STTH15L06. Turbo 2 ultrafast high voltage rectifier. Description. Features
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1 STTH15L6 Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description K A K A The STTH15L6, which is using ST Turbo 2 6 V technology, is specially suited for use in switching power supplies, and industrial applications, as rectification and discontinuous mode PC boost diode. TO-22AC K TO-22PAC Table 1. Device summary Symbol Value NC D²PAK A I (AV) Up to 2 A V RRM 6 V T j 175 C V (typ).95 V t rr (max) 55 ns eatures Ultrafast switching Low reverse recovery current Reduces switching and conduction losses Low thermal resistance April 214 DocID759 Rev 3 1/ This is information on a product in full production.
2 Characteristics STTH15L6 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 6 V I (RMS) orward rms current 3 A I (AV) Average forward current δ =.5 TO-22AC / D 2 PAK T c = 14 C T c = 12 C TO-22PAC T c = 9 C A I SM Surge non repetitive forward current t p = ms sinusoidal 2 A T stg Storage temperature range -65 to C T j Maximum operating junction temperature 175 C Table 3. Thermal parameter Symbol Parameter Maximum Unit R th(j-c) Junction to case TO-22AC / D 2 PAK 1.7 TO-22PAC 4. C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) Reverse leakage current T j = 25 C 15 V R = V RRM T j = 15 C 4 4 µa V (2) orward voltage drop T j = 25 C 1.55 I = 15 A T j = 15 C V 1. Pulse test: t p = 5 ms, δ < 2 % 2. Pulse test: t p = 38 µs, δ < 2 % To evaluate the maximum conduction losses use the following equation: P =.94 x I (AV) +.17 I 2 (RMS) 2/ DocID759 Rev 3
3 STTH15L6 Characteristics Table 5. Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit t rr Reverse recovery time T j = 25 C I RM Reverse recovery current T j = 125 C I =.5 A, I rr =.25 A, I R = 1 A I = 1 A, di /dt = 5 A/µs, V R = 3 V I = 15 A, di /dt = A/µs, V R = 4 V ns A t fr orward recovery time I = 15 A, 3 ns T j = 25 C di /dt = A/µs V P orward recovery voltage V R = 1.1 x V 3 V max igure 1. Conduction losses versus average current P (AV) (W) δ =.5 δ =.1 δ =.2 I (AV) (A) δ =.5 δ = 1 δ=tp/t igure 3. Relative variation of thermal impedance junction to case versus pulse duration (TO-22AC, D²PAK) Z th(j-c) /Rth(j-c) T tp igure 2. orward voltage drop versus forward current I M(A) T j=15 C (typical values) T j=15 C (maximum values) T j=25 C (maximum values) V M(V) igure 4. Relative variation of thermal impedance junction to case versus pulse duration (TO-22PAC) Z th(j-c) /Rth(j-c).2.2 Single pulse.1. Single pulse t (s) p 1.E-3 1.E-2 1.E-1 1.E+.1. t (s) p 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 DocID759 Rev 3 3/
4 Characteristics STTH15L6 igure 5. Peak reverse recovery current versus di /dt (9 % confidence) 35 3 I RM(A) V R=4V I =2 x I(AV) igure 6. Reverse recovery time versus di /dt (9 % confidence) 8 7 t (ns) rr V R=4V 25 I=I (AV) 6 I =2 x I(AV) 2 15 I =.5 x I(AV) I=I (AV) I =.5 x I(AV) igure 7. Reverse recovery charges versus di /dt (9 % confidence) Q (nc) rr V R=4V I =2 x I(AV) I=I (AV) I =.5 x I(AV) igure 9. Relative variations of dynamic parameters versus junction temperature QRR trr S factor IRM T ( C) j I=I (AV) V R=4V Reference: igure 8. Softness factor versus di /dt (typical values) S factor I < 2 x I(AV) V R=4V igure. Transient peak forward voltage versus di /dt (9 % confidence) V P(V) I=I (AV) / DocID759 Rev 3
5 STTH15L6 Characteristics igure 11. orward recovery time versus di /dt (9 % confidence) 3 25 t (ns) fr I=I (AV) V R=1.1 x V max. igure 12. Junction capacitance versus reverse voltage applied (typical values) C(p) =1MHz V OSC=3mVRMS T j=25 C V (V) R 1 igure 13. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board R4 copper thickness = 35 µm) (D 2 PAK) 8 7 R th(j-a) ( C/W) S CU(cm²) DocID759 Rev 3 5/
6 Package information STTH15L6 2 Package information Epoxy meets UL94, V Cooling method: by conduction (C) Recommended torque value:.4 to.6 N m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Table 6. TO-22AC dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. H2 Ø I L5 C A L7 A C D E L2 L G L9 D H L4 L typ..645 typ. L G M E L L L L M 2.6 typ..2 typ. Dia. I / DocID759 Rev 3
7 STTH15L6 Package information Table 7. TO-22PAC dimensions Ref. Millimeters Dimensions Inches Min. Max. Min. Max. A H A B B D Dia E L3 L2 L4 1 L6 L5 D L G G H L2 16 Typ..63 Typ. L G1 E L G L L L Dia DocID759 Rev 3 7/
8 Package information STTH15L6 Table 8. D 2 PAK dimensions Ref. Millimeters Dimensions Inches Min. Max. Min. Max. A L2 E C2 A A A B L L3 B2 B A1 C R D B C C D G E A2 G L M * V2 L * LAT ZONE NO LESS THAN 2mm L M R.4 typ..16 typ. V2 8 8 igure 14. ootprint (dimensions in mm) / DocID759 Rev 3
9 STTH15L6 Ordering information 3 Ordering information Table 9. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH15L6D STTH15L6D TO-22AC 1.9 g 5 Tube STTH15L6G STTH15L6G D 2 PAK 1.48 g 5 Tube STTH15L6G-TR STTH15L6G D 2 PAK 1.48 g Tape and reel STTH15L6P STTH15L6P TO-22PAC 1.7 g 5 Tube 4 Revision history Table. Document revision history Date Revision Changes 7-Sep-24 1 irst issue 15-Jul Updated I SM from 13 A to 15 A. 1-Apr Updated I SM from 15 A to 2 A. DocID759 Rev 3 9/
10 STTH15L6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET ORTH IN ST S TERMS AND CONDITIONS O SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE O ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES O MERCHANTABILITY, ITNESS OR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS O ANY JURISDICTION), OR INRINGEMENT O ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED OR USE IN: (A) SAETY CRITICAL APPLICATIONS SUCH AS LIE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT UNCTIONAL SAETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED OR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER S SOLE RISK, EVEN I ST HAS BEEN INORMED IN WRITING O SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED OR AUTOMOTIVE, AUTOMOTIVE SAETY OR MEDICAL INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIICATIONS. PRODUCTS ORMALLY ESCC, QML OR JAN QUALIIED ARE DEEMED SUITABLE OR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 214 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - inland - rance - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America / DocID759 Rev 3
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