1H4516-J HH-1M4516-J HH-1H J HH-1T J HH-1M J 18
18 HH-1B J HH-1M57-401J HU-1M J Z R X HU-1M2012-J HU-1M2012-0J HU-1M J HU-1H3216-J HU-1H4516-J HU-1H J HU-1M57-401J 19
19 RELIABILITY AND TEST CONDITIONS CHIP FERRITE BEADS ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS ~ max., 70% RH max. 1. No damage such as cracks should be caused in chip element. 2. More than 75% of the terminal electrode shall be covered with new solder. 3. Impedance change : within 30% 1. More than % of the terminal electrode shall be covered with new solder. 2. Impedance change : within 30% 1. More than % of the terminal electrode shall be covered with new solder. S ª S ˆT*0.5 ª T TEST CONDITION at packing condition Preheat temperature : 100 to Preheat time : 1min. Solder temperature : 2 10 Dipping time : sec. Preheat temperature : 100 to Preheat time : 1min. Solder temperature : Dipping time : 3 1sec. Preheat temperature : Preheat time : 1min. Solder temperature : 230 Soldering time: 10 sec. max. (Reflow soldering profile) Tensile strength (Terminal strength) 1. No mechanical damage Adhension of terminal electrode (Flexure strength) W a b c W unit:kgf (W) No mechanical damage unit: mm (a,b,c), Kgf (W) a b a W W(Kgf) min. c Land Pattern RO.5 W Body strength (Bending strength) 1. The body shall not be damaged by forces applied on the right. W 1.0mm unit: mm (d), Kgf (W) d W RO.5 T d 58
20 CHIP FERRITE BEADS Drop Vibration ITEM REQUIREMENTS No mechanical damage 2. Impedance change : within 30% 1. No mechanical damage 2. Impedance change : within 30% TEST CONDITION Drop 10 times on a concrete floor from a height of 91cm. Frequency : 10~55~10Hz Amplitude : 1.52 mm Direction and time : X,Y,Z directions for 2 hours Thermal shock (Temperature cycle) 1. No mechanical damage 2. Impedance change : within 30% Step min. Step min. Number of cycle : 100 times Heat load resistance 1. No mechanical damage 2. Impedance change : within 30% Temperature : 85 2 Applied current : rated current Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Low temp. resistance 1. No mechanical damage 2. Impedance change : within 30% Temperature : Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Humidity resistance 1. No mechanical damage 2. Impedance change : within 30% Temperature : 40 2 Humidity : ~95% RH Time : hours Measured at room ambient temperature after placing for 24 hours Humidity load resistance 1. No mechanical damage 2. Impedance change : within 30% Temperature : 40 2 Humidity : ~95% RH Applied current : rated current Time : hours Measured at room ambient temperature after placing for 24 hours 59
21 PACKING STANDARD QUANTITY Type Q flty(pcs) REMARKS 03 15,000 10, ,000 BULK CASSETTE 10,000 4,000 4mm pitch 8, ,000 7,000 3,000 7,000 3,000 1, 1, mm 254mm REEL DIMENSION unit:mm R1.0 j j Type 03, 1005, 18, 2012, 3216 Array 4516, 4532, j j W W[mm] ] more than less than 1.5 unit:mm TAPING DIMENSION / 8mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP BEADS ARRAY CHIP FERRITE INDUCTOR CHIP EMI SUPPRESSION FILTER CHIP EMI FILTER ARRAY CHIP LC FILTER CHIP COMMON MODE FILTER CHIP FEEDTHRU CHIP VARISTOR CHIP VARISTOR ARRAY CHIP SURGE ABSORBER
22 Paper Tape unit:mm Sprocket hole j Chip cavity B A P T 2.0 PRODUCT Type A 0.1 B 0.1 P 0.1 T(max.) MICRO INDUCTOR CHIP BEADS CHIP INDUCTOR CHIP VARISTOR CHIP SURGE ARRAY TAPING DIMENSION / 12mm wide Embossing Tape unit:mm Sprocket hole j Chip cavity B A P T Ko PRODUCT Type A 0.1 B 0.1 P 0.1 Ko 0.1 T(max.) CHIP BEADS CHIP FEEDTHRU unit ; mm 82
23 1005 BULK CASSETTE DIMENSION Unit:mm Slider Shutter Connecting Port TOP TAPE STRENGTH The force for tearing off top tape is 20 to 70 grams in the arrow direction. Top tape 165 to 1 Embossing tape TAPING MATERIAL Embossed Tape Paper Tape Top tape Top tape Paper tape Plastic/thermally activated adhesive Embossment Bottom tape Sprocket hole Embossed carrier Chip cavity LEADER AND BLANK PORTION Blank Portions Chip Cavity Blank Portions Leader 10 to 20 pitches 20 to 40 pitches 210mm to 2mm Drawing direction The pitch holes shift within 0.3mm for cumulative 10 pitches. 83
24 LAND PATTERN DESIGN BEAD, INDUCTOR, VARISTOR, SURGE ABSORBER ARRAY SIZE a b c unit ; mm Land pattern Land pattern <3 array> <4 array> unit ; mm SIZE array a b c d array 4 array EMI SUPPRESSION FILTER, LC FILTER, FEEDTHRU CAPACITOR e f Land pattern f Land pattern <2012 size> <3216, 4516 size> unit ; mm SIZE a b c d e f
25 LAND PATTERN DESIGN COMMON MODE FILTER, VARISTOR ARRAY SIZE POLE(Array) a b c d POLE 2 Array 2 POLE 2 Array unit ; mm ÆEMI FILTER ARRAY Land pattern e unit ; mm SIZE POLE(Array) a b c d e Array
26 SOLDERING PROFILE REFLOW SOLERING PROFILE preheating 100 sec. max. soldering 10 sec. max. cooling sec. min sec. max. sec. min. FLOW SOLDERING PROFILE preheating 100 sec. max. dipping 10 sec. max. cooling sec. min. 2 sec. min. MANUAL SOLDERING solder iron max. 30W T /0.5 sec. Tc soldering 2 sec. max. Diameter of solder iron 1.2 mm max. 86
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