Ben Gurion University of the Negev

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Ben Gurion University of the Negev Miniaturising and Integrating Matter Wave Quantum Technology The concept and workprogram of of a dedicated fabrication facility why? what? how?

1 Ben Gurion University of the Negev Miniaturising and Integrating Matter Wave Quantum Technology The concept and workprogram of of a dedicated fabrication facility why? what? how? Current funding: Israel Science Foundation Private Foundations Marie Curie Training Network Center for the Science of Complexity Bundesministerium fur Bildung und Forschung DIP, Industry, Defense R. Folman Past funding: EU-IST ACQUIRE consortium Marie Curie Fellowship

2 Short intro: what are are matter waves? Single or dilute gases of atoms with well defined internal and external quantum states

4 Two nobel prizes 1997 Light Cooling Steven Chu Claude Cohen-Tannoudji William D. Phillips 2001 BEC Eric A. Cornell Wolfgang Ketterle Carl E. Wieman

(electric) dimple 1d, 3d, crossover BEC propagation Some

.. Heidelberg Metrology (time) Navigation (acceleration) Geology

5 What can we do with them? a lot of exciting fundamental physics (e.g. Even nuclear! 219 hits on the web...) 1d traps: Condensate growth in disorder potentials and (electric) dimple 1d, 3d, crossover BEC propagation Some technological applications... Heidelberg Metrology (time) Navigation (acceleration) Geology (gravitation) Secure communications (quantum cryptography) Super computers (quantum computing) (all of the above have civilian as well as military applications) Also many other applications of cold atoms.

Atom lithography No diffration and no proximity effects cornel, NIST Single atom sources for deterministic doping Dopants per nanostructure

6 Atom lithography No diffration and no proximity effects cornel, NIST Single atom sources for deterministic doping Dopants per nanostructure nm cube 50 nm cube 30 nm cube 20 nm cube Dopant density, cm nm cube Fluctuations ~ N 1/2 > 30%

7 1d BEC as sensitive surface probe Heidelberg, Peter Krueger, Sebastian Hofferberth (poster tonight)

8 Magnetic imaging: comparison

9 Why?

10 Matter Wave Chips: miniaturization, integration, monolithic Electronics Optics Matter waves Atom Chip IonChip, CavityChip accuracy, complexity, scalability increased functionality Bottom line: Create a solid state device with isolated atoms.

magnetic, electric or light (dipole) 3d potential minimum Atom

surface Micro-electronics, photonics, MEMs, trapping,

11 How does the atomchip or ionchip work? OR How to move from glass bottles to invisible bottles which are dynamic and quantum friendly? NIST Nano Kelvin atom/ion trapped above the chip in a magnetic, electric or light (dipole) 3d potential minimum Atom hovering 1-100µm above chip surface Room temperature chip surface Micro-electronics, photonics, MEMs, trapping, manipulating and measuring the atom with magnetic, electric, and EM fields created on the surface and interacting with the atom vacuum

12 P. Zoller, , QIPC workshop, Bad Nauheim, Germany

4 examples of resulting bottle necks (2 fundamental, 2 technical): a.

13 History proved he is right! 1999 first chips Community methodology: Use fabs dedicated to other issues ( on-the-side ). 4 examples of resulting bottle necks (2 fundamental, 2 technical): a. Fabrication: Electro-plating, hybrid systems Result: fragmentation 5 µm Evaporation Electro plating ICAP 2004, J. Schmiedmayer shows a 2 order improvement in B/B Orsay, 2004

14 b. Ion Trap heating (1/d^4 scaling) Surface roughness, low aspect ratio Innsbruck, 2004 Turchette Q. A., et al., Phys. Rev. A, 61, , 2000 PS The community understood the on-the-side methodology is limited! 5 th of November 2004, NIST Gaithersburg, meeting of the leading Ion Trap groups with fabrication facilities to see who can become dedicated to the challenge. As a result, we are now conducting ion chip R&D (A. Ben-Kish)

15 c. Multi layer Still using glue! Zimmerman 2004 d. Electronics: not scalable! Monroe 2004

16 What? For now, we are concentrating on 3 systems: Atom chips Ion chips Cavity QED chips

17 1. AtomChip: quite a bit of miniaturization has been achieved QIPC architecture not really clear yet. Scientific American Feb In 2004, four experiments observed coherent phenomena!

18 1. AtomChip: quite a bit of miniaturization has been achieved J. Reichel coherence lifetime (d = 9 µm): τ coh = 2.8 s ~ 10 4 τ gate Scientific American Feb In 2004, four experiments observed coherent phenomena!

19 1. AtomChip: quite a bit of miniaturization has been achieved C. Zimmermann Scientific American Feb In 2004, four experiments observed coherent phenomena!

20 1. AtomChip: quite a bit of miniaturization has been achieved E. Cornell Heidelberg Coherent splitting in a guide Guided interfermetry opens many avenues: Area independent of velocity / flux / S/N high finesse Sagnac is possible Scientific American Feb. 2005

PRA (2001) electric phase modulator horizontal bias Single mode tunneling beam splitter 1mm Heidelberg

21 Beam splitters are non trivial Real designs Multi Mode IFM: One input - one output for elecrons: M. Heiblum Mach-Zehnder Single Mode IFM: Two input - two output E. Andersson et al. PRA (2001) electric phase modulator horizontal bias Single mode tunneling beam splitter 1mm Heidelberg Adiabatic RF potentials: double wells on micron scale for tunneling and coherence improved 3-port: more adiabaticity more symmetry horizontal bias

22 Surface (first priority): Issues to resolve Integration (near future): Fragmentation Thermally induced Noise Technical noise Heat conductivity Electrical breakdown Loading (e.g. MEMs) Electronics Photonics Particle and Laser sources Example of an integrated laser, optics, and photo detector, in a NIST miniature room temperature atomic clock (compared to grains of rice) Multi layers (CMP) Example of heating: Au SiO 2 Substrate (Si) Chip holder (MACOR) With Israel Bar-Joseph Nearby lens trap region with microlens Prof. Dr. J. Jahns, FernUniversitä

23 2. IonChip: QIPC architecture more advanced but miniaturization and integration is just in the first steps. NIST

24 Surface (first priority): Issues to resolve (NIST, Gaithersburg, 5 th Nov. 2004) Roughness High aspect ratio structures (to enlarge the distance to patch potentials on isolation layers) Multi layers (incl. back side alignment) Air bridges Materials (RF losses, SEC, UV, HV, vacuum) Integration (near future): RF filters Integration (further into the future): Control & readout electronics Photonics and detection Particle and Laser sources Compatibility with scalable architecture (islands, moving parts, etc.) P. Zoller

25 3. CavityQEDChip: miniaturization and integration non existent Chapman group, F=600,000 L=200µm J. Reichel Rempe group, F=430,000 L=116µm Zimmermann group F=24000, L=100000µm J. Schmiedmayer

WGM) 1-2nm surface roughness Transparent materials in the visible

26 Issues to resolve Not CavityQED but beautiful photonics Theory still not complete (e.g. FP vs. WGM) 1-2nm surface roughness Transparent materials in the visible Tuning Fiber Input and output losses 3D fabrication and coating (e.g. FP) vdw and many more. Mabuchi, Cal-Tech

27 How? A dedicated fabrication center with the right combination of: People (Photonics, micro electronics, MEMs, quantum optics) Materials (e.g. Silicon technology probably not good for many applications) Processes In-house cold atom and ion labs

BGU fab (will of course also be used for less

fabricators 300 m 2 of clean rooms (first 100

m 2 of characterization equipment (UHR SEM,

attention to novel materials and processes

28 BGU fab (will of course also be used for less demanding projects) Team of 10 designers and fabricators 300 m 2 of clean rooms (first 100 inaugurated on the 25 th of January 2005) 150 m 2 of characterization equipment (UHR SEM, AFM, TEM) 10M$ invested so far Special attention to novel materials and processes required by chip designs Collaborations (NIST, FP6, Defense, numerous labs e.g. HD) First sample supplied to Europe in February 2005 First BGU Ion Milling sample

29 examples of what we do 1. Materials Up to x75 noise reduction

2. Grain sizes (temperature, annealing) Grain Size, nm 100 90 80 70 60 Grain size vs thickness for Au films Elevated

Temperature before (blue line) and after (green line) Annealing 20 50 0 50 100 150 200 250 300 350 Deposition

01 0 500 1000 1500 2000 2500 3000 evaporated at room temperature 250nm thickness 750nm Normalized

30 2. Grain sizes (temperature, annealing) Grain Size, nm Grain size vs thickness for Au films Elevated temperature Room temperature Thickness, nm Grain Size, nm Gold Film Grain Size vs Deposition Temperature before (blue line) and after (green line) Annealing Deposition Temperature, Degrees Celsium evaporated at room temperature 250nm thickness 750nm Normalized Resestivity,Arbitrary Units Gold Film Resistivity vs Deposition Temperature before (blue line) and after (green line) Annealing Deposition Temperature, Degrees Celsium 250nm / 300C 1x1 micron

31 3. Photonics (High Q: Far field FP, Near field WGM, Tweezers FF & NF) FSR Tuning

Carbon Nano Tubes) both for Ion and Atom chips ballistic no finite size effect 10 9

32 4. Novel approaches to magnetic fields. Examples: Magnetic tweezers High Tc superconductors Metallic and non-metallic permanent magnets Molecules (e.g. Carbon Nano Tubes) both for Ion and Atom chips ballistic no finite size effect 10 9 A/cm 2 no vdw no fragmentation? noise Amsterdam 5. Decoherence theory (present theory not clear enough for experimental use) Fascinating issue that eventually goes back to the amount of information each electron takes away about the atoms. But this is for another talk.

33 Time estimate?

deposits. All the individual steps to do this with non-linear atom optics have been demonstrated.

34 Future "matter wave sensors" could include a new class of compact atom-laser gyroscopes at least a million times more sensitive than current laser gyroscopes and ultra-sensitive gravity-measuring sensors for detecting underground tunnels and chambers or undiscovered oil and mineral deposits. All the individual steps to do this with non-linear atom optics have been demonstrated. Its just a matter of making it work all together. I think it will happen in the next two or three years. (Pierre Meystre, Chair of the Quantum Optics center at the university of Arizona)

35 Did not touch many other non-surface issues of technology e.g. no magnetic coils around the chamber U-shaped structure MOT Heidelberg no vacuum chamber around the chip H-/Z-shaped structure Amsterdam J. Reichel For next time..

36 To you for listening and to the people in BGU: Students, Researchers, Fabricators, and Theoreticians

Revolution in Physics. What is the second quantum revolution? Think different from Particle-Wave Duality

Revolution in Physics. What is the second quantum revolution? Think different from Particle-Wave Duality PHYS 34 Modern Physics Ultracold Atoms and Trappe Ions Today and Mar.3 Contents: a) Revolution in physics nd Quantum revolution b) Quantum simulation, measurement, and information c) Atomic ensemble and