SPECIFICATION PARAMETER SPECIFICATION CONDITION TEST INSTRUMENTS

Transcription

1 rightek (Europe) Limited 1. MECHNICL & DIMENSIONS (UNIT: mm) 4R7 3R3 壮嘉雯 SPECIFICTION C a b c HF COMPLINT 7.6 Max 6.8 Max 3.2Max D 2.9±0.5 E 1.6± ref 3.7 ref 3.5 ref PC Pattern c Equivalent Circuit gray coating REMRK a b a (1) 新 7300 铁粉 (2)0.8*5.0*8.5Ts 2. ELECTRICL REQUIREMENTS: L0 3.3 ± 20% uh 100KHz/0.25V CH-1062 LCR METER DCR 30.0 max ± 5 I-sat 10.0(Typ) mps 75% L0 CH-3302 LCR METER + CH-1320 IS I rms 6.0 (Typ) mps ΔT 40 DIGITL THERMOMTER: DM TEMPERTURE RTING: Operating -20 ~ PRODUCT IDENTIFICTION: S R3 M - G C D E : Series Name. D: Inductance Tolerance. ( M±20%, K±10% ) : Dimensions and shape. E: Powder material. C: Inductance. ( Exp. 3.3uH = 3R3 ) (3) 成型条件 : 压力 :100 速度 :100 保压 :4S PRMETER SPECIFICTION CONDITION TEST INSTRUMENTS CH-16502C IMPEDNCE METER 08/10/2015 1

2 rightek (Europe) Limited 5. TESTING DT: PRMETER L UNIT SPECIFICTION CONDITION MIENT CONDITION 7. TEST DT NO MEN R TEMPERTURE 25 ± 5 HUMIDITY C D E 7.6 Max MEN R OK 0K 60 ± 10% 08/10/2015 2

3 ΔT ( C ) INDUCTNCE ( uh ) rightek (Europe) Limited 8. Electrical curve 3.6 (7)MRKING: NR DC IS (mps) DC IS ( mps ) 08/10/2015 3

4 rightek (Europe) Limited 9. Reliability and Testing Conditions / Pin Type Power Inductors SMD series Item Specification Conditions HF COMPLINT Operating temperature range Storage temperature and humidity range -20 ~ ±5, 70% RH Max 230 Preheating Dipping Cooling Solderability More than 90% of the terminal electrode should be covered with solder ±1.0 Unit: Second Preheatin Dipping Cooling 260 Solder Heat Resistance ±0. Unit: Second Heat resistance fter 500 hours in 125±5 and 2 hour drying under normal condition. Cold resistance fter 500 hours in -40±5 and 2 hour drying under normal condition. fter 10 cycles of following condition. Thermal shock Step Temperature ( ) Times (min.) 1-40± Room Temperature Within ± Room Temperature Within 3 Humidity Resistance fter 500 hours in 40±2 and 90 to 95% humidity, and 2 hour drying under normal condition. Vibration Test Inductance within ±5% of initial value and appearance shall not break. fter vibration for 1hour, In each of three orientations at sweep vibration (10~55~10Hz) with 1.52mm P-P mplitudes. 08/10/2015 4

5 0 0 TEMPERTURE C C Temperature ( ) Temperature ( ) rightek (Europe) Limited 10. Recommended Soldering Conditions For Lead-Free pplication HF COMPLINT Figure 1. Re-flow Soldering Preheating Soldering Cooling Peak : 245±5 5±0.5 sec or more sec to 120 Sec. PRE-HETING Time SOLDERING (Sec.) NTURL Figure 2. Hand Soldering Within 4 COOLING PRE-HETING SOLDERING NTURL COOLING Preheating Solderin Cooling Within 3 sec. Over 1 min. Over 1 min. Within 10 3 sec. Sec. Within 3 sec. Gradual Cooling Gradual Cooling 08/10/2015 5

6 W 0 F E D C 11. PCKGING Reel Dimension rightek (Europe) Limited Type (mm) (mm) C(mm) D(mm) 13'' x 16mm 16.0 ± ± ± Tape Dimension P2 P0 P D0 0 (7)MRKING: NR60 W O O KO P F E 16± ± ± ±0.1 12± ± ±0.1 Packaging Quantity P/N Chip/Reel Inner ox Carton PO P2 T 4±0.1 2± ±0.05 S pcs 3000pcs 12000pcs Tearing Off Force The force tearing off cove tape is 15 to 60 grams in the arrow direction under the following conditio Room Temp ( ) Room Humidity (%) Room atrn (hpa) Teaming Speed (mm/min) 5~35 45~85 860~ Storage Conditions 1. Temperature and humidity conditions: Less than 40 and 70% RH. 2. Recommended products should be used within 6 months form the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2.The use of tweezers or vacuum pick up is strongly recommended for individual components. 3.ulk handling should ensure that abrasion and mechanical shock are minimized. 08/10/2015 6