Effect of Filler Surface Modification on the Dielectric Properties of High-k Composite Materials
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1 Effect of Filler Surface Modification on the Dielectric Properties of High-k Composite Materials Lanla Yilla, Jiongxin Lu, C. P. Wong School of Materials Science & Engineering NSF Packaging Research Center Georgia Institute of Technology
2 Introduction Embedded passives Surface Mount Device (BGA/CSP/FC) Copper Layer Dielectric Layer Embedded Capacitors Embedded Resistors Micro Via Embedded Inductors Materials prerequisites High dielectric constant (K) ε A C 0 ε = r t Low dielectric loss PCB compatible: Low process temperature (<200 ºC)
3 Materials for embedded capacitors Ceramic materials e.g. BLC (boundary layer capacitors) and MLCC (multilayer ceramic capacitors) Ceramic-metal metal composites e.g. BaTiO3-Ni Polymer-ceramic composites e.g. BaTiO 3 /epoxy Polymer-conductive filler composites e.g. Ag/epoxy All-organic composites e.g. PANI/PU, PANI/epoxy
4 Polymer-conductive filler composites conductor-insulator percolative system as high-k materials Scaling theory Advantage Ultra-high dielectric constant Lower filler loading Balanced mechanical properties including high adhesion strength Disadvantage High dielectric loss Narrow processing window
5 Objectives Control the dielectric loss of polymer-conductive filler composites by modifying the properties of conductive filler Study the effect of carbon black surface treatment with inorganic coating on the dielectric behavior of ultrahigh k carbon black composites. Investigate the filler surface treatment on the dielectric properties of polymer-conductive filler composites
6 Approaches Core-shell structure Organic/Inorganic Shell Metal Core Inorganic coating of carbon black particles Silane coupling agent treatment of metal nanoparticles
7 Effect of filler type Dielectric properties of metal/polymer composites containing 10 vol.% various types of conductive filler 10 khz) metal/polymer Ag/polymer Cu/polymer Ni/polymer K Df conductive the K and Df of Cu and Ni composites were both low due to the less conductive properties and thicker oxide layer. Ag as selected for further investigation since its highest conductivity ctivity could render the lower percolation threshold and thus lower filler loading to maintain better adhesion and mechanical properties of the composites.
8 Having a blast collecting Data
9 Filler treatment
10 Thermal properties 20 wt.% 152 o C 40 wt.% o C 94.5 o C Temperature ( o C) 74.3 o C Temperature ( o C) Ag/polymer composites silane coupling agent treated Ag/polymer composites
11 Effect of filler loading K Df filler loading (wt.%) -1.0 Dielectric properties of Ag/polymer composites with various filler loadings (@ 10 khz)
12 Effect of filler loading Dielectric properties of silane coupling agent treated Ag/polymer composites with various filler loadings 10 khz)
13 Effect of processing method K SD K Df SD Df 10% % Improved processing method K SD K Df SD Df 10% %
14 Summary Surface modification of inorganic coating provide the carbon black particles completely new characteristics. Similarly, silane coupling agent treatment of Ag nanoparticles could also Improved processing method could render better film uniformity and thus more consistent data in dielectric study. Thinner film achieved using spin-coating method could increase the capacitance density. Thinner thickness and lower content of inorganic coatings are expected to improve the dielectric constant of the composites.
15 Future work Try to achieve the ideal thickness and content of inorganic/organic nic coating on the fillers to balance the dielectric properties. Other electrical property study such as leakage current and breakdown voltage.
16 The Greatest and most wonderful Mentor
17 Acknowledgements Sincere thanks and gratitude to Jiongxin Lu for all her help Thanks to Dr. Wong for allowing me the previledge to work with his team Thanks to Jack for pairing me with Justin ( (Jiongxin) Thanks for making me feel welcome all group members
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