M. Audronis 1 and F. Zimone 2 1. Nova Fabrica Ltd. 1. Angstrom Sciences Inc.
|
|
|
- Cecil Roberts
- 6 years ago
- Views:
Transcription
1 M. Audronis 1 and F. Zimone 2 1 Nova Fabrica Ltd. 1 Angstrom Sciences Inc. info@novafabrica.biz 1
2 Founded in 2013 the company is based in Lithuania (northern EU). NF are involved in two business areas: Manufacture of thin film components (e.g. FloTron process control systems) Distribution/resale of thin film products in the Baltic States area. 2
3 Reactive Sputtering is a process where a target of one chemical composition is sputtered in the presence of a gas or a mixture of gasses that will react with the target material to form a coating of a different chemical composition. Example: Si + Ar/O2 -> compound SiO2 coating. Argon is in most cases the main gas and the amount of a reactive gas introduced into a process chamber is controlled to either achieve certain amount of doping or produce a fully reacted compound. 3
4 a) and (b) devices with an OLED screen, (c) anti-reflective coatings, (d) laser optics elements (e) ITO coated glass, (f) ITO coated polymeric web, (g) decorative oxide coatings (h) TiN coated taps, (i) DLC coated end-mill, (j) Ti-O-N thermal solar absorber. 4
5 Operation in the so called transition region (explained in the later slides) allows high coating deposition rates to be obtained (normally using AC or p-dc power), Provides a superior alternative to sputtering ceramic compound targets with RF power. Can provide significant cost savings as well as production rate advantages. 5
6 (a) Deposition rate decrease due to target poisoning (after Hollands, 1968), (b) an arc in a magnetron discharge (courtesy of Deposition Sciences, Inc.), (c) a TEM micrograph showing an example of a droplet incorporated in a ceramic coating and resultant structure evolution, (d) SEM micrograph showing arc damage on the surface of a ceramic coating. 6
7 Essentially three magnetron sputtering target poisoning mechanisms can be taking place: Chemisorption, Ion implantation and Diffusion (hot processes, e.g. HIPIMS). The thickness of the compound formed depends on the location in the racetrack. AC and DC processes ---> a few nanometre compound layers. Hot processes, e.g. Hot Target Sputtering (HTS) or High Power Impulse Magnetron Sputtering (HIPIMS), can have pronounced diffusion taking place, with diffusion profiles extending as deep as a few tens or even hundreds of nanometres. 7
8 Largely understood as undesired effect. Opens opportunities to produce better coatings faster and fine tune film chemical composition and properties. Target poisoning during reactive sputtering (B. Sproul). etc. 8
9 After M Audronis et al Time effect, so can be represented as sensor vs. time 9
10 Fast changing processes require use of fast feedback loops, Algorithms of choice: PID (most widespread; can be used for reactive sputtering) PDF (robots, auto-pilots, temperature control, motor control, etc.; can be used for reactive sputtering), Fuzzy logic. 10
11 Target Voltage [Applied Films Lab (US), 1978] Free of charge; not suitable for multi-zone processing; only some materials. P.E.M. [Von Ardenne (DE) 1982, Bell Labs (US) 1981] High speed, excellent signal quality, suitable for large area multi-zone processing. Prone to disturbances and drifts due to moving substrate, target erosion, etc. Mass spectrometer [Bill Sproul, 1983] Excellent speed and signal, expensive. 11
12 Dual AC setup. BOC, 1995 Dual closed field setup. BOC, 1989 Dual magnetron alternating anode/cathode set-ups provide excellent process stability. Originally practiced with two same polarity arrays, Closed-field configuration with varying tilt angles may reduce plasma impedance and allows plasma substrate interaction control. Asymmetric dual magnetic arrays seem to be unnecessary luxury. Power supplies available from EN Technologies, Huettinger, AE, etc. 12
13 13
14 OEMs: GVE (UK), Izovac (BY), Sidrabe (LV), etc. NF, FloTron Gencoa: Speedflo Bill Sproul, (mass spec.) IRESS (Peter White) Megatech, Reactaflo Now offer FloTron Von Ardenne, PEM (note : dates indicated in the graph represent the best knowledge of the authors and may not be accurate.) Time (year) 14
15 1. FloTron TM ultra fast precision process monitoring & control systems models (3 / 5 / 9 channel) to suit any Reactive Sputtering process requirement. 3. Many advantages. Too many to mention all. Figure: FloTron X3 4. Some features and application examples given in the following slides. 15
16 Economical way to produce large area films by reactive sputtering using two reactive gases (e.g. Ti-O-N, Zr-O-N, Cr-O-N, etc.) 16
17 Dual sensor control, Nitrogen is not essential, Better films and faster can be produced without Nitrogen. 17
18 Reactively sputtered ZrO2 film posses better optical properties than optimized IBS ZrO2 Production speed is x10 faster. Room temperature deposition Full details at ISSP
19 K.J. Lesker sputtering system. Unique dual loop control approach for Nb Si. Both Nb (p-dc) and Si (RF) operate in the transition region. Room temperature deposition. Excellent film properties 19
20 V Conventional HIPIMS pulse and light detected by a PMT module. After Audronis et. al Schamatic of HIPIMS exhibit multiple pulses New power supply technologies - complex pulse patterns. Intelligent HIPIMS plasma monitoring sensor, which provide excellent signal for a wide range of HIPIMS pulse frequencies and will deal comfortably with pulses coming in at irregular intervals. The signal provided by the new sensor is straight forward to interpret and convenient to use. 20
21 Integration of an OEM device using only software libraries (e.g. DLLs) can be difficult. PROIFIBUS interface for quick, convenient and natural integration with PLCs and HMIs. Other FIELDBUS interfaces available (PROFINET, EtherCAT, etc.) 21
22 Reactive Sputtering field is as fascinating and fruitful as ever. New developments in both process technology and hardware are plentiful (some covered in this presentation). More is on the way. Thank you! 22
This is an author produced version of a paper presented at 2nd PATCMC, June 6th-8th 2011 Plzeň, Czech Republic.
http://uu.diva-portal.org This is an author produced version of a paper presented at 2nd PATCMC, June 6th-8th 2011 Plzeň, Czech Republic. Kubart, T. 2011. Process modelling for reactive magnetron sputtering
http://www.diva-portal.org This is the published version of a paper presented at Invited talk: 12th International Symposium on Sputtering and Plasma Processes, Kyoto, July 10-12, 2013. Citation for the
Keywords. 1=magnetron sputtering, 2= rotatable cathodes, 3=substrate temperature, 4=anode. Abstract
Managing Anode Effects and Substrate Heating from Rotatable Sputter Targets. F. Papa*, V. Bellido-Gonzalez**, Alex Azzopardi**, Dr. Dermot Monaghan**, *Gencoa Technical & Business Support in US, Davis,
TMT4320 Nanomaterials November 10 th, Thin films by physical/chemical methods (From chapter 24 and 25)
1 TMT4320 Nanomaterials November 10 th, 2015 Thin films by physical/chemical methods (From chapter 24 and 25) 2 Thin films by physical/chemical methods Vapor-phase growth (compared to liquid-phase growth)
A novel sputtering technique: Inductively Coupled Impulse Sputtering (ICIS)
IOP Conference Series: Materials Science and Engineering A novel sputtering technique: Inductively Coupled Impulse Sputtering (ICIS) To cite this article: D A L Loch and A P Ehiasarian 2012 IOP Conf. Ser.:
LECTURE 5 SUMMARY OF KEY IDEAS
LECTURE 5 SUMMARY OF KEY IDEAS Etching is a processing step following lithography: it transfers a circuit image from the photoresist to materials form which devices are made or to hard masking or sacrificial
6.5 Optical-Coating-Deposition Technologies
92 Chapter 6 6.5 Optical-Coating-Deposition Technologies The coating process takes place in an evaporation chamber with a fully controlled system for the specified requirements. Typical systems are depicted
Modelling of the Target Voltage Behaviour in Reactive Sputtering R. De Gryse*, D. Depla University Ghent, Krijgslaan 281/S1, B-9000 GENT, Belgium
Modelling of the Target Voltage Behaviour in Reactive Sputtering R. De Gryse*, D. Depla University Ghent, Krijgslaan 28/S, B-9 GENT, Belgium Abstract It has been shown that at least two mechanisms are
Repetition: Ion Plating
Repetition: Ion Plating Substrate HV (bis ca. 1kV) Optional ionization system Source Ionized filling gas Source material, ionized or neutral Repetition: Ion Plating Ion Species Separated ion source Ions
Atmospheric pressure Plasma Enhanced CVD for large area deposition of TiO 2-x electron transport layers for PV. Heather M. Yates
Atmospheric pressure Plasma Enhanced CVD for large area deposition of TiO 2-x electron transport layers for PV Heather M. Yates Why the interest? Perovskite solar cells have shown considerable promise
Exploration into Sputtered ITO Film Properties as a Function of Magnetic Field Strength
Tangential Magnetic Flux, Gauss Exploration into Sputtered ITO Film Properties as a Function of Magnetic Field Strength Patrick Morse and Timmy Strait Sputtering Components Inc. Owatonna Minnesota ABSTRACT
Gaetano L Episcopo. Scanning Electron Microscopy Focus Ion Beam and. Pulsed Plasma Deposition
Gaetano L Episcopo Scanning Electron Microscopy Focus Ion Beam and Pulsed Plasma Deposition Hystorical background Scientific discoveries 1897: J. Thomson discovers the electron. 1924: L. de Broglie propose
Energy fluxes in plasmas for fabrication of nanostructured materials
Energy fluxes in plasmas for fabrication of nanostructured materials IEAP, Universität Kiel 2nd Graduate Summer Institute "Complex Plasmas" August 5-13, 2010 in Greifswald (Germany) AG 1 Outline Motivation
Hysteresis-free reactive high power impulse magnetron sputtering
Linköping University Postprint Hysteresis-free reactive high power impulse magnetron sputtering E. Wallin and U. Helmersson N.B.: When citing this work, cite the original article. Original publication:
Plasma Deposition (Overview) Lecture 1
Plasma Deposition (Overview) Lecture 1 Material Processes Plasma Processing Plasma-assisted Deposition Implantation Surface Modification Development of Plasma-based processing Microelectronics needs (fabrication
DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD
Chapter 4 DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD 4.1 INTRODUCTION Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering
In search for the limits of
In search for the limits of rotating cylindrical magnetron sputtering W. P. Leroy, S. Mahieu, R. De Gryse, D. Depla DRAFT Dept. Solid State Sciences Ghent University Belgium www.draft.ugent.be Planar Magnetron
Atomic Force/Magnetic Force Microscope
Atomic Force/Magnetic Force Microscope Veeco Instruments Dimension 3000 SPM with Nanoscope IIIa controller Atomic Force Microscopy Mode Magnetic Force Microscopy Mode Vibration isolation and sound proof
nmos IC Design Report Module: EEE 112
nmos IC Design Report Author: 1302509 Zhao Ruimin Module: EEE 112 Lecturer: Date: Dr.Zhao Ce Zhou June/5/2015 Abstract This lab intended to train the experimental skills of the layout designing of the
Substrate Thermal Heating Rates as a Function of Magnetically Controlled Plasma Impedance on Rotary Cathodes
Substrate Thermal Heating Rates as a Function of Magnetically Controlled Plasma Impedance on Rotary Cathodes Patrick Morse, Russ Lovro, Timmy Strait, Mike Rost Sputtering Components Inc. Owatonna Minnesota
Repetition: Practical Aspects
Repetition: Practical Aspects Reduction of the Cathode Dark Space! E x 0 Geometric limit of the extension of a sputter plant. Lowest distance between target and substrate V Cathode (Target/Source) - +
Application of the GD-Profiler 2 to the PV domain
Application of the GD-Profiler 2 to the PV domain GD Profiler 2 RF GDOES permits to follow the distribution of the elements as function of depth. This is an ultra fast characterisation technique capable
FIB - SIMS. Focussed Ion Beam Secondary Ion Mass Spectrometry.
FIB - SIMS Focussed Ion Beam Secondary Ion Mass Spectrometry Outline Introduction to Hiden Analytical Introduction to SIMS FIB-SIMS - Introduction and key features FIB-SIMS - Applications data Hiden SIMS
Reactive magnetron sputter deposition: a journey from target to substrate
Reactive magnetron sputter deposition: a journey from target to substrate D. Depla Dedicated Research on Advanced Films and Targets Ghent University Setting the scene Who? Some keywords Main features of
A DIVISION OF ULVAC-PHI
A DIVISION OF ULVAC-PHI X-ray photoelectron spectroscopy (XPS/ESCA) is the most widely used surface analysis technique and has many well established industrial and research applications. XPS provides
Analyses of LiNbO 3 wafer surface etched by ECR plasma of CHF 3 & CF 4
1998 DRY PROCESS SYMPOSIUM VI - 3 Analyses of LiNbO 3 wafer surface etched by ECR plasma of CHF 3 & CF 4 Naoki Mitsugi, Kaori Shima, Masumi Ishizuka and Hirotoshi Nagata New Technology Research Laboratories,
EE143 Fall 2016 Microfabrication Technologies. Lecture 6: Thin Film Deposition Reading: Jaeger Chapter 6
EE143 Fall 2016 Microfabrication Technologies Lecture 6: Thin Film Deposition Reading: Jaeger Chapter 6 Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 Vacuum Basics Units 1 atmosphere
Wet and Dry Etching. Theory
Wet and Dry Etching Theory 1. Introduction Etching techniques are commonly used in the fabrication processes of semiconductor devices to remove selected layers for the purposes of pattern transfer, wafer
Influence of the nitrogen admixture to argon on the ion energy distribution in reactive high
Home Search Collections Journals About Contact us My IOPscience Influence of the nitrogen admixture to argon on the ion energy distribution in reactive high power pulsed magnetron sputtering of chromium
On the Method of Monitoring and Optimal Control of RF-Plasma. A. Aghajanyan, A. Hakhoumian, N. Poghosyan, T. Poghosyan, and T.
Armenian Journal of Physics, 2015, vol. 8, issue 1, pp. 44-50 On the Method of Monitoring and Optimal Control of RF-Plasma A. Aghajanyan, A. Hakhoumian, N. Poghosyan, T. Poghosyan, and T. Zakaryan * Institute
Deposition of polymeric thin films by PVD process. Hachet Dorian 09/03/2016
Deposition of polymeric thin films by PVD process Hachet Dorian 09/03/2016 Polymeric Thin Films nowadays The evaporation of polymers Ionization-Assisted Method Vacuum deposition 0,055eV/molecule at 1000
Plasma diagnostics of pulsed sputtering discharge
Plasma diagnostics of pulsed sputtering discharge Vitezslav Stranak Zdenek Hubicka, Martin Cada and Rainer Hippler University of Greifswald, Institute of Physics, Felix-Hausdorff-Str. 6, 174 89 Greifswald,
UNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun
UNIT 3 By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun 1 Syllabus Lithography: photolithography and pattern transfer, Optical and non optical lithography, electron,
June 5, 2012: Did you miss it? No Problem. Next chance in Venus in Front of the Sun and there is more: plasma imaging!
July 18 20, 2012 5th Int. Workshop on "Thin Films Applied To Superconducting RF And New Ideas For Pushing The Limits Of RF Superconductivity" Jefferson Lab, VA Strong localization of ionization in high
Characteristics of Neutral Beam Generated by a Low Angle Reflection and Its Etch Characteristics by Halogen-Based Gases
Characteristics of Neutral Beam Generated by a Low Angle Reflection and Its Etch Characteristics by Halogen-Based Gases Geun-Young Yeom SungKyunKwan University Problems of Current Etch Technology Scaling
Nova 600 NanoLab Dual beam Focused Ion Beam IITKanpur
Nova 600 NanoLab Dual beam Focused Ion Beam system @ IITKanpur Dual Beam Nova 600 Nano Lab From FEI company (Dual Beam = SEM + FIB) SEM: The Electron Beam for SEM Field Emission Electron Gun Energy : 500
Deposition of thin films
16 th March 2011 The act of applying a thin film to a surface is thin-film deposition - any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. Thin is
Contents. Bibliografische Informationen digitalisiert durch
1 Simulation of the Sputtering Process T. Ono, T. Kenmotsu, and T. Muramoto 1 1.1 Introduction 1 1.2 Computer Simulation Codes 2 1.3 Total Sputtering Yield 5 1.3.1 Incident-Energy Dependence of Sputtering
MICROCHIP MANUFACTURING by S. Wolf
by S. Wolf Chapter 15 ALUMINUM THIN-FILMS and SPUTTER-DEPOSITION 2004 by LATTICE PRESS CHAPTER 15 - CONTENTS Aluminum Thin-Films Sputter-Deposition Process Steps Physics of Sputter-Deposition Magnetron-Sputtering
Opportunities for Advanced Plasma and Materials Research in National Security
Opportunities for Advanced Plasma and Materials Research in National Security Prof. J.P. Allain allain@purdue.edu School of Nuclear Engineering Purdue University Outline: Plasma and Materials Research
3.155J/6.152J Microelectronic Processing Technology Fall Term, 2004
3.155J/6.152J Microelectronic Processing Technology Fall Term, 2004 Bob O'Handley Martin Schmidt Quiz Nov. 17, 2004 Ion implantation, diffusion [15] 1. a) Two identical p-type Si wafers (N a = 10 17 cm
Plasmonic Hot Hole Generation by Interband Transition in Gold-Polyaniline
Supplementary Information Plasmonic Hot Hole Generation by Interband Transition in Gold-Polyaniline Tapan Barman, Amreen A. Hussain, Bikash Sharma, Arup R. Pal* Plasma Nanotech Lab, Physical Sciences Division,
Combinatorial RF Magnetron Sputtering for Rapid Materials Discovery: Methodology and Applications
Combinatorial RF Magnetron Sputtering for Rapid Materials Discovery: Methodology and Applications Philip D. Rack,, Jason D. Fowlkes,, and Yuepeng Deng Department of Materials Science and Engineering University
Impact of Chamber Pressure on Sputtered Particle Energy
Wilmert De Bosscher Chief Technology Officer +32 9381 6177 wilmert.debosscher@soleras.com Impact of Chamber Pressure on Sputtered Particle Energy Tampa, October 18 th, 2017 Background Why Sputtering at
GRAPHENE FLAGSHIP TECHNOLOGIES
IOT AND SENSORS DATACOM HEALTH ENERGY COMPOSITES GRAPHENE FLAGSHIP TECHNOLOGIES IOT AND SENSORS CHROMATIC EYE The chromatic eye contains many different graphene photodetectors. This is a broadband sensor
Defining quality standards for the analysis of solid samples
Defining quality standards for the analysis of solid samples Thermo Scientific Element GD Plus Glow Discharge Mass Spectrometer Redefine your quality standards for the elemental analysis of solid samples
Accelerated Neutral Atom Beam (ANAB)
Accelerated Neutral Atom Beam (ANAB) Development and Commercialization July 2015 1 Technological Progression Sometimes it is necessary to develop a completely new tool or enabling technology to meet future
Thin and Ultrathin Plasma Polymer Films and Their Characterization
WDS'13 Proceedings of Contributed Papers, Part III, 134 138, 2013. ISBN 978-80-7378-252-8 MATFYZPRESS Thin and Ultrathin Plasma Polymer Films and Their Characterization M. Petr, O. Kylián, J. Hanuš, A.
Introduction to Plasma
What is a plasma? The fourth state of matter A partially ionized gas How is a plasma created? Energy must be added to a gas in the form of: Heat: Temperatures must be in excess of 4000 O C Radiation Electric
Leybold Optics Low-E series
Leybold Optics Low-E series Heat treatable Low-E coatings for architectural applications I. Wegener VDMA - 04.03.2015 Introduction Content New layer stack Different layer stack embodiments Physical properties
AZtec LayerProbe TM. Layer thickness and composition characterisation in the SEM. ...the ultimate non-destructive, high-resolution solution.
AZtec LayerProbe TM EDS Layer thickness and composition characterisation in the SEM...the ultimate non-destructive, high-resolution solution 300 nm 253 nm 198 nm ds AZtec LayerProbe Overview Measure layer
Lecture 6. Rapid Thermal Processing. Reading: Chapter 6
Lecture 6 Rapid Thermal Processing Reading: Chapter 6 (Chapter 6) Categories: Rapid Thermal Anneal (RTA) Rapid Thermal Oxidation (RTO) Rapid Thermal Nitridation (RTN) (and oxynitrides) Rapid Thermal Diffusion
Section 5: Thin Film Deposition part 1 : sputtering and evaporation. Jaeger Chapter 6. EE143 Ali Javey
Section 5: Thin Film Deposition part 1 : sputtering and evaporation Jaeger Chapter 6 Vacuum Basics 1. Units 1 atmosphere = 760 torr = 1.013x10 5 Pa 1 bar = 10 5 Pa = 750 torr 1 torr = 1 mm Hg 1 mtorr =
Sciences and Analyses of Materials Department Surface Treatment Unit Centre de Recherche Public Gabriel Lippmann Belvaux - Luxembourg
Sciences and Analyses of Materials Department Surface Treatment Unit Centre de Recherche Public Gabriel Lippmann Belvaux - Luxembourg Surface Treatment Unit, UTS BRIEF history : 2006 2009 : launched of
Electrical Characterization with SPM Application Modules
Electrical Characterization with SPM Application Modules Metrology, Characterization, Failure Analysis: Data Storage Magnetoresistive (MR) read-write heads Semiconductor Transistors Interconnect Ferroelectric
Hong Young Chang Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea
Hong Young Chang Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea Index 1. Introduction 2. Some plasma sources 3. Related issues 4. Summary -2 Why is
Nanostructure. Materials Growth Characterization Fabrication. More see Waser, chapter 2
Nanostructure Materials Growth Characterization Fabrication More see Waser, chapter 2 Materials growth - deposition deposition gas solid Physical Vapor Deposition Chemical Vapor Deposition Physical Vapor
vacuum analysis plasma diagnostics surface science gas analysis
Hiden EQP Systems High Sensitivity Mass and Energy Analysers for Monitoring, Control and Characterisation of Ions, Neutrals and Radicals in Plasma. vacuum analysis surface science gas analysis plasma diagnostics
Ultra-High Vacuum Technology. Sputter Ion Pumps l/s
Ultra-High Vacuum Technology 30-400 l/s 181.06.01 Excerpt from the Product Chapter C15 Edition November 2007 Contents General General..........................................................................
Visualizing the bi-directional electron transfer in a Schottky junction consisted of single CdS nanoparticles and a planar gold film
Electronic Supplementary Material (ESI) for Chemical Science. This journal is The Royal Society of Chemistry 2017 Electronic Supplementary Information Visualizing the bi-directional electron transfer in
The effect of self-absorption in hollow cathode lamp on its temperature
Plasma Science and Applications (ICPSA 2013) International Journal of Modern Physics: Conference Series Vol. 32 (2014) 1460349 (9 pages) The Author DOI: 10.1142/S2010194514603494 The effect of self-absorption
Chemie en Technologie van Materialen (Materials Science and Technology)
ST module 8b Chemie en Technologie van Materialen (Materials Science and Technology) 2018-19 201600135 Module coordinator: dr.ir. Evert Houwman Chemie en Technologie van Materialen Materials Science and
Hiden Analytical Ltd
www.hidenanalytical.com Hiden Analytical Ltd Company profile Hiden Analytical Ltd - Company headquarters based in 23,000sqft factory in Warrington, England - Privately owned - 70 employees work out of
PHI. Scanning XPS Microprobe
PHI Scanning XPS Microprobe Unique Scanning XPS Microprobe X-ray photoelectron spectroscopy (XPS/ESA) is the most widely used surface analysis technique and has many well established industrial and research
Introduction to Photolithography
http://www.ichaus.de/news/72 Introduction to Photolithography Photolithography The following slides present an outline of the process by which integrated circuits are made, of which photolithography is
Hiden EQP Applications
Hiden EQP Applications Mass/Energy Analyser for Plasma Diagnostics and Characterisation EQP Overview The Hiden EQP System is an advanced plasma diagnostic tool with combined high transmission ion energy
MOS Transistor Properties Review
MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO
LABORATORY of ADVANCED MATERIALS and MICRODEVICES. Prospects and Plans. N. Martirosyan
LABORATORY of ADVANCED MATERIALS and MICRODEVICES Prospects and Plans N. Martirosyan Topics Categorization of Advanced/Smart Materials High-Temperature Synthesis of Complex Materials Ceramic-Based Devices
INTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL
INTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL Prof. Mark J. Kushner Department of Electrical and Computer Engineering 1406 W. Green St. Urbana, IL 61801 217-144-5137 mjk@uiuc.edu http://uigelz.ece.uiuc.edu
A DIVISION OF ULVAC-PHI. Quantera II. Scanning XPS Microprobe
A DIVISION OF ULVAC-PHI Quantera II Scanning XPS Microprobe X-ray Photoelectron Spectroscopy (XPS/ESCA) is the most widely used surface analysis technique and has many well established industrial and
THE PROPERTIES OF THIN FILM DIELECTRIC LAYERS PREPARED BY SPUTTERING
THE PROPERTIES OF THIN FILM DIELECTRIC LAYERS PREPARED BY SPUTTERING Ivana BESHAJOVÁ PELIKÁNOVÁ a, Libor VALENTA a a KATEDRA ELEKTROTECHNOLOGIE, ČVUT FEL, Technická 2, 166 27 Praha 6, Česká republika,
Secondary Ion Mass Spectroscopy (SIMS)
Secondary Ion Mass Spectroscopy (SIMS) Analyzing Inorganic Solids * = under special conditions ** = semiconductors only + = limited number of elements or groups Analyzing Organic Solids * = under special
OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626
OPTI510R: Photonics Khanh Kieu College of Optical Sciences, University of Arizona kkieu@optics.arizona.edu Meinel building R.626 Announcements HW#3 is assigned due Feb. 20 st Mid-term exam Feb 27, 2PM
Effect of Spiral Microwave Antenna Configuration on the Production of Nano-crystalline Film by Chemical Sputtering in ECR Plasma
THE HARRIS SCIENCE REVIEW OF DOSHISHA UNIVERSITY, VOL. 56, No. 1 April 2015 Effect of Spiral Microwave Antenna Configuration on the Production of Nano-crystalline Film by Chemical Sputtering in ECR Plasma
Chapter 10. Nanometrology. Oxford University Press All rights reserved.
Chapter 10 Nanometrology Oxford University Press 2013. All rights reserved. 1 Introduction Nanometrology is the science of measurement at the nanoscale level. Figure illustrates where nanoscale stands
Discover the Difference
M-2000 Discover the Difference Focused M-2000 The M-2000 line of spectroscopic ellipsometers is engineered to meet the diverse demands of thin film characterization. An advanced optical design, wide spectral
Materials Science. Hand axes like this one found in the United Arab Emirates indicate humans left Africa 125,000 years ago.
Summary Materials Science Ion Beam Analysis (IBA) @ 3 MV Tandetron TM Accelerator Rutherford Backscattering Spectrometry (RBS) Elastic Recoil Detection (ERD) Nuclear Reaction Analysis (NRA) Ion implant/channeling
GEM-based gaseous Photomultipliers for UV and visible photon imaging. Dirk Mörmann Amos Breskin Rachel Chechik Marcin Balcerzyk Bhartendu Singh
GEM-based gaseous Photomultipliers for UV and visible photon imaging Dirk Mörmann Amos Breskin Rachel Chechik Marcin Balcerzyk Bhartendu Singh Gaseous Photomultiplier State of the art: Advantages: large
Instrumentation and Operation
Instrumentation and Operation 1 STM Instrumentation COMPONENTS sharp metal tip scanning system and control electronics feedback electronics (keeps tunneling current constant) image processing system data
Introduction. Photoresist : Type: Structure:
Photoresist SEM images of the morphologies of meso structures and nanopatterns on (a) a positively nanopatterned silicon mold, and (b) a negatively nanopatterned silicon mold. Introduction Photoresist
White Paper Adhesives Sealants Tapes
Fundamental principles of UV reactive manufacturing processes Introduction While the UV systems technology and the appropriate chemistry have been developing continuously, the principle of irradiation
Some more equations describing reactive magnetron sputtering.
Some more equations describing reactive magnetron sputtering D. Depla, S. Mahieu, W. Leroy, K. Van Aeken, J. Haemers, R. De Gryse www.draft.ugent.be discharge voltage (V) 44 4 36 32 28..5 1. 1.5 S (Pumping
a. An emission line as close as possible to the analyte resonance line
Practice Problem Set 5 Atomic Emission Spectroscopy 10-1 What is an internal standard and why is it used? An internal standard is a substance added to samples, blank, and standards. The ratio of the signal
Alex Samarian School of Physics, University of Sydney, NSW 2006, Australia
Alex Samarian School of Physics, University of Sydney, NSW 2006, Australia What is Dusty (Complex) Plasma? Laboratory Dusty Plasma Why Study Complex (Dusty) Plasma? Worldwide Research Activities Complex
Powering Big Data and the IoT s
Powering Big Data and the IoT s a great challenge and an even greater opportunity for materials efficiency using low cost perovskite solar cells Reinhold H. Dauskardt (dauskardt@stanford.edu) by 2020,
PHYSICAL VAPOR DEPOSITION OF THIN FILMS
PHYSICAL VAPOR DEPOSITION OF THIN FILMS JOHN E. MAHAN Colorado State University A Wiley-Interscience Publication JOHN WILEY & SONS, INC. New York Chichester Weinheim Brisbane Singapore Toronto CONTENTS
Coatings for CO Laser Optics
Coatings for CO Laser Optics ULO Optics is the leading European manufacturer of CO laser optics, a position it has held for more than two decades. The optics manufactured by ULO Optics are often used in
Research on the winding control system in winding vacuum coater
Acta Technica 61, No. 4A/2016, 257 268 c 2017 Institute of Thermomechanics CAS, v.v.i. Research on the winding control system in winding vacuum coater Wenbing Jin 1, Suo Zhang 1, Yinni Jin 2 Abstract.
Modern Methods in Heterogeneous Catalysis Research: Preparation of Model Systems by Physical Methods
Modern Methods in Heterogeneous Catalysis Research: Preparation of Model Systems by Physical Methods Methods for catalyst preparation Methods discussed in this lecture Physical vapour deposition - PLD
Plasma Route to Nanosciences and Nanotechnology Frontiers
J. Plasma Fusion Res. SERIES, Vol. 8 (2009) Plasma Route to Nanosciences and Nanotechnology Frontiers M.P.SRIVASTAVA Department of Physics and Astrophysics, University of Delhi, Delhi -110007, INDIA (Received:
Magnetron Sputter Coater Design Software. The most important thing we build is trust. Probe and perfect magnetron design with Opera
Magnetron Sputter Coater Design Software The most important thing we build is trust Probe and perfect magnetron design with Opera Magnetron Sputter Coater Design Software Accelerate and optimize your design
Etching Issues - Anisotropy. Dry Etching. Dry Etching Overview. Etching Issues - Selectivity
Etching Issues - Anisotropy Dry Etching Dr. Bruce K. Gale Fundamentals of Micromachining BIOEN 6421 EL EN 5221 and 6221 ME EN 5960 and 6960 Isotropic etchants etch at the same rate in every direction mask
Thermo Scientific K-Alpha + XPS Spectrometer. Fast, powerful and accessible chemical analysis for surface and thin film characterization
Thermo Scientific K-Alpha + XPS Spectrometer Fast, powerful and accessible chemical analysis for surface and thin film characterization X-ray Photoelectron Spectroscopy Quantitative, chemical identification
Effects of Ligand on the Absorbance and Transmittance of Chemical Bath Deposited Zinc Sulphide Thin Film
Available online at www.pelagiaresearchlibrary.com Advances in Applied Science Research, 2012, 3 (5):2821-2825 ISSN: 0976-8610 CODEN (USA): AASRFC Effects of Ligand on the Absorbance and Transmittance
Dr. OligoTM DNA / RNA / OLIGO SYNTHESIZERS
Dr. OligoTM DNA / RNA / OLIGO SYNTHESIZERS High Throughput Oligo Synthesis Synthesize Cleave Deprotect Desalt Elute Dr. Oligo TM The Dr. Oligo TM High Throughput Oligo Synthesizer is available in four
Thermal Resistance Measurement
Optotherm, Inc. 2591 Wexford-Bayne Rd Suite 304 Sewickley, PA 15143 USA phone +1 (724) 940-7600 fax +1 (724) 940-7611 www.optotherm.com Optotherm Sentris/Micro Application Note Thermal Resistance Measurement
Small-molecule OPV: From the Lab to Roll-to-Roll Production. Company Presentation 1
Small-molecule OPV: From the Lab to Roll-to-Roll Production Company Presentation 1 Organic solar cells + - Metal contact 100nm 1g/m² Organic semiconductor layers 250nm transparent contact (TCO) 100nm Substrate
2D Materials for Gas Sensing
2D Materials for Gas Sensing S. Guo, A. Rani, and M.E. Zaghloul Department of Electrical and Computer Engineering The George Washington University, Washington DC 20052 Outline Background Structures of
Combinatorial Heterogeneous Catalysis
Combinatorial Heterogeneous Catalysis 650 μm by 650 μm, spaced 100 μm apart Identification of a new blue photoluminescent (PL) composite material, Gd 3 Ga 5 O 12 /SiO 2 Science 13 March 1998: Vol. 279
National Academy of Sciences of Ukraine. Athens, 10 April 2008
National Academy of Sciences of Ukraine Athens, 10 April 2008 Proposals of Ukrainian Institutions in Physics Growth technology Fabrication technology Devices & Equipment Characterization and diagnostic