BAS19LT1, BAS20LT1, BAS21LT1, BAS21DW5T1. High Voltage Switching Diode HIGH VOLTAGE SWITCHING DIODE. Pb Free Packages are Available.
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1 BAS9LT, BAS0LT, BASLT, BASDWT Preferred Devices High Voltage Switching Diode Features PbFree Packages are Available MAXIMUM RATINGS Continuous Reverse Voltage Rating Symbol Value Unit BAS9 BAS0 BAS Repetitive Peak Reverse Voltage BAS9 BAS0 BAS V R V RRM Continuous Forward Current I F madc Peak Forward Surge Current I FM(surge) 6 madc Junction and Storage Temperature Range T J, T stg to +0 Power Dissipation (Note ) P D 8 mw Electrostatic Discharge ESD HM < 00 MM < 00 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Mounted on FR Board =.0 x 0.7 x 0.06 in. C V HIGH VOLTAGE SWITCHING DIODE CATHODE ANODE SC88A CATHODE CATHODE SOT (TO6) CASE 8 STYLE 8 SC88A (SOT) CASE 9A SOT ANODE ANODE MARKING DIAGRAMS Jx M Jx M x = P, R, or S P = BAS9LT R = BAS0LT S = BASLT or BASDWT M = Date Code = PbFree Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon the manufacturing location. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 8
2 BAS9LT, BAS0LT, BASLT, BASDWT THERMAL CHARACTERISTICS (SOT) Characteristic Symbol Max Unit Total Device Dissipation FR Board (Note ) T A = C Derate above C P D.8 mw Thermal Resistance JunctiontoAmbient (SOT) R JA 6 C/W Total Device Dissipation Alumina Substrate (Note ) T A = C Derate above C P D 00. mw Thermal Resistance JunctiontoAmbient R JA 7 C/W Junction and Storage Temperature Range T J, T stg to +0 C THERMAL CHARACTERISTICS (SC88A) Characteristic Symbol Max Unit Power Dissipation (Note ) P D 8 mw Thermal Resistance JunctiontoAmbient Derate Above C R JA 8.0 Maximum Junction Temperature T Jmax 0 C Operating Junction and Storage Temperature Range T J, T stg to +0 C. FR = in.. Alumina = in. 99.% alumina.. Mounted on FR Board =.0 x 0.7 x 0.06 in. C/W ELECTRICAL CHARACTERISTICS (T A = C unless otherwise noted) Characteristic Symbol Min Max Unit Reverse Voltage Leakage Current (V R = 00 ) BAS9 (V R = 0 ) BAS0 (V R = ) BAS (V R = 00, T J = 0 C) BAS9 (V R = 0, T J = 0 C) BAS0 (V R =, T J = 0 C) BAS I R Adc Reverse Breakdown Voltage (I BR = 00 Adc) BAS9 (I BR = 00 Adc) BAS0 (I BR = 00 Adc) BAS V (BR) Forward Voltage (I F = 00 madc) (I F = madc) Diode Capacitance (V R = 0, f =.0 MHz) C D.0 pf Reverse Recovery Time (I F = I R = 0 madc, I R(REC) =.0 madc, R L = 00) t rr 0 ns V F.0.
3 BAS9LT, BAS0LT, BASLT, BASDWT ORDERING INFORMATION Device Package Shipping BAS9LT SOT 000 / Tape & Reel BAS9LTG SOT (PbFree) 000 / Tape & Reel BAS9LT SOT 0000 / Tape & Reel BAS9LTG SOT (PbFree) 0000 / Tape & Reel BAS0LT SOT 000 / Tape & Reel BAS0LTG SOT (PbFree) 000 / Tape & Reel BASLT SOT 000 / Tape & Reel BASLTG SOT (PbFree) 000 / Tape & Reel BASLT SOT 0000 / Tape & Reel BASLTG SOT (PbFree) 0000 / Tape & Reel BASDWT SC88A 000 / Tape & Reel BASDWTG SC88A (PbFree) 000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D.
4 BAS9LT, BAS0LT, BASLT, BASDWT PACKAGE DIMENSIONS SOT (TO6) CASE 808 ISSUE AN A E A D e b HE SEE VIEW C L L VIEW C c 0. NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 98.. CONTROLLING DIMENSION: INCH.. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.. 80 THRU 07 AND 09 OBSOLETE, NEW STANDARD 808. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A b c D E e L L HE STYLE 8: PIN. ANODE. NO CONNECTION. CATHODE SOLDERING FOOTPRINT* SCALE 0: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
5 BAS9LT, BAS0LT, BASLT, BASDWT PACKAGE DIMENSIONS S A G B D PL 0. (0.008) M B M N SC88A, SOT, SC70 CASE 9A0 ISSUE J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y.M, 98.. CONTROLLING DIMENSION: INCH.. 9A0 OBSOLETE. NEW STANDARD 9A0.. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D G 0.06 BSC 0.6 BSC H J K N REF 0.0 REF S C J H K SOLDERING FOOTPRINT* SCALE 0: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 6
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