Concertation Meeting

Transcription

1 Concertation Meeting Brussels, 20 th October 2010 Alfredo de Rossi (Project Coordinator) Thales Research and Technology (TRT) Eric Larkins (Technical Manager) The University of Nottingham

2 THE CONSORTIUM THALES Research and Technology [FR] The University of Nottingham [UK] CNRS LPN [FR] CNRS Foton [FR] DTU Fotonik [DK] Università di Ferrara [IT] U2t [DE] THALES Systèmes Aéroportés [FR]

3 Copernicus Vision Silicon CMOS chips integrated onto an Photonic Integrated Circuit Critical (high-speed and low-power) signal processing at the optical level Seamless optical communication at all levels CMOS Optical processing unit CMOS CMOS Optical Fibre optical data links (OTDM, >100 Gb/s) Optical Backplane

4 Objectives of COPERNICUS (1/2) 5? µm m 250 nm Bit streams λ 1, λ 2, λ 3, λ 4 Compact Photonic Circuits based on Photonic Crystal Slab Compact 100G WDM receiver Key optical function: wavelength demux & detection (PIC) Drop Filter Photodetector CMOS electronics Size of the receiver chip will be ~ mm^2 Integration with electronics (TIA) and packaging λ 4 λ 3 λ 2 λ 1

5 Technological implementation Benefits of Photonic Crystals Extreme compactness: e.g. drop filter ~ 10 x 10 µm 2 Ultra-low Power required for EO and all-optical interaction (< 100fJ) wavelength selectivity (Q = 10 3 to 10 6 ) <4 psswitching time Why? Optical confinement is extremely efficient: Q/V ratio is very high Moreover, there are almost infinite degrees of freedom in design What about losses? propagation loss <1 db/mm (1 mm is the size of the PIC) PhC to fibercoupling loss ~ 3dB (<1dB with polymer taper, e.g. NTT, IBM)

6 Technological Challenges and solutions CHALLENGES Drop Filter: drop efficiency, channel isolation Photonic Circuits Integration fast and sensitive Photodetectors Packaging SOLUTIONS Use slab PhC technology (large Q, low-loss) Use of optimization topology and massive 3D modelling Use ultra-fast waveguide PDs concepts Packaging technology of a U2t Photonics

7 Objectives of COPERNICUS (2/2) All-optical monolithic OTDM receiver Bit stream λ s λ s λ s λ s Optical control λ c bit 3 Optical control λ c bit 2 Optical control λ c bit 1 bit 0 Optical control λ c CHALLENGES ADDRESSED OBJECTIVES Demultiplexing of >100Gb/s data stream Reduced consumption Compactness The All-Optical control enables ps response time, however: May require considerable amount of power (laser sources) May require uncommon/unpractical materials Heat management, synchronisation, etc etc

8 OTDM receiver: key technology Cavity 2.5 µm cavity.pdf COPERNICUS 2010 Thales PhC an ENABLING TECHNOLOGY Very small cavity volume ~ 100fJ/pulse Faster carrier dynamics ~ < 4ps On/Off

9 Industrial exploitation perspective: WDM Receiver In June 2010 the IEEE ratified various 40Gbps and 100Gbps Ethernet standards. Huge CFP form factoris due to the use of discretecomponents, power consumption and the CAUI interface. Pictures from Opnext shown during IEEE Meeting in Genever May 2010

10 100G Port density With the current CFP MSA port density will be reducedcompared to 10GE Customers are very unhappywith this solution and prefer a QSFP-alike form factor. TODAY Possible with COPERNICUS 2016 Market ~ 200 M Slide from Brocade shown during Ethernet Alliance Technology Exploration Forum in September 09

11 Possible cooperation within the cluster In the future, Copernicus might also provide new building blocksfor the III-V fabrication platform which will be tested in the PARADIGM project Copernicus might benefit from the solutions for integration of III- V PIC with CMOS (projects Historic and Helios) The DeLight project is aiming at a 100G compact transmitter That technology will be compatible with that developed by COPERNICUS