1. Features of Ceramic LED PKG

Transcription

1 Ceramic LED PKG

2 1. Features of Ceramic LED PKG Compactness Compactness (Small, (Small, Low Low profile) profile) High High Reliability Reliability Good Good Thermal Thermal Properties Properties Surface Surface Mountable Mountable Pb PbFree (RoHS (RoHSCompliant) Design Design can can be be changed changed easily easily --Module Module type type available available Comparison Comparison of of Material Material characteristics characteristics of of Ceramic Ceramic and and Resin Resin (PPA) (PPA) Thermal Conductivity Thermal Expansion Coefficient Size Cost Dimension Accuracy Ceramic PPA

3 2. Ceramic Material Properties Ceramic PPA Color White White Dielectric Constant 7~ Thermal Conductivity (W/mK) 2~4 > 50 (with thermal via, Ag)* 0.47 Thermal Expansion Coefficient (CTE) 5~6(x10-6 /K) 10~25x10-6 /K Mechanical Strength > 200MPa > 190MPa Specific gravity 3.0± The The above values are are typical values. * In In case case of of thermal conductivity, the the value can can vary vary by by the the design of of LED LED PKG PKG with with thermal via. via. (50~max W/mK, refer refer to to Appendix of of this this Brochure)

4 3. Manufacturing Process Sheet casting Sheet punching Printing Coating Stacking Cutting Firing Breaking

5 4. Exploded Diagram Standard (open-tool) High Power Flash Type Thermal Via * World s World s First First Ceramic Ceramic and and Silver Silver Metal Metal Hybrid Hybrid Type Type Ceramic * Thermal Thermal Via Via Diameter :: 1.5~2.0mm (5x5 (5x5 size), size), the the larger larger thermal thermal via via diameter diameter is is possible possible (PKG (PKG size size consideration) The The material material of of electrode, reflector, via via and and thermal thermal via via is is pure pure silver(ag).

6 5. Design Rule Standard Standard High High Power Power ΘΘ Heat Sink Typical Special 1 A Block Customer (>14mil) 12mil 2 B Block 2~4mil - 3 C Block Customer (>14mil) 12mil 4 PAD Spacing > 8mil 4mil 5 Internal via to part etch 10mil 5mil 6 Via pitch (Thermal via) 3x Via Dia 1.8x Via Dia 7 Cavity angle (Θ) 60~90 degree 50 degree 8 Internal via diameter 8~80mil (Heat Sink, 5x5 size) > 80mil possible (PKG Size Consideration)

7 6. Figure of PKG Standard High High Power Power Type I Type II Type III

8 High Power PKG TYPE_3 TYPE_2 TYPE_1

9 7. Open-Tool Dimension 4x4 Size 5x5 Size

10 8. Reliability Test Item Test Condition Requirement No Result Vibration Frequency : Hz Direction : x, y, z Time : 2hr No Mechanical Damage Inspect with Scope 10ea OK Thermal Shock 100 cycle (-40 *20min 85 *20min) No Mechanical Damage Inspect with Scope 10ea OK Reflow Soldering Preheat Temp : 150 Preheat Time : 1min. Solder Temp : 230±10 Soldering Time : 10sec (max.) Inspect with Scope 10ea OK Wire Bondability Au Wire Temp 160 ( Au Wire 1mil) Pull Strength : >3gr 10ea OK

11 9. Thermal Analysis Thermal Resistance of of various products Product Ceratech Type I (5x5) Ceratech Type II (5x5) Rth (only PKG, T3Ster) 5~6K/W 9~10K/W Remark > 1.30K/W* Ceratech Type III (5x5) LumiLEDs 9~10K/W 4K/W Same Test Condition * Calculated value --resulted from from ultra ultra small Substrate thickness (World s Shortest Thermal Path) Rth = L K A Type I

12 9. Thermal Analysis 1 e T3 Ste r Ma s te r: d iffe re n tia l s tru ctu re fu n ctio n (s ) R th Measurement : T3Ster (in Oil Bath) K [W2s/K2] K[W2s/K2] K[W2s/K2] chip Die attach Result from low thermal conductivity of applied silicone die bond (0.5W/mK) package Oil Type I Ceratech LED Type III Ceratech LED Type II Ceratech LED 1 e -4 1 e RRth [K/W] ] R th th : 5~6K/W (only PKG, Type I) PKG Designer can result in best efficiency from CTC Type I (LED chip, Ag Epoxy and Silicone die bond, etc. must be considered for Rth(j-a))

13 10. Thermal Expansion TMA TMA Curve Curve (Type (Type I) I) TMA TMA Data Data Coefficient of thermal expansion (CTE, x10-6 /K) Ceramic Only Type I (Ceramic+Metal) CTE of the Type I is very similar to the value of the LED substrate (ex. GaN 5.5ppm) Highly Reliable for the Thermal Stress

14 11. Appendix Thermal Via Via Metal Metal Coverage-sensitivity Study Study Description Peak Stage Temp. ( ) Thermal Resistance ( /W) A No Silver Paste-filled thermal via B 25 thermal vias 150 μm diameter each C D 14 thermal vias 250 μm diameter each Silver-paste filled thermal via Covering 100% the die area Similar to Ceratech Test Data by T3Ster *. V. A. Chiria, Thermal Assessment of RF Integrated LTCC FEM, International Society Conference on Thermal Phenomena, 520~527 (2002)

15 11. Appendix Thermal Conductivity of of various materials (Ag) (Ag) (Au) (Au) ** Refer Refer to to the the data data of of Dupont Dupont