ELECTROSÓN BTA24, BTB24, BTA25 BTA26, BTB26, T A standard and Snubberless triacs. Features. Applications. Description
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1 BT4, BTB24, BT5 BT6, BTB26, T25 25 A standard and Snubberless triacs Features High current triac Low thermal resistance with clip bonding High commutation (4 quadrant) or very high commutation (3 quadrant) capability BTA series UL1557 certified (File ref: 81734) Packages are RoHS (2002/95/EC) compliant Applications Applications include the ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits, etc., or for phase control operation in light dimmers, motor speed controllers, and silmilar. The snubberless versions (BTA/BTB...W and T25 series) are especially recommended for use on inductive loads, due to their high commutation performances. The BTA series provides an insulated tab (rated at 2500 V RMS ). TO-220AB Insulated (BT4) RD91 (BT5) TO-220AB (BTB24) TOP3 Insulated (BT6) Description Available either in through-hole or surface-mount packages, the BT4, BTB24, BT5, BT6, BTB26 and T25 triac series is suitable for general purpose mains power AC switching. D 2 PAK (T25) TOP3 (BTB26) Table 1. I T(RMS) Device summary Symbol Parameter BT4 (1) V DRM /V RRM I T (Snubberless) I T (Standard) 1. Insulated packages RMS on-state current Repetitive peak off-state voltage Triggering gate current Triggering gate current BTB24 BT5 (1) BT6 (1) BTB26 T25 Unit A 600 / / / (2) / V version available only with I T = 50 ma (Snubberless and Standard) / 800 V 35 / / / ma ma TM: Snubberless is a trademark of STMicroelectronics July 2007 Rev 10 1/12 12
2 Characteristics BT4, BTB24, BT5, BT6, BTB26, T25 1 Characteristics Table 2. Absolute maximum ratings Symbol Parameter Value Unit I T(RMS) I TSM RMS on-state current (full sine wave) Non repetitive surge peak on-state current (full cycle, T j initial = 25 C) TOP3 D 2 PA K / TO-220AB RD91 Ins/ TOP3 Ins. TO-220AB Ins. T c = 105 C T c = 100 C T c = 100 C T c = 75 C F = 50 Hz t = 20 ms 250 F = 60 Hz t = 16.7 ms A I ² t I ² t Value for fusing t p = 10 ms 340 A ² s di/dt V DSM /V RSM Critical rate of rise of on-state current I = 2 x I T, t r 100 ns Non repetitive surge peak off-state voltage F = 120 Hz T j = 125 C 50 A/µs t p = 10 ms T j = 25 C V DRM /V RRM I M Peak gate current t p = 20 µs T j = 125 C 4 A P (AV) Average gate power dissipation T j = 125 C 1 W T stg T j Table 3. Storage junction temperature range Operating junction temperature range - 40 to to Electrical characteristics (T j = 25 C, unless otherwise specified), Snubberless and logic level (3 quadrants) T25, BTA/BTB24...W, BT5...W, BT6...W Symbol Test Conditions Quadrant T25 BTA/BTB T2535 CW BW I (1) T I - II - III MAX ma V D = 12 V R L = 33 Ω V T I - II - III MAX. 1.3 V V D I H (2) V D = V DRM R L = 3.3 kω T j = 125 C A V C Unit I - II - III MIN. 0.2 V I T = 500 ma MAX ma I - III I L I = 1.2 I T MAX. II dv/dt (2) V D = 67 %V DRM gate open T j = 125 C MIN V/µs (di/dt)c (2) Without snubber T j = 125 C MIN A/ms 1. minimum I T is guaranted at 5% of I T max. 2. for both polarities of referenced to. ma 2/12
3 BT4, BTB24, BT5, BT6, BTB26, T25 Characteristics Table 4. Electrical characteristics (T j = 25 C, unless otherwise specified), standard (4 quadrants), BTB24...B, BT5...B, BT6...B, BTB26...B Symbol Test Conditions Quadrant Value Unit I T (1) V D = 12 V R L = 33 Ω I - II - III 50 MAX. IV 100 V T ALL MAX. 1.3 V V D V D = V DRM R L = 3.3 kω T j = 125 C ALL MIN. 0.2 V I H (2) ) I T = 500 ma MAX. 80 ma I - III - IV 70 I L I = 1.2 I T MAX. II 160 dv/dt (2) V D = 67 %V DRM gate open T j = 125 C MIN. 500 V/µs (dv/dt)c (2) (di/dt)c = 13.3 A/ms T j = 125 C MIN. 10 V/µs 1. minimum I T is guaranted at 5% of I T max. 2. for both polarities of referenced to. Table 5. Static characteristics Symbol Test Conditions Value Unit V TM (1) I TM = 35 A t p = 380 µs T j = 25 C MAX V V t0 (1) Threshold voltage T j = 125 C MAX V R d (1) Dynamic resistance T j = 125 C MAX. 16 mω I DRM T j = 25 C 5 µa V I DRM = V RRM MAX. RRM T j = 125 C 3 ma 1. for both polarities of referenced to. ma ma Table 6. Thermal resistance Symbol Parameter Value Unit TOP R th(j-c) Junction to case (AC) D 2 PAK / TO-220AB 0.8 RD91 Insulated / TOP3 Insulated 0.9 C/W TO-220AB Insulated 1.7 (1) S = 1 cm ² D 2 PA K 4 5 R th(j-a) Junction to ambient TOP3 / TOP3 Insulated 50 C/W TO-220AB / TO-220AB Insulated S = Copper surface under tab. 3/12
4 Characteristics BT4, BTB24, BT5, BT6, BTB26, T25 Figure 1. Maximum power dissipation versus RMS on-state current (full cycle) Figure 2. RMS on-state current versus case temperature (full cycle) 30 P(W) 30 I T(RMS) (A) BTB BT BTB24 / T25xx / BT5 / BT6 5 0 I T(RMS) (A) T ( C) C Figure 3. D 2 PAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration 4.0 I T(RMS) (A) 1E+0 K=[Z th/rth] 3.5 DPAK 2 2 (S=1cm ) Zth(j-c) E-1 1E-2 Zth(j-a) BTA / BTB24 / T25 Zth(j-a) BT T amb( C) t p(s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles 300 I TM(A) 300 I TSM(A) 100 T j max. V to = 0.85V R d = 16 mω T= j T j max. 250 t=20ms Non repetitive T j initial=25 C One cycle 10 T j = 25 C. 100 Repetitive T C=75 C V TM(V) Number of cycles /12
5 BT4, BTB24, BT5, BT6, BTB26, T25 Characteristics Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width t p < 10 ms and corresponding value of I 2 t Figure 8. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) I TSM(A), I t (A s) di/dt limitation: 50A/µs T j initial=25 C I T,I H,I L[T] j / I T,I H,I L[T j=25 C] 1000 ITSM 1.5 IT 2 I t 1.0 IH & IL t p(ms) T j( C) Figure 9. Relative variation of critical rate of decrease of main current versus (dv/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus T j (di/dt)c [(dv/dt)c] / Specified (di/dt)c T2535/CW/BW 1.4 B (dv/dt)c (V/µs) (di/dt)c [T j ] / (di/dt)c [T j specified] T ( C) j Figure 11. D 2 PAK thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) 80 R th(j-a) ( C/W) 70 DPAK S(cm²) /12
6 Ordering information scheme BT4, BTB24, BT5, BT6, BTB26, T25 2 Ordering information scheme Figure 12. BTA and BTB series BT A BW R Triac series Insulation A = insulated B = non insulated Current 24 = 25 A in TO-220AB 25 = 25 A in RD91 26 = 25 A in TOP3 Voltage 600 = 600 V 800 = 800 V Sensitivity and type B = 50 ma Standard BW = 50 ma Snubberless CW = 35 ma Snubberless Packing mode R = Tube Figure 13. T25 series T (-TR) Triac series Current 25 = 25 A Sensitivity 35 = 35 ma Voltage 600 = 600 V 800 = 800 V Package 2 = D PAK Packing mode Blank = Tube -TR = Tape and Reel 6/12
7 BT4, BTB24, BT5, BT6, BTB26, T25 Package information 3 Package information Epoxy meets UL94,V0 Cooling method: C Recommended torque value: Nm (TO-220AB), Nm (TOP3 and RD91) Maximum torque value for BTB24 is 0.5 Nm Table 7. D 2 PAK dimensions REF. Millimeters DIMENSIONS Inches Min. Typ. Max. Min. Typ. Max. A A L2 E C D B L B L3 C B2 B C R C D E mm min. FLAT ZONE L V2 L L R V Figure 14. D 2 PAK footprint dimensions (in millimeters) /12
8 Package information BT4, BTB24, BT5, BT6, BTB26, T25 Table 8. RD91 dimensions DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. L2 L1 A B2 C B1 B B C2 C1 B C N2 F N1 B C C E E3 A I F I L L N N /12
9 BT4, BTB24, BT5, BT6, BTB26, T25 Package information Table 9. TOP3 (insulated and non_insulated) dimensions DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. H A A R ØL B B K F C D E F P C H J J E D J K ØL P R /12
10 Package information BT4, BTB24, BT5, BT6, BTB26, T25 Table 10. TO-220AB (insulated and non-insulated) dimensions DIMENSIONS REF. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A a B Ø I L b2 C F a B b A b I4 l3 C a1 c2 c l2 a2 c e e b1 M c1 F ØI I L l l M In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: 10/12
11 BT4, BTB24, BT5, BT6, BTB26, T25 Ordering information 4 Ordering information Table 11. Ordering information Ordering type Marking Package Weight Base qty Delivery mode BTA/BTB24-xxxyzR BTA/BTB24 xxxyz TO-220AB 2.3 g 50 Tube BT5-xxxyz BT5xxxyz RD91 20 g 25 Bulk BT6-xxxyR BT6xxxyz TOP3 Ins. 4.5 g 30 Tube BTB26-600BR BTB26600B TOP3 4.5 g 30 Tube T2535-xxx T2535 xxx D 2 50 Tube PAK 1.5 g T2535-xxx-TR T2535 xxx 1000 Tape and reel Note: xxx = voltage, y = sensitivity, z = type 5 Revision history Table 12. Revision history Date Revision Description of changes Oct A Previous update. 13-Feb TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 31-May Reformatted to current standard. T c in figure 3 changed to T amb 31-Jul Typing error corrected on page 1 (BTB124 instead of BTB24) 05-Jul Added BTB26-600BR. Restructured cover page and section 2: Ordering information scheme on page 6 to simplify product selection. Thermal resistance values updated in Ta bl e 6 and Figure 2. raphic for I 2 t updated in Figure 7. 11/12
12 BT4, BTB24, BT5, BT6, BTB26, T25 12/12
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