PRODUCT. Part. A1 Micro USB USB3140. Rev. Page. Description Doc USB3140.

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Denis Cox
5 years ago
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1 1 PREL LIM MI IN AR RY

2 1.0 SCOPE. This specification covers performance, tests and quality requirements for the Receptacle (Type B, SMT, Vertical)..0 NAME AND PART NUMBER. Receptacle, 5 Pins, SMT, Type B:..0 SHAPE, DIMENSIONS AND MATERIAL. Please refer to drawings. 4.0 RATINGS. 4.1 Current rating: Signal (Pins,, 4) Power (Pins1, 5) A 1.8A 4. Voltagerating 0V AC 4. Operating Temperature Range -0 C to +85 C 5.0 TEST AND MEASUREMENT CONDITIONS. is designed to meet electrical, mechanical and environmental performancerequirements specified in Paragraph 6.0. Alll tests are performed in ambient conditions unless otherwise specified. 6.0 PERFOANCE. Examination of Visual, dimensional and functionalinspectionn as per quality plan. shall meet requirements of product drawing and specification.

3 Mating/Un-mating Force Durability Vibration Mechanical Shock 6.1 Electrical Performance. Low-signal Level Contact Resistance Insulation Resistance Dielectric Strength When measured at 0mV maximum open circuit at 100mA. Mated test contacts must be in a connector housing In accordance witheia-64-. Mate/Un-mate connectors, apply 100V DC for 1 minute at sea level between adjacent terminal or ground. In accordance with EIA Mate/Un-mate connectors, apply 100V ACfor 1 minute at sea level. In accordance with EIA mω Max MΩ Min. No Breakdown. 6.Mechanical Performance. Mate/Un-mated at a rate of 1.5mm/min. In accordance with EIA ,000 cycles at a cycle rate of 500 cycles per hour if done automatically and 00 if manual cycles. In accordance with EIA Mate connectors and subject to 5.5 Gs S. For a period of 15 minutes in each of the mutually perpendicular axes. In accordance with EIA-64-8 Test conditionn V test letter A. Mate connectors and subject to the following shock conditions, shocks shall be applied along mutually perpendicular axis (Total of 18 shocks) ). Test Pulse at Half Sine Peak Value: 94 m/ /s² (0G) Duration: 11ms. In accordance with EIA Test condition H. Mating force: 5N Max. Un-Mating force: 8N Min. to 5NMax. Mating force: 5N Max. Un-Mating force: 8N Min. to 5N Max Low Level Contact Resistance: 0mΩ Max. Appearance: No Damage. Contact Resistance: 50 mω Max. Discontinuity: 1.0 µ second Max. Appearance: No Damage. Contact Resistance: 10 mω Max. Change allowed. Discontinuity: 1.0 µ second Max.

4 4 6.Environmental Performance and Others. Humidity Test Salt Spray Temperature Life Temperature Rise Thermal Shock Solderability Resistancee to Soldering Heat (Reflow Soldering) Resistancee to Soldering Heat (Hand Soldering) Resistance to Solder Heat (Wave Soldering) Subject mated connectors to Duration: 168 hours temperature between -5 C to +65 C with 90 to 95% RH. In accordance with EIA Test condition A method III Subject mated/unmated connectors to 5% salt-solution concentration, 5 C for 48 hours. In accordance with EIA-64-6, B. Subject mated connectors to temperature life at +85ºC for 96hours. In accordance with EIA Test condition Method A. Mate connector and measure the temperature rise of contact when the maximum rated current is passed and in accordance with EIA Mate module and subject to follow condition for 10 cycles. At -55 C to +85 C. In accordance with EIA-64-, test conditionn I. Dip solder-tails in flux then immerse in solder bath at 45 ±5 C up to 0.5mm from the bottom of the housing for 4~5 seconds. In accordance with EIA-64-5, category. Sample mounted on PCB and subject to solder bath method, Temperature:60 C for 10±11 sec In accordance with EIA Sample mounted on PCB and subject to hand iron soldering, Temperature:50±10 C for ± ±1 sec Heat: 60±5 C, 10+/-0 sec. In accordance with EIA Appearance: No Damage. Contact Resistance: 10 mω Max. change allowed. Insulation Resistance: 1000 MΩ Min. Dielectric Strength: No Breakdown. Low Level Contact Resistance: 50mΩ Max. No visible rust Contact Resistance: 10 mω Max.Change allowed. Insulation Resist: 1000 MΩ Min.Shall meet visual equirement and show no physical damage. +0 C Max. Change allowed. No Damage 10mΩ Max. change allowed. Insulation Resist: MΩ Min. Dielectric Strength: No Breakdown. 95% of immersed area must show no voids, pin holes. Without deformation of shell or excessive loosenesss of the terminals (pin.) Without deformation of shell or excessive loosenesss of the terminals (pin.) Without deformation of shell or excessive loosenesss of the terminals (pin.)

5 5 7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT 7.1Lead Freee Process: Reflow soldering cycles limited to two times Temp 60ºC Peak temp 60ºC MAX.(10sec. Max) TEMPERATURE ON BOARD PATTERN SIDE 00ºC Min 40 sec. Min Slope <ºC/Sec 0ºC Min Pre-heat Hold time for 150~180º ºC Max. is 60~10sec.

6 6 8.0 QUALIFICATION AND TEST SEQUENCE Test 1 Test Group Examination of 1,,6 1,6 1,4 1, 1, 1, 1, Low-signal Level Contact Resistance Insulation Resistance Dielectric Withstanding Voltage Mating / Unmating Forces 1,5 1,4,,9,,8,9,8,5 4,,7 4,7,4 Durability Vibration Mechanical Shock Humidity Salt Spray Temp Life 5 5 Temp Rise 1 Thermal Shock 4 Solderability Resistancee to Wave Soldering Heat Resistancee to HandSoldering Heat Resistancee to ReflowSoldering Heat

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION Page 1 Page 2 1.0 SCOPE. This specification covers performance, tests and quality requirements for the SIM Card Connector SIM 2055 (Receiver Type, 6-Pin, SMT, 1.8 & 2.2mm Profiles). 2.0 PRODUCT NAME AND