STPS20M60S. Power Schottky rectifier. Features. Description. High current capability Avalanche rated Low forward voltage drop High frequency operation
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1 Power Schottky rectifier Features High current capability valanche rated Low forward voltage drop High frequency operation Description The is a single Schottky diode, suited for high frequency switch mode power supply. Packaged in TO-22B, I 2 P and D 2 P, this device is intended to be used in notebook, game station and desktop adapters, providing in these aplications a good efficiency at both low and high load. Table 1. Symbol Device summary alue I F() 2 RRM 6 F (typ).365 T (max) 15 C Figure 1. I 2 P R I TO-22B T D 2 P G-TR Electrical characteristics (a) 2 x I O I "Forward" X I F RRM R R I O I R X To F(Io) F F(2xIo) "Reverse" I R a. RM and I RM must respect the reverse safe operating area defined in Figure 12. R and I R are pulse measurements (t p < 1 µs). R, I R, RRM and F, are static characteristics October 211 Doc ID 1945 Rev 1 1/9 9
2 Characteristics 1 Characteristics Table 2. bsolute ratings (limiting values with terminals 1 and 3 short circuited at T amb = 25 C, unless otherwise specified) Symbol Parameter alue Unit RRM Repetitive peak reverse voltage 6 I F(RMS) Forward rms current 9 I F() verage forward current, δ =.5 T c = 135 C Per package 2 I FSM Surge non repetitive forward current t p = 1 ms sine-wave 6 P (1) RM Repetitive peak avalanche power T = 25 C, t p = 1 µs 264 W RM (2) Maximum repetitive peak avalanche voltage 1. For temperature or pulse time duration deratings, please refer to Figure 4 and 5. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes N1768 and N See Figure dptot 1 < condition to avoid thermal runaway for a diode on its own heatsink dt Rth(-a) Table 3. Thermal resistance Symbol Parameter alue Unit To evaluate the conduction losses use the following equation: P =.38 x I F() +.63 x I F 2 (RMS) t p < 1 µs, T < 15 C, I R < 99 8 (2) Maximum single-pulse SM peak avalanche voltage t p < 1 µs, T < 15 C, I R < 99 8 T stg Storage temperature range -65 to +175 C T Maximum operating unction temperature (3) 15 C R th(-c) Junction to case 1. C/W Table 4. Static electrical characteristics (terminals 1 and 3 short circuited) Symbol Parameter Test conditions Min. Typ. Max. Unit I R (1) F (2) Reverse leakage current Forward voltage drop 1. Pulse test: t p = 5 ms, δ < 2 % 2. Pulse test: t p = 38 µs, δ < 2 % T = 25 C µ R = RRM T = 125 C m T = 25 C I F = 1 T = 125 C T = 25 C I F = 2 T = 125 C /9 Doc ID 1945 Rev 1
3 Characteristics Figure 2. verage forward power dissipation versus average forward current Figure 3. verage forward current versus ambient temperature (δ =.5) P F() (W) 18 I F() () δ =.5 δ =.1 δ =.2 δ =.5 δ = 1 2 R th(-a) = R th(-c) δ = t p / T t p I F() () T 4 T amb( C) Figure 4. Normalized avalanche power derating versus pulse duration Figure 5. Normalized avalanche power derating versus unction temperature 1 P P RM RM (tp) (1µs) P RM(T) P RM(25 C) t (µs) T ( C) p Figure I () M I M t δ =.5 Non repetitive surge peak forward current versus overload duration (maximum values) T = 25 C c T = 75 C c T = 125 C c 1.E-3 1.E-2 1.E-1 1.E+ t(s) Figure Z th(-c) /Rth(-c) Single pulse Relative variation of thermal impedance unction to case versus pulse duration.1. t p(s) 1.E-4 1.E-3 1.E-2 1.E-1 1.E+ Doc ID 1945 Rev 1 3/9
4 Characteristics Figure 8. Reverse leakage current versus reverse voltage applied (typical values) Figure 9. Junction capacitance versus reverse voltage applied (typical values) 1.E+2 1.E+1 I (m) R T = 15 C T = 125 C C(pF) 1 F = 1 MHz osc = 3 m T = 25 C RMS 1.E+ T = 1 C T = 75 C 1 1.E-1 T = 5 C 1.E-2 T = 25 C 1.E-3 () R R() Figure 1. I FM() Forward voltage drop versus forward current T = 125 C (Typical values) T = 125 C (Maximum values) T = 25 C (Maximum values) FM() Figure Thermal resistance unction to ambient versus copper surface under tab R th(-a) ( C/W) 8 epoxy printed board copper thickness = 35 µm 7 2 DP 1 2 S Cu(cm ) Figure 12. Reverse safe operating area (t p < 1 µs and T < 15 C) I arm () I arm ( arm) 15 C, 1µs arm () 4/9 Doc ID 1945 Rev 1
5 Package information 2 Package information Epoxy meets UL94, Cooling method: by conduction (C) Recommended torque value:.4 to.6 N m In order to meet environmental requirements, ST offers these devices in different grades of ECOPC packages, depending on their level of environmental compliance. ECOPC specifications, grade definitions and product status are available at: ECOPC is an ST trademark. Table 5. TO-22B dimensions Ref. Millimeters Dimensions Inches Min. Max. Min. Max H2 Dia L5 C L7 C D E F L2 F2 L6 F F G F1 L9 D G F L4 H L Typ..645 Typ. G1 G M E L L L L L M 2.6 Typ..12 Typ. Dia Doc ID 1945 Rev 1 5/9
6 Package information Table 6. D 2 P dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. L2 E C B L D B L3 B2 B 1 C R C C D G E G L M * 2 * FLT ZONE NO LESS THN 2mm L L M R.4 typ..16 typ Figure 13. D 2 P footprint (dimensions in mm) /9 Doc ID 1945 Rev 1
7 Package information Table 7. I 2 P dimensions Dimensions Ref. Millimeters Inches L2 E c2 Min. Max. Min. Max b D b c L1 1 c L b1 D e e e1 b c e E L L L Doc ID 1945 Rev 1 7/9
8 Ordering information 3 Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode T T TO-22B 2.2 g 5 Tube R R I 2 P 1.49 g 5 Tube G-TR G D 2 P 1.48 g 1 Tape and reel 4 Revision history Table 9. Revision history Date Revision Changes 11-Oct Initial release 8/9 Doc ID 1945 Rev 1
9 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics N and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. ll ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS ND CONDITIONS OF SLE ST DISCLIMS NY EXPRESS OR IMPLIED WRRNTY WITH RESPECT TO THE USE ND/OR SLE OF ST PRODUCTS INCLUDING WITHOUT LIMITTION IMPLIED WRRNTIES OF MERCHNTBILITY, FITNESS FOR PRTICULR PURPOSE (ND THEIR EQUILENTS UNDER THE LWS OF NY JURISDICTION), OR INFRINGEMENT OF NY PTENT, COPYRIGHT OR OTHER INTELLECTUL PROPERTY RIGHT. UNLESS EXPRESSLY PPROED IN WRITING BY TWO UTHORIZED ST REPRESENTTIES, ST PRODUCTS RE NOT RECOMMENDED, UTHORIZED OR WRRNTED FOR USE IN MILITRY, IR CRFT, SPCE, LIFE SING, OR LIFE SUSTINING PPLICTIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FILURE OR MLFUNCTION MY RESULT IN PERSONL INJURY, DETH, OR SEERE PROPERTY OR ENIRONMENTL DMGE. ST PRODUCTS WHICH RE NOT SPECIFIED S "UTOMOTIE GRDE" MY ONLY BE USED IN UTOMOTIE PPLICTIONS T USER S OWN RIS. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. ll other names are the property of their respective owners. 211 STMicroelectronics - ll rights reserved STMicroelectronics group of companies ustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong ong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United ingdom - United States of merica Doc ID 1945 Rev 1 9/9
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