Thin Film Passive Components

Transcription

1 Thin Film Passive Components TECDIA Co., Ltd OCT) B-28-

2 Table of Contents Single Layer Capacitors Table of Contents P General Features P Single Layer Capacitors P2 Single Layer Capacitors Design Styles P2 Single Layer Capacitors Dielectric Specifications P2 Screening P3 Typical Characteristics P4 Single Layer Capacitors Type A (Class I & Class II / Class IV) P P6 Single Layer Capacitors Type B (Class I & Class II) P7 Application Notes P8 Single Layer Capacitors Type C (Class I & Class II / Class IV) P9 P Rectangular Capacitors P Binary Capacitors P2 Gap capacitors P2 Row Capacitors P3 Integrated Resistor-Capacitors (IRC ) P4 Thin Film Chip Resistors P Ground Blocks P6 Hybrid Ceramic Technologies / Thin Film Ceramic Substrates P7 Single Layer Capacitors Options P8 Packaging P8 Designs Tecdia Chip Capacitors are normally constructed as square chips for single values and binary capacitor arrays, and in rectangular shapes for capacitor row arrays and custom designs. Tecdia uses variations in chip thickness (by lapping), as well as electrode/ceramic size and dielectric constant to construct capacitors. This permits a broad range of capacitance values to be manufactured with various form factors and designs. Tecdia has a long history of manufacturing capacitors with bare ceramic margins around the periphery of the electrodes, and has the expertise to produce them in its full range of sizes and values. The borders help prevent short circuits (arcing at the chip edges) after die attachment, especially with conductive epoxy. The design also reduces damage to the electrode when handling with tweezers, and facilitates visual recognition for automated pick and place assembly processes. Single Layer Capacitors Design Styles General Features Type A Border Electrode Fully Metallized Type B Border Electrode Border Electrode Type C Fully Metallized Fully Metallized Ceramic Dielectric Tecdia produces over 9% of the ceramic wafers used to manufacture its capacitors, using fine ceramic powders consisting of unique titanate formulations and proprietary firing processes. A variety of dielectrics are produced from these formulations, covering a range of dielectric constant (K) values, temperature characteristics (TC), and other properties. The products included in this catalog fall within the industry standard dielectric classes I & II. Tecdia also produces EIA class IV single layer ceramic chip capacitors using Grain Boundary Barrier Layer (GBBL) technology Electrode Metallization The sintered wafers are lapped and polished to produce smooth, flat surfaces onto which metal is deposited using dry (sputtering) metallization processes to produce electrodes with ultra-low loss at microwave and millimeter-wave frequencies, and enable reliable thermocompression attachment of gold wires. Metallization Type Applicable Metals Purpose Diffusion Prevention Layer Adhesion Layer TaN TiW or Ti Stop Ti from diffusing Used as resistive material for Integrated Resistor-Capacitor and Thin Film Chip Resistor Create strong bond between metal and ceramic Single Layer Capacitors Dielectric Specifications EIA Class* Tecdia Dielectric Material Code P 4 7 F C 2 Dielectric Constant (Nominal) ,6 2,8 6, 3,, Dissipation 2 C MHz MHz MHz MHz < khz < khz < khz < khz < khz Insulation 2 C 6 MΩ 6 MΩ 6 MΩ MΩ * MΩ MΩ 4 MΩ 4 MΩ 4 MΩ EIA TC Code* 2 CG S2H U2J M3K X7R X7R X7S X7S X7S Temperature Characteristics ± 3 ppm / C - ± 6 ppm / C -7 ± ppm / C - ± 2 ppm / C ± % ± % ± 22% ± 22% ± 22% Temperature Range - C to +2 C - C to +2 C - C to +2 C - C to +2 C - C to +2 C - C to +2 C - C to +2 C - C to +2 C - C to +2 C Barrier Layer Conductive Layer Pt Au Protect adhesion layer during solder attach Wire bondable, high conductivity layer Note : Minimum 6 2 C is available by special order. Note 2: See EIA-98--F. Environmental Coitment Tecdia's environmental policy is published on our website: Our manufacturing facilities are ISO 4 certified. All our capacitors are RoHS2 compliant. 2

3 Screening Typical Characteristics Tecdia's capacitors are designed and manufactured for a wide range of applications from high volume coercial counication systems to flight and space programs with stringent quality and performance requirements. The same production processes are used for all our capacitors, whether used for "High Reliability", industrial or coercial applications. However, selection and screening criteria may vary based on procurement requirements. The screening of capacitors falls within three categories: Standard Grade, Coercial Grade, and Custom. Typical Temperature Characteristics (Class I) K=4 Typical Temperature Characteristics (Class II) K=,6 Regular Scheduled Screening For Single Layer Capacitors Visual Electrical Characteristics Visual Inspection Capacitance Dissipation Factor (DF) Insulation Resistance (IR) Dielectric Withstanding Voltage (DWV) Quantity Inspected Inspection Lot AQL II. Inspection Lot AQL II. Inspection Lot AQL II. pcs per Wafer Lot*¹ pcs per Wafer Lot Inspection Lot AQL II. Inspection Lot AQL II. Inspection Lot AQL II. *¹ Allowable Failures Capacitance Change (%) - - K=9 K=4 K=28 Capacitance Change (%) K=2,8 Mechanical Wire Pull 3 pcs per Wafer Lot - -3 High Temperature Dimension Check 4 C For min. Measurement of Capacitor Dimensions pcs per Wafer Lot*² 3 pcs per Wafer Lot *² Temperature ( C) Temperature ( C) *¹ Inspection Lot AQL I (.%) is applied for Class IV products. *² Not applicable for class IV products. Typical Temperature Characteristics (Class IV) Typical Aging Characteristics Test Lab Capabilities Parameter Temperature Cycling Thermal Shock Voltage Conditioning Capacitance & DF IR DWV Bond Pull Die Shear Temperature Coefficient Limits Test Condition MIL-STD-883 / Method Cond. A / B / C MIL-STD-22 / Method 7 Cond. A / B / F MIL-STD-883 / Method Cond. A / B / C / F MIL-STD-22 / Method 3 MIL-STD-22 / Method 32 MIL-STD-22 / Method 3 MIL-STD-883 / Method 2 Cond. D MIL-STD-883 / Method 29 less than 3 kg EIA-98 / Method Capacitance Change (%) Temperature ( C) K=6, K=3, K=, Capacitance Change (%) ,, Time (Hrs) K=,6 K=2,8 K=6, K=3, K=, Iersion MIL-STD-22 / Method 4 Resistance to Solder Heat MIL-STD-22 / Method 2 Cond. A / B / C / D Moisture Resistance Life Humidity (Steady State) MIL-STD-22 / Method 6 MIL-STD-22 / Method 8 less than or equal C MIL-STD-22 / Method 3 Typical DC Bias Characteristics Class I Typical Resonance Frequency (GHz) Class I,II Constant Acceleration MIL-STD-883 / Method 2 Cond. A / B / C / D / E / F / G / H / Y Vibration MIL-STD-22 / Method 2 Vibration, High Frequency MIL-STD-22 / Method 24 Cond. A / B / C / D Vibration, Variable Frequency MIL-STD-883 / Method 27 Cond. A For more information on proper components use, visit our website. Tecdia may, at its discretion, with or without notice and without liability to Tecdia, suspend sales of the products and/or revise product information from that wich is published in the Catalog (B-28-) Capacitance Change (%) K=,6 K=2,8 K=6, (6 mil-t) K=6, ( mil-t) K=3, (6 mil-t) K=3, ( mil-t) K=, (6 mil-t) Resonance Frequency (GHz) Class IV ( mil-t) Class IV (6 mil-t) ,, Voltage (Vdc) Capacitance (pf) 3 4

4 Single Layer Capacitors Type A Class I & Class II Class IV Class I and II single layer capacitors with a border on the top electrode to aid with visual recognition and to prevent shorting due to epoxy creep up. High dielectric constant GBBL capacitors with a border on the top electrode to aid with visual recognition and to prevent shorting due to epoxy creep up. TiW - Au, TaN - TiW - Au TiW - Pt - Au, TaN - TiW - Pt - Au Capacitance Code A : ±. pf* B : ±. pf* C : pf* J : % K : ± % V : - % / + % Z : - 2% / + 8% *Capacitance under. pf AMS Class I & II A Type Capacitor Code R :. pf R :. pf : pf : pf K 2 K Dielectric Class : Class I (K = 4-28) 2 : Class II (K =,6-2,8) TiW - Au, Ti - TiW - Au Ti - Pt- Au Class IV Capacitor Code SK: Legacy (4 um Au thickness) SKT: Standard (. um Au thickness) SKT A M A 6 A Type Capacitor Code : pf : pf 2 :, pf 3 :, pf Capacitance Code M : ± 2% V : - % / + % Z : - 2% / + 8% Surface Finish A: As Fired Thickness Code 6 : 6 (. ) : (.2 ) Dielectric Material Code : K = 6, : K = 3, 2 : K =, R R2 R3 R4 R R6 R8 R R2 R R8 2R2 2R7 3R3 3R9 4R7 R6 6R8 8R B.2.2 C F H.. K P R.. S.2.2 T K = 4 K = 9 K = 4 K = 28 K =,6 K = 2,8 Class I Class II Thickness: 6 ± mil (. ±.2 ),,2,,8 2,2 2,7 3,3 3,9 4,7,6 6,8 8,2,,,2,,8 2,2 2,7 3, ± ±. ± ± Thickness: ± mil (.2 ±.2 ) Dielectric Material Rated Working Voltage ± ± ± ±.. Thickness K = 6, K = 3, 6 V 6 V V ± ±.7.7 K =, V - Class IV Class IV 6

5 Single Layer Capacitors Type B Class I & Class II Application Notes Class I and II single layer capacitors with borders on top and bottom electrode to aid with visual recognition, preventing shorting due to epoxy creep up, and possessing top-bottom syetry. TiW - Au, TaN - TiW - Au TiW - Au, TaN - TiW - Au Capacitance Code A : ±. pf* B : ±. pf* C : pf* J : % K : ± % V : - % / + % Z : - 2% / + 8% *Capacitance under. pf BMS Class I & II B Type Capacitor Code R:. pf R :. pf : pf : pf K 2 K Dielectric Class : Class I (K = 4-28) 2: Class II (K =,6-2,8) Tecdia s SLCs are used in a variety of devices in the optical and RF market including, but not limited to, Microwave/Optical Transceivers Synthesizers, Oscillators and other signal generators TOSA/ROSA/BOSA (Transmit/Receive/Bidirectional Optical Sub-Assemblies) Microwave/Optical Amplifiers and Modulators High Frequency Signal and RF Measurement Equipment B.2.2 C F H.. K P R.. S.2.2 T In these devices SLC function can be suarized into the 3 categories; DC Block, High..2 R R2 Frequency Bypass and Impedance Matching..3 R R4 R R6 DC Block R8 R R2 R R8 2R2 In the DC Block application, the chip capacitor is placed in series in a circuit to prevent the DC bias voltage from one circuit from affecting another. The capacitance is chosen so that the capacitor approximates a short at the frequency of interest R R3 3R9 4R7 R6 6R8 8R2 2 8 Class I Class II High Frequency Bypass In the High Frequency Bypass application, the chip capacitor is placed in shunt (ground) within a circuit to remove high frequency noise or signals by shorting them to ground. The capacitance is chosen such that high frequencies see a low impedance path to ground, while the DC bias voltage or lower frequency signals see a high impedance path to ground and can hence continue along the circuit with minimal attenuation. Impedance Matching The Impedance Matching application uses a chip capacitor to provide a specific reactance in a circuit to achieve the desired impedance. These capacitors can be used in numerous lumped circuits to minimize reflections and maintain the signal when passing through elements/circuits of different impedances. 47 K = 4 K = 9 K = 4 K = 28 K =,6 K = 2,8 7 8

6 Single Layer Capacitors Type C Class I & Class II Class IV Class I and II single layer capacitors without border for solderability, top-bottom syetry, maximum capacitance density and decreased parasitics. Our most popular high dielectric constant GBBL capacitors for high capacitance density, lower cost decoupling/bypass applications. TiW - Pt - Au, TaN - TiW - Pt - Au TiW - Pt - Au, TaN - TiW - Pt - Au Capacitance Code A : ±. pf* B : ±. pf* C : pf* J : % K : ± % V : - % / + % Z : - 2% / + 8% *Capacitance under. pf CMS Class I & II C Type Capacitor Code R :. pf R:. pf : pf : pf K 2 FC Dielectric Class : Class I (K = 4-28) 2: Class II (K =,6-2,8) Ti - Pt - Au Ti - Pt - Au Thickness: 6 ± mil (. ±.2 ) Class IV Capacitor Code SK: Legacy (4 um Au thickness) SKT: Standard (. um Au thickness) C Type Capacitor Code SKT 4 C 2 M A 6 : pf : pf 2 :, pf 3 :, pf Capacitance Code V : - % / + % Z : - 2% / + 8% Surface Finish A: As Fired Thickness Code 6: 6 (. ) : (.2 ) Dielectric Material Code : K = 6, : K = 3, 2 : K =, R R2 R3 R4 R R6 R8 R R2 R R8 2R2 2R7 3R3 3R9 4R7 R6 6R8 8R BC.2.2 CC FC HC.. KC PC RC.. SC.2.2 TC K = 4 K = 9 K = 4 K = 28 K =,6 K = 2,8 Class I Class II,,2,,8 2,2 2,7 3,3 3,9 4,7,6 6,8 8,2, ± ±. Thickness: ± mil (.2 ±.2 ),,2,,8 2,2 2,7 3, ± ± Dielectric material Rated Working Voltage ± ± ± ±.. Thickness K = 6, K = 3, 6 V 6 V V V ± ±.7.7 K =, V - Class IV Class IV 9

7 Rectangular Capacitors Binary Capacitors GD JD LD Binary Capacitors are available in arrays with 3, 4 or electrodes that share a coon rear electrode, convenient for tuning the capacitance to be used in circuits. Tecdia has a range of high-aspect ratio rectangular capacitors available, popular for use in GaN matched transistor packages. TiW - Au, TaN - TiW - Au TiW - Pt - Au, TaN - TiW - Pt - Au, TiW Au, TaN TiW Au Class I & II Capacitor Code AMS : A Type BMS : B Type Capacitance Code J : % K : ± % M : ± 2% V : - % / + % Z : - 2% / + 8% AMS : pf : 2 pf 2: 2 pf K 3 TiW - Au, TaN - TiW - Au TiW - Pt - Au, TaN - TiW - Pt - Au, TiW - Au, TaN - TiW - Au Standard Parts Design Styles A: Type A B : Type B A Capacitance Code A : ±. pf * B : ±. pf * C : pf * K : ± % *Capacitance under. pf MB Binary Capacitor Code R7 B of the Largest Cap R7 :.7 pf R :. pf 3R: 3. pf 6R: 6. pf GD GD: 2 x 2 mil (. x. ) JD : 2 x 36 mil (. x.9 ) LD : 36 x 36 mil (.9 x.9 ) Dielectric Class : Class I (K = 4-28) Part Number of the Largest Cap Array Pad Capacitance (pf) () () Dielectric AMBR7BGD R7.7 /.3 /.8.. K = 4 Standard Parts BMBR7BGD AMBRKGD R7 R.7 /.3 /.8. /.7 / K = 4 K = 28 Part Number AMSK3 AMSK3 Capacitance (pf) 2 () t () t Dielectric K = 9 K = 9 RWV BMBRKGD AMBRKJD BMBRKJD AMB3RKJD BMB3RKJD R R R 3R 3R. /.7 /.38. /.7 /.38 /.9. /.7 /.38 /.9 3. /. /.7 / /. /.7 / K = 28 K = 4 K = 4 K = 28 K = 28 AMS4K3 AMS6K3 AMSK AMB3RKLD BMB3RKLD AMB6RKLD BMB6RKLD 3R 3R 6R 6R 3. /. /.7 /.38 /.9 3. /. /.7 /.38 /.9 6. / 3. /. /.7 / / 3. /. /.7 / K = 4 K = 4 K = 28 K = 28 AMS2K3 AMSK K = 4 Binary relationship is based on the relative sizes (surface area) of the electrodes within the array instead of the actual electrical values for the individual capacitors. Screeing Acceptance Procedures are based on measurements of the largest electrode pad only. AMSK6 AMS2K6 AMS24K6 AMS26K6 AMS3K K = 4 K = 9 K = 9 K = 9 Note : Manufactured to metric dimensions. Imperial units are for reference only. Note 2: Typical resonance frequency on page 4 does not apply to this product line. Gap Capacitors AG BG AMS3K AMS4K AMS4K AMSK If you have custom specifications you wish to satisfy then Tecdia can tailor the dimensions, dielectric constant, capacitance, TC and other options to match any particular die form factor you are using. Note : Manufactured to metric dimensions. Imperial units are for reference only. Note 2: Typical resonance frequency on page 4 does not apply to this product line. Gap Capacitors are constructed on a single rectangular chip, with two electrodes on the same surface providing a series connection when mounted array side down, eliminating bonding wire inductance. TiW - Au, TaN - TiW - Au TiW - Pt - Au, TaN - TiW - Pt - Au, TiW - Au, TaN - TiW - Au Design Styles A: Type A B : Type B A MG Gap Capacitor Code R B 2 AG Capacitance Code A : ±. pf * B : ±. pf * C : pf * K : ± % *Capacitance under. pf of Each Array Pad R:. pf R:. pf : pf 2 : 2 pf AG: 2 x 24 mil (.3 x.6 ) BG : 2 x 33 mil (. x.8 ) Dielectric Class 2: Class II (K =,6-2,8) Standard Parts Part Number of Each Array Pad Capacitance Mounted (pf) () () Dielectric AMGRB2AG R K = 2,8 BMGRB2AG R K = 2,8 AMGRK2AG R K =,6 BMGRK2AG R K =,6 AMGK2BG K =,6 BMGK2BG K =,6 AMG2K2BG K = 2,8 BMG2K2BG K = 2,8 Note : Manufactured to metric dimensions. Imperial units are for reference only. Note 2: Typical resonance frequency on page 4 does not apply to this product line. 2

8 Row Capacitors Integrated Resistor-Capacitors (IRC ) An array of 2 or more Type A capacitors onto a single chip for increased capacitance density, fewer components to place and optimal packing efficiency. TiW - Au, Ti - TiW - Au Ti - Pt - Au Class IV Capacitor Code SK: Legacy (4 um Au thickness) SKT: Standard (. um Au thickness) L2 SKT A N A 6 Number of Pads L2 : 2 pads L3 : 3 pads L4: 4 pads Surface Finish A: As Fired A Type Capacitor Code : pf : pf 2 :, pf Capacitance Code N: ± 3% Thickness Code 6: 6 (. ) Dielectric Material Code : K = 6, : K = 3, 2 : K =, Integration of a resistor onto a capacitor to form a single ceramic chip made with Tecdia s Class IV (K=6,) dielectric, decreasing BOM count and requiring one less wire bond. TaN - TiW - Au Ti - Pt - Au Thickness: ± mil (.2 ±.2 ) SKTR IRC Capacitor Code SK: Legacy (4 um Au thickness) SKT: Standard (. um Au thickness) A Type Capacitor Code 3 A : pf Capacitance Code Z : - 2% / + 8% V : - % / + % M A - 2 R K Surface Finish A: As Fired Dielectric Material Code : K = 6, Resistor Code Thickness Code : (.2) Resistance Code K : ± % Resistance Code : Ω : Ω Thickness: 6 ± mil (. ±.2 ) ±.3 2 Pads ± 4 ± 2..2 ± 4 ± ± 4 ± 4.. ± 6 ± ± 8 ± ±. ±. ±. ±. ±. ±. ±. ±. ±.2 ± Pads ± 4 ± ± ± 8 ± 4.2. ± 8 ± ± ± ±. ±. ±.2 ±. ±.2 ±. ±.2 ±. ± Pads ± 6 ± 2..2 ± 6 ± ± 8 ± ± ± ± 2 ± Resistance (Ω) Resistance Code ±. ±. ±. ±. ±.2 ±. ±. ±.3 ± * Capacitance tolerance V is not applicable. Dielectric Material Rated Working Voltage K = 6, V Temperature Charactristic of Resistance (TCR) - ppm / C (@ - C to + 8 C ) Resistor Rated Power < 7 C 7 < 8 C ** < 7 C **3 < 8 C Heat Resistance 32 C x mininutes N2 atmosphere Note : Manufactured to metric dimensions. Imperial units are for reference only. Note 2: Typical resonance frequency on page 4 does not apply to this product line. Note : Manufactured to metric dimensions. Imperial units are for reference only. Note 2: Typical resonance frequency on page 4 does not apply to this product line. Note 3: Electrical characteristics are measured between top and bottom electrodes only. No bias voltage should be applied between electrodes on top surface. Dielectric Material Rated Working Voltage K = 6, V K = 3, 6 V K =, V 3 4

9 Thin Film Chip Resistors Ground Blocks SA Series - 2 SA Series - 3 MB Series Wire-bondable chip resistors for biasing, RF line termination, and various other applications. Tecdia Ground Blocks are customizable conductive ceramic shims ideal for application within micro-assemblies in both optical and microwave industries. TaN - TiW - Au TiW - Pt - Au Resistor Type Code SAW : Resistor MBW: 2 Resistors SAW Resistance Code : Ω : Ω 2 :, Ω Resistance Code J : % K : ± % K 2A 2 Rated Power 2A: ma Thickness Code : (.2 ) H F : 6 x 6 (.4 x.4 ) H: 2 x 2 (. x. ) P : 3 x 3 (.8 x.8 ) HR: 2 x 4 (. x. ) : No Metallization : TiW - Pt - Au 2 : TiW - Pt Ti - Pt - Au Ti - Pt - Au TGB Ground Block Code 2 3 Length Code 2 :.2 :. :. Thickness Code Width Code 3 :.3 2:.2 :. :. 2:.2 Standard Parts Standard Parts Part Number Resistance (Ω) Resistance Code () () Configuration Part Number () t () t SAWK2A2H. x. TGB SAW2K2A2F x.4 TGB SAW2K2A2H 2 2. x. TGB SAWK2A2F x.4 TGB SAWK2A2H. x. TGB SAWK2A2HR TGB SAWK2A2P TGB 6... SAW7K2A2HR TGB SAWK2A2H. x. TGB SAWK2A2HR TGB2...2 SAW2K2A2H 2 2. x. SA Series - 2 SAW2M2A2H 2. x. SA Series - 3 MBW2K2A2P MB Series MBW2K2A2P MBWK2A2P MB Series MB Series Custom Part Design Guide MBW7K2A2P MBWK2A2P MB Series MB Series Parameter Specification Length: L.2-2. Temperature Charactristic of Resistance (TCR) - + / - ppm / C (@ - C to + 8 C) Width: W Thickness: t Resitor Rated Power < 7 C Resistivity 3 - Ωm nominal Heat Resistance 32 C x mininutes N2 atmosphere 6

10 Hybrid Ceramic Technologies Thin Film Ceramic Substrates HCT (Hybrid Ceramic Technologies) combines over 4 years of experience in ceramics, machining, wafer processing, and thin film metallization techniques into one group that specializes in build-to-print thin film metalized ceramic substrates. Features such as fine patterns, electrical wraps, thin film resistors and pre-deposited AuSn are all specialized for miniaturized high-speed counication devices. Single Layer Capacitors Options Predeposited AuSn AuSn (gold-tin solder) can be added to the metallization stack of any type A (top border only) or type C (no borders) Tecdia capacitors for easier and faster eutectic die attach process. Electrical Wrap AuSn Pre-Deposited Solder Pads Backside Gold No back side gold capacitors have no Au in the backside metallization stack. The absence of gold helps decrease overall costs, but makes the capacitor only compatible with epoxy attachment. Packaging Packaging Standard Packaging Material Color Waffle Pack ABS White / Natural 2 inch Alumina 99.6% or AlN 7 W/m*K TaN Thin Film Resistors Customized Packaging Waffle Pack* Material Conductive PC Color Black 2 inch Thickness:. - 3 Blue tape (w/ring) Blue tape (w/o Ring) PVC PVC Blue Blue 6 inch 7.87 inch *Please contact us if you have special requests for the tray pocket sizes. 7 8