STPS2H V power Schottky rectifier. Datasheet. Features. Description. Negligible switching losses
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1 Datasheet 100 V power Schottky rectifier Features A Negligible switching losses A High junction temperature capability Low leakage current K SMA K SMB Good trade-off between leakage current and forward voltage drop Avalanche capability specified ECOPACK 2 component A A Description K SMA Flat K SMB Flat This Schottky rectifier is designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat, SMB and SMB Flat, the STPS2H100 is ideal for use in lighting and telecom power applications. Product status link STPS2H100 Product summary Symbol I F(AV) V RRM Value 2 A 100 V T j (max.) 175 C V F (max.) 5 V DS Rev 9 - May 2018 For further information contact your local STMicroelectronics sales office.
2 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 100 V SMA T l = 130 C, δ = 0.5 I F(AV) Average forward current SMB T l = 135 C, δ = 0.5 SMA Flat T l = 145 C, δ = A SMB Flat T l = 150 C, δ = 0.5 I FSM Surge non repetitive forward current t p = 10 ms sinusoidal 75 A P ARM Repetitive peak avalanche power t p = 10 µs, T j = 125 C 173 W T stg Storage temperature range -65 to +175 C T j Maximum operating junction temperature (1) 175 C 1. (dp tot /dt j ) < (1/R th(j-a) ) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Max. value Unit SMA 30 R th(j-l) Junction to lead SMA Flat 20 SMB 25 C/W SMB Flat 15 Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) Reverse leakage current T j = 25 C - 0 µa V R = V RRM T j = 125 C ma V F (2) Forward voltage drop T j = 25 C I F = 2 A T j = 125 C T j = 25 C - 8 I F = 4 A T j = 125 C V 1. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.56 x I F(AV) + 45 x I 2 F (RMS) For more information, please refer to the following application notes related to the power losses : AN604: Calculation of conduction losses in a power rectifier AN4021: Calculation of reverse losses on a power diode DS Rev 9 page 2/17
3 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5, SMA / SMB) P ( W) F(AV) δ = 5 δ = 0.1 I F(AV) (A) δ = δ = 0.5 δ=tp/t δ = T tp I F(AV) (A) δ =tp/t SMA R th(j-a) = 100 C/W S (CU) = 1.5cm2 T tp R th(j-a) =R t h(j-i) SMB R th(j-a) = 80 C/W S (CU) = 1.5cm2 T ( C ) amb SMA SMB Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) Figure 4. Average forward current versus ambient temperature (δ = 0.5, SMA Flat) I F(AV) (A) δ=tp/t T tp R th(j-a) =Rth(j-l) T amb( C) SMBflat R th(j-a) = 40 C/W 2 S CU= 2.5 cm I F(AV) (A) T δ=tp/t tp T amb( C) R th(j-a) =R th(j-l) SMAflat DS Rev 9 page 3/17
4 Characteristics (curves) Figure 5. Normalized avalanche power derating versus junction temperature (T j = 125 C) P ARM(tp) P ARM(10 µs) 1 t p(µs) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Z th(j-a) /Rth(j-a) SMA 0.1 Single pulse t p(s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 7. Relative variation of thermal impedance junction to lead versus pulse duration (SMA Flat) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Z th(j-l) /Rth(j-l) SMAflat Single pulse t (s) p 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E Z th(j-a) /Rth(j-a) SMB 0.1 Single pulse t p(s) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat) Figure 10. Reverse leakage current versus reverse voltage applied (typical values) 0.9 Z th(j-l) /Rth(j-l) SMBflat 1.E+04 1.E+03 I (µa) R T j = 150 C E+02 T j = 125 C T j = 100 C E+01 T j = 75 C Single pulse t (s) p 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 T j = 50 C 1.E+00 T j = 25 C 1.E-01 V R(V) 1.E DS Rev 9 page 4/17
5 Characteristics (curves) Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Forward voltage drop versus forward current (low level) C(pF) 100 F= 1MHz V OSC= 30mVRMS T j= 25 C I (A) F T j =125 C (Maximum values) T j =125 C (Typical values) T j =25 C (Maximum values) 10 V ( V) R V (V) F Figure 13. Forward voltage drop versus forward current (high level) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 100 I (A) F R th(j-a) ( C/W) 200 Epoxy printed circuit board FR4,copper thickness: 35 µm SMA T j =125 C (Maximum values) T j =125 C (Typical values) T j =25 C (Maximum values) V (V) F S (Cu) (cm²) Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat) 200 R th(j-a) ( C/W) Epoxy printed circuit board FR4,copper thickness: 35 µm SMAflat Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (SMB) R th(j-a) ( C/W) 200 Epoxy p rinted circuit board FR4, copper t hickness: 35 µm SMB S (Cu) (cm²) S (Cu) (cm²) DS Rev 9 page 5/17
6 Characteristics (curves) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) R th(j-a) ( C/W) 200 Epoxy printed circuit board FR4, e Cu = 35 µm SMB-Flat S Cu (cm²) DS Rev 9 page 6/17
7 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 2.1 SMA Flat package information Epoxy meets UL94, V0 Lead-free package Figure 18. SMA Flat package outline D A c L 2x L1 2 x E E1 L L2 2 x b 2 x Ref. Table 4. SMA Flat package mechanical data Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A b c D E E L L L DS Rev 9 page 7/17
8 SMAflat package information Figure 19. SMA Flat recommended footprint in mm (inches) 5.52 (17) 1.52 (60) 1.20 (47) 3.12 (0.123) millimeter (inches) s 1.20 (47) DS Rev 9 page 8/17
9 SMA package information 2.2 SMA package information Epoxy meets UL94, V0 Lead-free package Figure 20. SMA package outline E1 D E A1 C L A2 b Ref. Table 5. SMA package mechanical data Millimeters Dimensions Inches Min. Max. Min. Max. A A b c D E E L DS Rev 9 page 9/17
10 SMA package information Figure 21. SMA recommended footprint in mm (inches) 1.4 (55) 2.63 (0.103) 1.4 (55) 1.64 (64) 5.43 (14) DS Rev 9 page 10/17
11 SMB package information 2.3 SMB package information Epoxy meets UL94, V0 Lead-free package Figure 22. SMB package outline E1 D E A1 C A2 L b Ref. Table 6. SMB package mechanical data Millimeters Dimensions Inches Min. Max. Min. Max. A A b c D E E L DS Rev 9 page 11/17
12 SMB package information Figure 23. SMB recommended footprint 1.62 (64) 2.60 (0.102) 1.62 (64) 2.18 (86) 5.84 (30) DS Rev 9 page 12/17
13 SMB Flat package information 2.4 SMB Flat package information Epoxy meets UL94, V0 Lead-free package Figure 24. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Ref. Millimeters Table 7. SMB Flat mechanical data Dimensions Inches Min. Typ. Max. Min. Typ. Max. A b c D E E L L L DS Rev 9 page 13/17
14 SMB Flat package information Figure 25. Footprint recommendations, dimensions in mm (inches) 1.20 (47) 3.44 (0.136) 1.20 (47) 2.07 (82) 5.84 (30) millimeters (inches) DS Rev 9 page 14/17
15 Ordering Information 3 Ordering Information Table 8. Ordering information Order code Marking Package Weight Base qty. Delivery mode STPS2H100A S21 SMA 68 g 5000 Tape and reel STPS2H100AF F21 SMA Flat 35 g Tape and reel STPS2H100U G21 SMB g 2500 Tape and reel STPS2H100UF FG21 SMB Flat 50 g 5000 Tape and reel DS Rev 9 page 15/17
16 Revision history Table 9. Document revision history Date Version Changes Jul A Last update. Aug Feb SMA package dimensions update. Reference A1 max. changed from 2.70 (0.106 inches) to 2.03 mm (80 inches). Reformatted to current standards. Added ECOPACK statement. Added SMBflat package. 15-Feb Updated weight for SMBflat in Table Jun Added SMAflat package 17-May Removed figure 6. Updated Table 1. Absolute ratings (limiting values at 25 C, unless otherwise specified) and Section Description. Minor text changes to improve readability. DS Rev 9 page 16/17
17 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved DS Rev 9 page 17/17
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