Perform Solder Heat Resistance using three temperature profiles: 230 C, 260 C and 280 C. Summary Report PART DESCRIPTION LTMM S-D-RA
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1 Perform Solder Heat Resistance using three temperature profiles: 230 C, 260 C and 280 C. Summary Report PART DESCRIPTION LTMM S-D-RA File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 1 of 11
2 CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS l and ANSI/NCSL , as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 2 of 11
3 SCOPE Perform Solder Heat Resistance using three temperature profiles: 230 C, 260 C and 280 C. APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION. 1) Parts are visually inspected for cleanliness. File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 3 of 11
4 FLOWCHART TEST 260 C 280 C 230 C STEP GROUP D GROUP E Control 01 1 Pass 1 Pass 1 Pass Solder Heat Group Solder Heat Solder Heat Resistance A Resistance Resistance nd Pass Solder Heat 04 Resistance 05 3rd Pass Solder Heat Resistance 06 Group B Group C Solder Heat Resistance (Visual): Blistering, Distortion (Bowed or Twisted), Discoloration File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 4 of 11
5 ATTRIBUTE DEFINITIONS Following is a brief, simplified description of attributes. THERMAL PROFILE: 1) The Following Thermal Profile was used to stress the parts. File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 5 of 11
6 ATTRIBUTE DEFINITIONS Continued SOLDER HEAT RESISTANCE (Visual): 1) Blistering a) Pass/Fail 2) Distortion a) Bowed or Twisted 3) Discoloration a) Pass/Fail File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 6 of 11
7 SUPPLEMENTAL TEST: Solder Heat Resistance (Visual) at 230 C ATTRIBUTE DEFINITIONS Continued File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 7 of 11
8 SUPPLEMENTAL TEST: Solder Heat Resistance (Visual) at 280 C ATTRIBUTE DEFINITIONS Continued File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 8 of 11
9 RESULTS Solder Heat Resistance, 260 C Thermal Stressing Blistering o Two Thermal Stresses Pass o Three Thermal Stresses Pass Distortion o Two Thermal Stresses Pass o Three Thermal Stresses Pass Discoloration o Two Thermal Stresses Pass o Three Thermal Stresses Pass File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 9 of 11
10 RESULTS Continued Supplemental Tests Solder Heat Resistance, 230 C Thermal Stressing Blistering Distortion Discoloration Solder Heat Resistance, 280 C Thermal Stressing Blistering Distortion Discoloration File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 10 of 11
11 EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: THL-01 Description: Temperature/Humidity Chart Recorder Manufacturer: Dickson Model: THDX Serial #: Accuracy: Temp: +/- 1C; Humidity: +/-2% RH (0-60%) +/- 3% RH (61-95%). Last Cal: 7/15/02, Next Cal: 7/15/03 Equipment #: OV-5 Description: Nitrongen Purge IR Reflow Manufacturer: Vitronics Soltec Model: XPM-730 Serial #: XN Accuracy: + / - 5 File: J:\QA LAB\Test Programs\TC031-Lead Free-0141\ TC031-Lead Free-0141.doc Form 01 Rev 01 Page 11 of 11
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