MODELING OF CV CHARACTERISTICS OF HIGH-k MIM CAPACITORS

Size: px
Start display at page:

Download "MODELING OF CV CHARACTERISTICS OF HIGH-k MIM CAPACITORS"

Transcription

1 Chapter 6 MODELING OF CV CHARACTERISTICS OF HIGH-k MIM CAPACITORS 6.1 Introduction and Motivation Capacitance-Voltage characteristics and voltage linearity of MIM capacitor are important performance parameters for design of AMS ICs. Achieving low voltage coefficient of capacitance (VCC) is still a challenge to meet ITRS recommendations. However, the origin of nonlinear behavior of capacitance with voltage is not clear. Some authors attempted to model the voltage nonlinearity using orientation polarization [Phung et al., 2011], electrode polarization [Gonon and Vallae, 2007], electrostriction [Wenger et al., 2008] and ionic polarization [Be cu et al., 2006]. However, most of them are either complex or biased to particular materials. For instance, Phung et al demostrated the modeling of negative VCC for SiO 2 MIM capacitors using orientation polarization of polar dielectrics [Phung et al., 2011]. This model can not be used for nonpolar dielectrics, such as Al 2 O 3 and Ta 2 O 5. Also the dipole moment of O-Si-O bond was calculated using complex techniques. Kim et al reprted that the VCC is a linear function of temperature [Kim et al., 2004]. However, the models mentioned above did not considered the effect of temperature. 82

2 In this chapter, a generalized model of voltage nonlinearity for MIM capacitors is presented using microscopic and macroscopic ionic polarizations. The model was verified with fabricated MIM capacitors with low and high dielectric constant materials such as Al 2 O 3 and TiO 2, respectively, at various temperatures. The model maps the dependable elements of voltage linearity, such as dielectric thickness and dielectric constant, to meet the recommendations of International Technology Roadmap for Semiconductor (ITRS) [ITRS, 2011]. Bilayer and multilayer dielectric MIM capacitors are proposed to solve the issues in single layer cases, such as high VCC and high leakage current density. However, no report was found on modeling of CV characteristics of such capacitors as per our knowledge. In our observations in leakage characteristics of bilayer MIM capacitors, the interfacial traps and migration of charges were predicted. Therefore, the modeling of CV characteristics of bilayer dielectric stack MIM capacitors should account space charge accumulation or interfacial polarization. This phenomena is also referred as Maxwell-Wagner polarization. In this chapter, a CV model for bilayer MIM capacitors is proposed which shows a good fit with experimental results of anodic TiO 2 /Al 2 O 3 MIM capacitors. 6.2 Modeling of C-V characteristics of single layer MIM capacitor Dielectric materials are largely influenced by their polarization properties with applied electric field. In MIM capacitors, the formation of capacitance is due to various polarization mechanisms, namely electronic polarization (P e ), ionic polarization (P i ), orientation polarization (P o ) and space charge polarization (P sc ). The total polarization of dielectric layer can be expressed as P = P e + P i + P o + P sc. Among these, ionic and electronic polarization are almost independent of applied field. Electronic polarization is due to deformation of electrons in molecules which lead to dipole formation. For the applied field, the induced shift of cations (metal) of molecule with respect to neighbor atoms (oxide) of 83

3 Figure 6.1: Dielectric response and polarization mechanisms with frequency dielectric layer causes induced dipole moment. The polarization of these induced dipoles are called ionic polarization. It occurs for ionically bonded materials (Al 2 O 3, HfO 2 and Ta 2 O 3 ), sometimes called as non-polar dielectrics. Dipolar/orientation polarization is due to polarization of inherent/permanent polar molecules with applied dielectric field. For the applied AC field, the accumulation of charges/carriers at the insulating boundaries (interface and interface traps) is called as space charge polarization or interfacial polarization. Electrode polarization is highly sensitive to frequency because of its time dependency. Fig shows the occurrence of various polarization mechanism in the frequency scale In this model, the susceptibility for ionic and electric polarizations are considered as field independent. The orientation of induced dipoles for the applied field is considered as macroscopic case where the field is uniform through out the dielectric layer. However, according to Lorentz approach, the field can t be uniform within the dipole molecule or a cluster of dipole molecules. For this case, the internal field or local field inside dipole is considered which orients the electronics charges of dipole molecules. This electronic orientation of charges are treated as microscopic case which is known as Clausius Mossotti 84

4 Figure 6.2: (a) Al 2 O 3 Molecule at equilibrium (b) Induced dipole due to bond distortion for the applied field model Macroscopic model In dielectric materials, the voltage dependency of dielectric constant is based on the ionic polarization of induced dipoles and orientation polarization of permanent dipole. The polar dielectric materials have permanent dipoles which offer the polarization due to field. The paraelectric materials, such as Al 2 O 3, TiO 2 and Ta 2 O 3, are called non-polar oxides since they do not have permanent dipoles. The metal and oxygen atoms of paraelectric materials are coupled by ionic bond. This metal-oxygen bond is distorted due to applied field which changes the inter-atomic distance between metal and oxygen atoms. This distortion creates induced dipole in such dielectrics [Talebian and Talebian, 2012]. Fig 6. 1 shows the distortion of metal ions (cations) in Al 2 O 3 which results induced dipole for the applied field. In macroscopic model, the polarization of nonpolar dielectrics is modeled using orientation of induced dipole. If angle between the induced dipole µ = α ie E and the applied electric field is θ, then the average dipole moment can be expressed as M = N di α ie cos 2 θe loc [Neumann, 1986]. Here α ie is the internal electronic polarizability which is a microscopic quantity. E loc is the local electric field within the dipole sphere which changes with respect to the position in dielectric layer from electrode. This is expressed as E loc = λe, for the applied external field E and field correction factor λ. In 85

5 Onsager Model, the neighboring molecules are also affecting the polarization and the field correction factor was derived as λ = 3ε r /[2ε r + 1] [Neumann, 1986]. Using Boltzmann statistics, the mean value of cos 2 θ can be given as, cos 2 θ = ( ) 0 exp αie cos 2 θe loc k B T cos 2 θsinθdθ ( ) π 0 exp αie cos 2 θe loc k B T sinθ dθ π (6.2.1) which can be reduced to 2nd order Langevin function with axial symmetry [Gubin, 2009], cos 2 θ = L 2 (β) = 1 2 L(β) (6.2.2) β where, L(β) = eβ + e β e β e β 1 β = cothβ 1 β (6.2.3) L(β) is referred as Langevin function [Gubin, 2009]. Here β = µe loc k B T. Thus, the average dipole moment can be expressed as, M = N di α e L 2 (β)e loc = N di α e [ 1 2 β L(β) ]E loc (6.2.4) The total orientation polarizability of induced dipoles is α oi = N di M E. Therefore, α o = N di α e L 2 (β) = λn di α e [ 1 2 β L(β) ] (6.2.5) where N di = n di Ad is the number of induced dipoles in dielectric layer with uniform applied electric field E, n di is the density of induced dipoles per cubic volume, A and d are area and thickness of dielectric layer, respectively Microscopic model The molecular electronic orientation is influenced by associated internal field within dipole and the external field. In Lorentz approach, the dipoles are modeled as sphere with few molecule/atoms inside where the total internal electric field for isotropic materials is 86

6 expressed as E int = E ext + E pol [Talebian and Talebian, 2012]. Here, E pol is the field due to polarized charge distribution, expressed as E pol = P 3ε 0 with polarization P. The total polarization per dipole is expressed as, p total = ε 0 αe total [Talebian and Talebian, 2012], therefore, Also, ( P ie = ε 0 N di α ie E + P ) ie 3ε 0 P ie = ε 0N di α ie E 1 N di α ie /3 (6.2.6) (6.2.7) where α ie is internal/induced electronic polarizability of charges within the dipole sphere. Since P = ε 0 (ε r 1)E = ε 0 χ ie E, this equation can be written as, α ie = 3ε 0 N di ( ) εr 1 ε r + 2 (6.2.8) This is called Clausius Mossotti equation. This equation relates the macroscopic element ε r with microscopic element α ie. Using this microscopic and macroscopic models of ionic polarization, the total polarization can be expressed as, P = ( ε 0 χ e + N di [ 3ε0 N di ( )] ) εr 1 L 2 (β) E (6.2.9) ε r + 2 The over all permittivity of dielectric layer of thickness d can be expressed in term of applied bias V (= Ed). The second order Langevin function can be approximated to L 2 (β) β 2 15 for β << 1 or λ µe << k BT [Gubin, 2009], ε (V ) = ε 0 + ε 0 χ e + N di [ 3λε0 N di ( )] εr 1 3 E 2 ε r (k B T ) 2 (6.2.10) This equation can be compared with empirical relation, C (V ) = C 0 ( αv 2 + βv + 1 ), where C 0 is the capacitance at zero bias. Therefore, the quadratic (α) coefficient of 87

7 capacitance is, ( ) 2 [ ε0 α 1.8 λ N di k B T ( )] εr ε r + 2 d 2 (6.2.11) Here, N di is the number of induced dipoles and ε r is the static dielectric constant of material. The model shows that α is inversely proportional to square of the thickness which shows a good agreement with the model proposed by Wenger et al and Phung et al [Phung et al., 2011, Wenger et al., 2008]. It also shows a large dependence with ε r, which indicates that higher dielectric constant materials shall lead to large α. Eq. 6 shows that the α is inversely proportional to temperature, but it is observed that the α shows a linear relation with temperature T in many recent works [Wenger et al., 2008, Kim et al., 2004]. This is due to increase in induced dipole moment with temperature which can be introduced as M (T ) = MηT. Here η is the increment factor of linear relation for the temperature T. This yields, ( ) 2 [ ε0 α 1.8 λη N di k B ( )] εr 1 3 T ε r + 2 d 2 (6.2.12) The polarization due to permanent dipoles of paraelectric materials can be modeled in accordance with [Phung et al., 2011]. Therefore, we can introduce the orientation polarization P o = N pd µ d L(β) in Eq as described in [Phung et al., 2011], where N pd is the number of permanent dipoles and µ pd is the dipole moment. It is observed that L(β) converges to unity much faster than L 2 (β) [Gubin, 2009] which indicates that the polar dielectric material show a high α than that of paraelectrics Model verification Quadratic coefficient of capacitance α is extracted from measured C-V characteristics using ( empirical relation C (V ) = C 0 αv 2 + βv + 1 ). For both TiO 2 and Al 2 O 3 MIM capacitors, the modeled and extracted α are plotted as a function of dielectric thickness in Fig Measured values of α of HfO 2 and Y 2 O 3 MIM capacitors for various thicknesses are available in [Wenger et al., 2008], which is also included in Fig to validate the model. Fitting parameters of the model for all materials are presented in Table Al 2 O 3 shows 88

8 α-vcc (ppm/v 2 ) Model(Alumina) Measured (Alumina) Model(Titania) Measured (Titania) Model(Y2O3) Measured (Y2O3) Model(Hafinia) Measured (Hafinia) Thickness (nm) Figure 6.3: Measured and modeled quadratic coefficient of capacitance α of various MIM capacitors [Kannadassan et al., 2012a,b, Wenger et al., 2008]. Material Al 2 O 3 TiO 2 HfO 2 Y 2 O 3 Dielectric constant (ε r ) Induced dipole density (N di ) (10 22 /cm 3 ) Table 6.1: Material parameters for modeling low α and good agreement with measured data. The crystalline state and strong ionic bond of anodic Al 2 O 3 also support in reduction of α. It is observed that for the anodic TiO 2 capacitor, with same thickness of 15nm, the α decreases for higher anodization voltages due to transformation of amorphous to crystalline state which reduces the dependency of field. HfO 2 and Y 2 O 3 MIM capacitors show a good fit with our model. Fig shows the fitting compatibility of model with measured quadratic coefficient of capacitance at various temperatures. It is observed that titania MIM capacitor shows a strong dependence with temperature. This is due to week ionic bond which lead to large distortion of metal atoms. MIM capacitors with alumina shows a low dependence with temperature as thickness increases. It is due to decrease in field as thickness increases which intern reduces the local field. Also the ionic bond is strong and less sensitive to temperature. The model can be used to explore the limitation of thickness and dielectric constant to meet the ITRS requirement. Fig shows the required physical thickness of dielectric layer to meet α = 100ppm/V 2, assuming the average density of dipoles N di = per cm 3. It is observed that required thickness d increases with dielectric constant ε r. However, 89

9 Capacitance density (ff/μm 2 ) Thickness d (nm) α-vcc (ppm/v 2 ) Model(14nm-Alumina) Measured (14nm-Alumina) Model(22nm-Alumina) Measured (22-Alumina) Model(15nm-Titania) Measured (15nm-Titania) η=2.7 η=3.9 η= Temperature ( o C) Figure 6.4: Measured and modeled quadratic coefficient of capacitance α of various Temperature α = 100ppm /V 2 α = 200ppm /V ITRS α = 100ppm α = 200ppm ε r Dielectric Constant ε r Figure 6.5: Required thickness of dielectric to meet the ITRS recommendations for various dielectric constants. it saturates to 100nm after ε r 30. This indicates that the high dielectric constant MIM capacitors require > 100nm thickness of dielectric layer to meet the ITRS recommendation. Fig also shows the required thickness if α = 200ppm/V 2 is acceptable, which shows 20% reduction in thickness. Inset of Fig shows the maximum achievable capacitance density for the extracted thickness to meet α = 100ppm/V 2 and α = 200ppm/V 2. Fig and its inset are highly useful to select the material thickness and electrode area as per the IC design requirement. For vertical or thickness miniaturization, one should go for low dielectric material with higher electrode area to achieve high capacitance. For horizontal or area reduction of ICs, the thicker and higher dielectric constant layer is preferable. However, the technology limitations such as oxidation rate, deposition rate, defect density and ionic bonding of material play a major role in the performance of MIM capacitors. 90

10 6.3 Modeling of C-V characteristics of bilayer MIM capacitors High-k multilayer dielectric stack MIM capacitors were proposed by many authors in recent years [Kaynak et al., 2011, Kim et al., 2004, Wu et al., 2012, Tsui and Cheng, 2010]. It is observed that the voltage coefficient of capacitance (VCC) is higher at low frequencies than high frequencies. This is due to migration and accumulation of charges at the interface of dielectrics. Such accumulated charges are polarized due to the applied field and the mechanism is called as Maxwell-Wagener polarization [Sillars, 1937]. Maxwell Wagner (MW) polarization was observed in many ferroelectric heterostructures [Erbil et al., 1996, Qu et al., 1998, O Neill et al., 2000, Catalan et al., 2000, Shen et al., 2001]. The grains of two different ferroelectric materials form heterostructures which lead to accumulation of charges for applied field. This accumulation of charges enhances the dielectric constant of the entire material stack. Giant dielectric constant ( 1000) from TiO 2 /Al 2 O 3 multilayer was achieved by Wei Li et al [Li et al., 2010]. This multilayer laminate structure was fabricated with ALD deposition of 1A o Al 2 O 3 and 0.3A o TiO 2. The interface accumulation yields a high dielectric constant because of MW polarization. Recently, MW effect has been found in MOS device by Jinesh et al [Jinesh et al., 2009]. It can be noted that the MW charge accumulation is observed in forward bias only, i. e., the charge injection from high conductive semiconductor to low conductive high-k material. The approach of imaginary permittivity (ε ) to in forward bias at low frequencies indicates the presence of MW polarization [Jinesh et al., 2009]. However, these reports were ignored the dependence of applied potential across the dielectric stack. The measured capacitance voltage characteristics of samples AT3 and AT4 at low frequencies ( 10kHz) are shown in Fig The characteristics are asymmetric and frequency dependent. This is due to the accumulation of charges for reverse bias which enhances the capacitance. This indicates the MW polarization of accumulated charges is voltage dependent. It is also observed that the maximum capacitance at reverse bias 91

11 Capacitance density (ff/μm 2 ) Capacitance density (ff/μm 2 ) Measured(1KHz) Measured(1KHz) Measured(5KHz) Measured(5KHz) Measured(10KHz) Measured(10KHz) Applied Voltage (V) Applied Voltage (V) Figure 6.6: Measured Capacitance Voltage at low frequencies for two bilayer samples at room temperature decreases with increment in frequency. This is due to large relaxation time of accumulated interfacial charges. In this chapter, the interfacial charge density and capacitance due to applied AC field are studied in detail. A model for capacitace-voltage characteristics is proposed using MW polarization model of interfacial charges and compared with measured results at various frequencies C-V modeling with Maxwell-Wagner polarization James Clerk Maxwell was the first man who coined the physics of conduction through heterogeneous media [Maxwell, 1873]. He considered a dielectric material consists of sphere of another dielectric material which forms heterogeneous or discontinuity. He mathematically proved that the fields on both the spheres are not equal. He also claimed that when a set of sheets of alternative dielectric materials kept transverse to field, charge accumulation at the interfaces will take place. This theory was extended by Wagner and Sillars later with proper experimental setup [Sillars, 1937]. It was observed that the effective dielectric constant of dielectric stacks was enhanced by accumulation of charges at interfaces of materials which is named as Maxwell-Wagner polarization. In this part of the chapter, we assumed a simple dielectric stack of two materials, TiO 2 and Al 2 O 3. A CV model is proposed using MW polarization theory to examine the interface of anodic bilayer system at low frequencies. 92

12 ε 1, σ 1 ε 2, σ 2 E R 1 C 1 C MW R 2 C 2 (a) (b) Figure 6.7: Schematic of bilayer configuration (a) Layer specification, (b) Equivalent circuit at low frequencies. A bilayer dielectric MIM structure is shown in Fig (a). This two dielectric materials have permittivities of ε r1 and ε r2 with thickness of d 1 and d 2 respectively. Conductivity and relaxation time of these layers are represented as σ n and τ n, respectively. Fig (b) shows the equivalent RC network of bilayer MIM structure. C MW is interfacial capacitance due to accumulation of charges, also called Maxwell-Wagner capacitance. This capacitance is significant at low frequencies. The total capacitance can be expressed as, ( 1 C tot (V B ) = + 1 ) 1 +C MW (V B ) (6.3.1) C 1 C 2 where C MW = A.q 2.N MW [Sze and Ng, 2006] where q is charge of an electron and A is top electrode area of capacitor. According to MW theory of double layer [Maxwell, 1873, Morshuis et al., 2007], the accumulated charge density at the interface as a function of applied potential and time is expressed as, [ ] [ ( (εr1 σ 2 ε r2 σ 1 ) N MW = ε 0.V stack. 1 e σ 1 d 2 + σ 2 d 1 t τ MW )], (6.3.2) where V stack = V B V bi is voltage across the bilayer dielectric stack for the applied bias voltage V B over a time period of t. V bi is built in potential at interface due to accumulated interface charges and native interface traps. τ MW relaxation time of double layer which can be expressed as 93

13 τ MW = (d 1ε 2 + d 2 ε 1 ) (d 1 σ 2 + d 2 σ 1 ) (6.3.3) τ MW is in the order of micro-seconds. If the time t is very greater than τ MW, then the third term vanishes. This yields This equation can be rearranged as, [ ] (εr1 σ 2 ε r2 σ 1 ) N MW = ε 0. V B V bi, (6.3.4) σ 1 d 2 + σ 2 d 1 N MW = ( ) σ 1.σ ε1 2 σ 1 ε 2 σ 2 d 1.d 2 ( σ1 d 1 + σ 2 d 2 ) V B V bi. (6.3.5) We know, τ 1 = ε 1 σ 1 & τ 2 = ε 2 σ 2 and G 1 = σ 1 d 1 & G 2 = σ 2 d 2. By replacing these, ( ) G1 G 2 N MW =.(τ 1 τ 2 ). V B V bi (6.3.6) G 1 + G 2 here G 1G 2 G 1 +G 2 = G, where G is total conductance of bilayer. Therefore, Eq can be reduced to, N MW = G.(τ 1 τ 2 ). V B V bi (6.3.7) The total conductance G is a frequency sensitive term. It is expressed as G = ωc 0 ε, where ε is imaginary part of dielectric permittivity. ε of bilayer dielectric stack was derived by Wagner [O Neill et al., 2000], ε = 1 + ω2 ((τ MW.τ 1 ) + (τ MW.τ 2 ) (τ 1.τ 2 )) ωc 0 (R 1 + R 2 ) ( 1 + ω 2 τmw 2 ) (6.3.8) and, thus Eq. ( ) can be rewritten as N WM = 1 + ω2 ((τ MW.τ 1 ) + (τ MW.τ 2 ) (τ 1.τ 2 )) (R 1 + R 2 ) ( 1 + ω 2 τmw 2 ).(τ 1 τ 2 ). V B V bi (6.3.9) 94

14 Capacitance density (ff/μm 2 ) Capacitance density (ff/μm2) Model(1KHz) Measured(1KHz) Model(5KHz) Measured(5KHz) Model(10KHz) Measured(10KHz) Model(1KHz) Measured(1KHz) Model(5KHz) Measured(5KHz) Model(10KHz) Measured(10KHz) Applied Voltage (V) Applied Voltage (V) Figure 6.8: MW Capacitance Voltage Model (without tunneling probability) and Measured C-V fitting compatibility for samples (a) AT-3, (b) AT-4 Sample σ d 1 (nm) d 2 (nm) ε r1 ε 1 σ 2 φ 1 (ev ) φ 2 (ev ) V bi (V ) name r2 (ps/cm) (ps/cm) AT AT Table 6.2: Fitting parameters of Maxwell-Wagener capacitance model The compatibility of the proposed model with measured capacitance for the applied voltages at various frequencies is shown in Fig (a) and 6. 8 (b) for AT-3 and AT-4 respectively. Table 6. 1 shows the parameters adopted for fitting this model with measured capacitance. The model is not compatible with measured CV characteristics. This is due to linear relation of applied voltage with accumulated charge density. According to Maxwell and Wagner, the dielectric layers are thick and pure insulators which do not conduct. But the fabricated bilayer has nanostructured thin films which has sufficiently large conductivity. One can observed this from Fig This migration of charges for the applied potential can be incorporated to Eq. ( ). Tunneling probability of charges across the bilayer can be introduced using trap assisted tunneling model [Houssa et al., 2000]. Therefore, Eq. ( ) can be rewritten as, N MW (V B ) = q ω2 ((τ MW.τ 1 ) + (τ MW.τ 2 ) (τ 1.τ 2 )) (R 1 + R 2 ) ( 1 + ω 2 τmw 2 ).(τ 1 τ 2 ). (V B V bi ){1 exp[(qv stack φ 1 + φ 2 )/k B T ]} (6.3.10) 95

15 Capacitance density (ff/μm 2 ) Capacitance density (ff/μm 2 ) Model(1KHz) Model(1KHz) Measured(1KHz) Model(5KHz) Measured(1KHz) Model(5KHz) Measured(5KHz) Model(10KHz) Measured(10KHz) Measured(5KHz) Model(10KHz) Measured(10KHz) Applied Voltage (V) Applied Voltage (V) Figure 6.9: MW Capacitance Voltage Model (with tunneling probability) and Measured C-V fitting compatibility for samples (a) AT-3, (b) AT-4 Fig (a) and 6. 9 (b) show the fitting compatibility of model with tunneling probability which shows a better fit with measured data. The capacitance enhancement is not observed in forward bias because the accumulation of charges is not happened. This indicate that the MW polarization occurs only when the field travels from high conductive material to low. Similar effect is observed in MOS devices [Li et al., 2010]. This is due to both the permittivity and bandgap of dielectric materials. MW effect of permittivity enhancement in bilayer MIM capacitors leads to increase in VCC at low frequencies. It is observed that the ratio of permittivity of both dielectric material (R di = ε r1 /ε r2 ) determines the MW capacitance. For instance, TiO 2 /Al 2 O 3 has R di = 90/9 = 10 which shows a capacitance enhancement of twice compared to series capacitance of bilayer in our experiments. At the same time, sandwich of TiO 2 and Al 2 O 3 multilayer stack shows a giant dielectric constant of > 500 times of single layer MIM strucutre [Li et al., 2010]. Therefore, the dependence of capacitance with voltage can be reduced by choosing the materials with less R di, such as ZrO 2 /HfO 2 (29/25=1.16) and HfO 2 /Al 2 O 3 (29/9=3.22). 6.4 Summary In this chapter, the modeling of capacitance-voltage characteristics and it s nonlinearity for single and multilayer MIM capacitors are presented in detail. The ionic polarization and 96

16 orientation polarization are statistically incorporated to formulate the dielectric constant of single layer dielectrics. The quadratic coefficient of capacitance, α, is modeled with microscopic and macroscopic ionic polarization of induced dipole. It is observed that the distortion of ionic bond in dielectric molecule for the applied field leads to such dependence of capacitance with applied voltage. This indicates the strong ionic bond between metal-oxygen which should be enhanced during fabrication process with some additional techniques, such as annealing or re-anodization. It predicts that the coefficient α is inversely proportional to thickness of dielectric layer and directly proportional to dielectric constant. These observations have good agreement with experimental data of anodic Al 2 O 3 and TiO 2 MIM capacitors. The model also helps to find the required thickness of high-k dielectric materials in MIM capacitors to meet the ITRS recommendations. C-V characteristics of bilayer MIM capacitors are derived from Maxwell approach on accumulation of charges at dielectric interface. The voltage dependence of permittivity enhancement with Wagner equation on space charge polarization is derived. The model shows good agreement with experimental results. It is observed that the Maxwell-Wagener polarization occurs at low frequencies and largely depends on field direction. The charge built-up due to tunneling and accumulation have added more accuracy compared to the ideal case. 97

Chap. 7. Dielectric Materials and Insulation

Chap. 7. Dielectric Materials and Insulation Chap. 7. Dielectric Materials and Insulation - The parallel plate capacitor with free space as an insulator: - The electric dipole moment for a pair of opposite changes +Q and -Q separated by a finite

More information

Challenges and Opportunities. Prof. J. Raynien Kwo 年

Challenges and Opportunities. Prof. J. Raynien Kwo 年 Nanoelectronics Beyond Si: Challenges and Opportunities Prof. J. Raynien Kwo 年 立 Si CMOS Device Scaling Beyond 22 nm node High κ,, Metal gates, and High mobility channel 1947 First Transistor 1960 1960

More information

J. Price, 1,2 Y. Q. An, 1 M. C. Downer 1 1 The university of Texas at Austin, Department of Physics, Austin, TX

J. Price, 1,2 Y. Q. An, 1 M. C. Downer 1 1 The university of Texas at Austin, Department of Physics, Austin, TX Understanding process-dependent oxygen vacancies in thin HfO 2 /SiO 2 stacked-films on Si (100) via competing electron-hole injection dynamic contributions to second harmonic generation. J. Price, 1,2

More information

Chapter 6 ELECTRICAL CONDUCTIVITY ANALYSIS

Chapter 6 ELECTRICAL CONDUCTIVITY ANALYSIS Chapter 6 ELECTRICAL CONDUCTIVITY ANALYSIS CHAPTER-6 6.1 Introduction The suitability and potentiality of a material for device applications can be determined from the frequency and temperature response

More information

CHAPTER 6 DIELECTRIC AND CONDUCTIVITY STUDIES OF ZIRCONIUM TIN TITANATE (ZST)

CHAPTER 6 DIELECTRIC AND CONDUCTIVITY STUDIES OF ZIRCONIUM TIN TITANATE (ZST) 123 CHAPTER 6 DIELECTRIC AND CONDUCTIVITY STUDIES OF ZIRCONIUM TIN TITANATE (ZST) 6.1 INTRODUCTION We know that zirconium tin titanate ceramics are mostly used in microwave frequency applications. Previous

More information

Properties of Materials

Properties of Materials Tao Deng, dengtao@sjtu.edu.cn 1 1896 1920 1987 2006 Properties of Materials Chapter 3 Electrical Properties of Materials Tao Deng 3.1.4.4 The superconducting tunneling effect (Josephson effect) Tao Deng,

More information

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e) (a) (b) Supplementary Figure 1. (a) An AFM image of the device after the formation of the contact electrodes and the top gate dielectric Al 2 O 3. (b) A line scan performed along the white dashed line

More information

Physikalisches Praktikum für Fortgeschrittene 1 Dielectric Constant Assistent: Herr Dr. M. Ghatkesar by Therese Challand theres.

Physikalisches Praktikum für Fortgeschrittene 1 Dielectric Constant Assistent: Herr Dr. M. Ghatkesar by Therese Challand theres. Physikalisches Praktikum für Fortgeschrittene 1 Dielectric Constant Assistent: Herr Dr. M. Ghatkesar by Therese Challand theres.challand stud.unibas.ch Contents 1 Theory 1 1.1 Introduction............................

More information

Advanced Vitreous State The Physical Properties of Glass

Advanced Vitreous State The Physical Properties of Glass Advanced Vitreous State The Physical Properties of Glass Dielectric Properties of Glass Lecture 1: Dielectric in Static Field Himanshu Jain Department of Materials Science & Engineering Lehigh University,

More information

Steep-slope WSe 2 Negative Capacitance Field-effect Transistor

Steep-slope WSe 2 Negative Capacitance Field-effect Transistor Supplementary Information for: Steep-slope WSe 2 Negative Capacitance Field-effect Transistor Mengwei Si, Chunsheng Jiang, Wonil Chung, Yuchen Du, Muhammad A. Alam, and Peide D. Ye School of Electrical

More information

Frequency dispersion effect and parameters. extraction method for novel HfO 2 as gate dielectric

Frequency dispersion effect and parameters. extraction method for novel HfO 2 as gate dielectric 048 SCIENCE CHINA Information Sciences April 2010 Vol. 53 No. 4: 878 884 doi: 10.1007/s11432-010-0079-8 Frequency dispersion effect and parameters extraction method for novel HfO 2 as gate dielectric LIU

More information

ECE 340 Lecture 39 : MOS Capacitor II

ECE 340 Lecture 39 : MOS Capacitor II ECE 340 Lecture 39 : MOS Capacitor II Class Outline: Effects of Real Surfaces Threshold Voltage MOS Capacitance-Voltage Analysis Things you should know when you leave Key Questions What are the effects

More information

Chapter 4. Electrostatic Fields in Matter

Chapter 4. Electrostatic Fields in Matter Chapter 4. Electrostatic Fields in Matter 4.1. Polarization 4.2. The Field of a Polarized Object 4.3. The Electric Displacement 4.4. Linear Dielectrics 4.5. Energy in dielectric systems 4.6. Forces on

More information

MaxCaps Next Generation Dielectrics for Integrated Capacitors

MaxCaps Next Generation Dielectrics for Integrated Capacitors MaxCaps Next Generation Dielectrics for Integrated Capacitors Guenther Ruhl Infineon Technologies AG Σ! 2365 Semicon Europa 2011 Dresden, October 11, 2011 October 11, 2011 1 Outline Introduction MaxCaps

More information

Metal Semiconductor Contacts

Metal Semiconductor Contacts Metal Semiconductor Contacts The investigation of rectification in metal-semiconductor contacts was first described by Braun [33-35], who discovered in 1874 the asymmetric nature of electrical conduction

More information

Fabrication and Characterization of Al/Al2O3/p-Si MOS Capacitors

Fabrication and Characterization of Al/Al2O3/p-Si MOS Capacitors Fabrication and Characterization of Al/Al2O3/p-Si MOS Capacitors 6 MOS capacitors were fabricated on silicon substrates. ALD deposited Aluminum Oxide was used as dielectric material. Various electrical

More information

EVALUATION OF A.C. CONDUCTIVITY FOR LEAD SILICATE GLASS FROM DIELECTRIC MEASUREMENTS

EVALUATION OF A.C. CONDUCTIVITY FOR LEAD SILICATE GLASS FROM DIELECTRIC MEASUREMENTS Journal of Electron Devices, Vol. 12, 2012, pp. 750-755 JED [ISSN: 1682-3427 ] EVALUATION OF A.C. CONDUCTIVITY FOR LEAD SILICATE GLASS FROM DIELECTRIC MEASUREMENTS D.K. Mahde, B.T.Chiad, Ghuson H.Mohamed

More information

An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B

An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B Thin Solid Films 488 (2005) 167 172 www.elsevier.com/locate/tsf An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B S.C. Chen a, T, J.C. Lou a, C.H. Chien

More information

Novel Devices and Circuits for Computing

Novel Devices and Circuits for Computing Novel Devices and Circuits for Computing UCSB 594BB Winter 213 Lectures 5 and 6: VCM cell Class Outline VCM = Valence Change Memory General features Forming SET and RESET Heating Switching models Scaling

More information

3.3 Capacitance, relative permittivity & dielectrics 4

3.3 Capacitance, relative permittivity & dielectrics 4 3.3 Capacitance, relative permittivity & dielectrics 4 +Q d E Gaussian surface Voltage, V Q Fig. 3.2. Parallel plate capacitor with the plates separated by a distance d which have been charged by a power

More information

MOS CAPACITOR AND MOSFET

MOS CAPACITOR AND MOSFET EE336 Semiconductor Devices 1 MOS CAPACITOR AND MOSFET Dr. Mohammed M. Farag Ideal MOS Capacitor Semiconductor Devices Physics and Technology Chapter 5 EE336 Semiconductor Devices 2 MOS Capacitor Structure

More information

Dielectric Properties of Solids

Dielectric Properties of Solids Dielectric Properties of Solids Electric polarization In an insulator the electrons are so tightly bound that at ordinary temperatures they cannot be dislodged either by thermal vibrations or with ordinary

More information

Chapter 2. Dielectric Theories

Chapter 2. Dielectric Theories Chapter Dielectric Theories . Dielectric Theories 1.1. Introduction Measurements of dielectric properties of materials is very important because it provide vital information regarding the material characteristics,

More information

The Power of Feedback: From Dielectric to Ferroelectric Systems

The Power of Feedback: From Dielectric to Ferroelectric Systems 140 International Journal of Plasma Environmental Science & Technology, Vol.10, No.2, DECEMBER 2016 The Power of Feedback: From Dielectric to Ferroelectric Systems H. Kliem and A. Leschhorn Institute of

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

Dielectrics 9.1 INTRODUCTION 9.2 DIELECTRIC CONSTANT

Dielectrics 9.1 INTRODUCTION 9.2 DIELECTRIC CONSTANT 9 Dielectrics 9.1 INTRODUCTION A dielectric is an insulating material in which all the electrons are tightly bound to the nuclei of the atoms and there are no free electrons available for the conduction

More information

Introduction to solid state physics

Introduction to solid state physics PHYS 342/555 Introduction to solid state physics Instructor: Dr. Pengcheng Dai Professor of Physics The University of Tennessee (Room 407A, Nielsen, 974-1509) Chapter 13: Dielectrics and ferroelectrics

More information

Chapter 3 Modeling and Simulation of Dye-Sensitized Solar Cell

Chapter 3 Modeling and Simulation of Dye-Sensitized Solar Cell Chapter 3 Modeling and Simulation of Dye-Sensitized Solar Cell 3.1. Introduction In recent years, dye-sensitized solar cells (DSSCs) based on nanocrystalline mesoporous TiO 2 films have attracted much

More information

Control of Flat Band Voltage by Partial Incorporation of La 2 O 3 or Sc 2 O 3 into HfO 2 in Metal/HfO 2 /SiO 2 /Si MOS Capacitors

Control of Flat Band Voltage by Partial Incorporation of La 2 O 3 or Sc 2 O 3 into HfO 2 in Metal/HfO 2 /SiO 2 /Si MOS Capacitors Control of Flat Band Voltage by Partial Incorporation of La 2 O 3 or Sc 2 O 3 into HfO 2 in Metal/HfO 2 /SiO 2 /Si MOS Capacitors M. Adachi 1, K. Okamoto 1, K. Kakushima 2, P. Ahmet 1, K. Tsutsui 2, N.

More information

Lecture 9: Metal-semiconductor junctions

Lecture 9: Metal-semiconductor junctions Lecture 9: Metal-semiconductor junctions Contents 1 Introduction 1 2 Metal-metal junction 1 2.1 Thermocouples.......................... 2 3 Schottky junctions 4 3.1 Forward bias............................

More information

Extrinsic and Intrinsic Frequency Dispersion of High-k Materials in Capacitance-Voltage Measurements

Extrinsic and Intrinsic Frequency Dispersion of High-k Materials in Capacitance-Voltage Measurements Materials 01, 5, 1005-103; doi:10.3390/ma5061005 Review OPEN ACCESS materials ISSN 1996-1944 www.mdpi.com/journal/materials Extrinsic and Intrinsic Frequency Dispersion of High-k Materials in Capacitance-Voltage

More information

e - Galvanic Cell 1. Voltage Sources 1.1 Polymer Electrolyte Membrane (PEM) Fuel Cell

e - Galvanic Cell 1. Voltage Sources 1.1 Polymer Electrolyte Membrane (PEM) Fuel Cell Galvanic cells convert different forms of energy (chemical fuel, sunlight, mechanical pressure, etc.) into electrical energy and heat. In this lecture, we are interested in some examples of galvanic cells.

More information

DEPARTMENT OF ELECTRICAL ENGINEERING DIT UNIVERSITY HIGH VOLTAGE ENGINEERING

DEPARTMENT OF ELECTRICAL ENGINEERING DIT UNIVERSITY HIGH VOLTAGE ENGINEERING UNIT 1: BREAKDOWN IN SOLIDS 1.) Introduction: The solid dielectric materials are used in all kinds of electrical apparatus and devices to insulate current carrying part from another when they operate at

More information

DIELECTRIC SPECTROSCOPY. & Comparison With Other Techniques

DIELECTRIC SPECTROSCOPY. & Comparison With Other Techniques DIELECTRIC SPECTROSCOPY & Comparison With Other Techniques DIELECTRIC SPECTROSCOPY measures the dielectric and electric properties of a medium as a function of frequency (time) is based on the interaction

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Chenming Hu.

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Chenming Hu. UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Spring 2009 Professor Chenming Hu Midterm I Name: Closed book. One sheet of notes is

More information

Analysis and modelling of dielectric relaxation data using DCALC

Analysis and modelling of dielectric relaxation data using DCALC Analysis and modelling of dielectric relaxation data using DCALC Michael Wübbenhorst Short course, Lodz, 8 October 2008 Part I dielectric theory, representation of data Schedule 1 st session (8 October

More information

Transduction Based on Changes in the Energy Stored in an Electrical Field

Transduction Based on Changes in the Energy Stored in an Electrical Field Lecture 6-1 Transduction Based on Changes in the Energy Stored in an Electrical Field Electric Field and Forces Suppose a charged fixed q 1 in a space, an exploring charge q is moving toward the fixed

More information

Materials and Devices in Electrical Engineering

Materials and Devices in Electrical Engineering Examination WS 02/03 Materials and Devices in Electrical Engineering Monday 17 th of March, 9:00 11:00, International Department, SR. 203 Notice 1. It is allowed to use any kind of aids (books, scripts,

More information

This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented.

This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented. This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented. References IEICE Electronics Express, Vol.* No.*,*-* Effects of Gamma-ray radiation on

More information

Dielectric Materials: Properties and Applications

Dielectric Materials: Properties and Applications Dielectric Materials: Properties and Applications Content 1. Dielectrics : Properties 2. Fundamental definitions and Properties of electric dipole 3. Various polarization mechanisms involved in dielectric

More information

Classification of Dielectrics & Applications

Classification of Dielectrics & Applications Classification of Dielectrics & Applications DIELECTRICS Non-Centro- Symmetric Piezoelectric Centro- Symmetric Pyroelectric Non- Pyroelectric Ferroelectrics Non-Ferroelectric Piezoelectric Effect When

More information

Characterization of Charge Trapping and Dielectric Breakdown of HfAlOx/SiON Dielectric Gate Stack

Characterization of Charge Trapping and Dielectric Breakdown of HfAlOx/SiON Dielectric Gate Stack Characterization of Charge Trapping and Dielectric Breakdown of HfAlOx/SiON Dielectric Gate Stack Y. Pei, S. Nagamachi, H. Murakami, S. Higashi, S. Miyazaki, T. Kawahara and K. Torii Graduate School of

More information

Energy Stored in Capacitors

Energy Stored in Capacitors Energy Stored in Capacitors U = 1 2 qv q = CV U = 1 2 CV 2 q 2 or U = 1 2 C 37 Energy Density in Capacitors (1) We define the, u, as the electric potential energy per unit volume Taking the ideal case

More information

Defects in Semiconductors

Defects in Semiconductors Defects in Semiconductors Mater. Res. Soc. Symp. Proc. Vol. 1370 2011 Materials Research Society DOI: 10.1557/opl.2011. 771 Electronic Structure of O-vacancy in High-k Dielectrics and Oxide Semiconductors

More information

HIGH VOLTAGE TECHNIQUES Basic Electrode Systems

HIGH VOLTAGE TECHNIQUES Basic Electrode Systems HIGH VOLTAGE TECHNIQUES Basic Electrode Systems Basic electrode systems Different configurations Parallel plate electrodes Co-axial cylinders Concentric spheres Parallel plate electrodes Plane-plane electrode

More information

Cascade-Like Nonlinearity Caused by Local-Field Effects: Extending Bloembergen's Result

Cascade-Like Nonlinearity Caused by Local-Field Effects: Extending Bloembergen's Result Cascade-Like Nonlinearity Caused by Local-Field Effects: Extending Bloembergen's Result Ksenia Dolgaleva 1, Robert W. Boyd 1, and John E. Sipe 2 1 Institute of Optics, University of Rochester 2 Department

More information

an introduction to Semiconductor Devices

an introduction to Semiconductor Devices an introduction to Semiconductor Devices Donald A. Neamen Chapter 6 Fundamentals of the Metal-Oxide-Semiconductor Field-Effect Transistor Introduction: Chapter 6 1. MOSFET Structure 2. MOS Capacitor -

More information

Ferroelectrics investigation

Ferroelectrics investigation Ferroelectrics investigation. Introduction A dielectric is understood as a material where the electric field induces an electric momentum. Let s consider a vacuum capacitor made of two planar metallic

More information

Objective: Competitive Low-Cost Thin-Film Varactor Technology. Integrated Monolithic Capacitors using Sputtered/MOCVD material on low-cost substrates

Objective: Competitive Low-Cost Thin-Film Varactor Technology. Integrated Monolithic Capacitors using Sputtered/MOCVD material on low-cost substrates Overview of Program Objective: Competitive Low-Cost Thin-Film Varactor Technology coplanar waveguide (CPW) capacitor ground signal ground Si substrate etched troughs Focus of Our Program! Reproducibility!

More information

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University

MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University MSE 310/ECE 340: Electrical Properties of Materials Fall 2014 Department of Materials Science and Engineering Boise State University Practice Final Exam 1 Read the questions carefully Label all figures

More information

ECE 305 Exam 3: Spring 2015 March 6, 2015 Mark Lundstrom Purdue University

ECE 305 Exam 3: Spring 2015 March 6, 2015 Mark Lundstrom Purdue University NAME: PUID: : ECE 305 Exam 3: March 6, 2015 Mark Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula sheet at the end of this exam Following the ECE policy,

More information

During such a time interval, the MOS is said to be in "deep depletion" and the only charge present in the semiconductor is the depletion charge.

During such a time interval, the MOS is said to be in deep depletion and the only charge present in the semiconductor is the depletion charge. Q1 (a) If we apply a positive (negative) voltage step to a p-type (n-type) MOS capacitor, which is sufficient to generate an inversion layer at equilibrium, there is a time interval, after the step, when

More information

Materials and Devices in Electrical Engineering

Materials and Devices in Electrical Engineering Examination WS 01/02 Materials and Devices in Electrical Engineering Monday 11 th of March, 9:00 to 11:00, SR 203, International Department building It is allowed to use any kind of media (books, scripts,

More information

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures 034 Chin. Phys. B Vol. 19, No. 5 2010) 057303 Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures Liu Hong-Xia ), Wu Xiao-Feng ), Hu Shi-Gang

More information

ESO 205 Nature and Properties of Materials

ESO 205 Nature and Properties of Materials Dielectric Materials Topics to discuss Principles of dielectrics Dielectrics Loss and Breakdown Polarizations Frequency dependence Ferro-, Piezo- and Pyro- electrics ESO 205 Nature and Properties of Materials

More information

Phase Transitions in Strontium Titanate

Phase Transitions in Strontium Titanate Phase Transitions in Strontium Titanate Xinyue Fang Department of Physics, University of Illinois at Urbana-Champaign Abstract Strontium Titanate SrTiO 3 (STO) is known to undergo an antiferrodistortive

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 10/02/2007 MS Junctions, Lecture 2 MOS Cap, Lecture 1 Reading: finish chapter14, start chapter16 Announcements Professor Javey will hold his OH at

More information

Leakage Mechanisms. Thin films, fully depleted. Thicker films of interest for higher voltage applications. NC State

Leakage Mechanisms. Thin films, fully depleted. Thicker films of interest for higher voltage applications. NC State Leakage Mechanisms Thin films, fully depleted Leakage controlled by combined thermionic / field emission across the Schottky barrier at the film-electrode interfaces. Film quality effects barrier height,

More information

EE650R: Reliability Physics of Nanoelectronic Devices Lecture 18: A Broad Introduction to Dielectric Breakdown Date:

EE650R: Reliability Physics of Nanoelectronic Devices Lecture 18: A Broad Introduction to Dielectric Breakdown Date: EE650R: Reliability Physics of Nanoelectronic Devices Lecture 18: A Broad Introduction to Dielectric Breakdown Date: Nov 1, 2006 ClassNotes: Jing Li Review: Sayeef Salahuddin 18.1 Review As discussed before,

More information

Low Frequency Noise in MoS 2 Negative Capacitance Field-effect Transistor

Low Frequency Noise in MoS 2 Negative Capacitance Field-effect Transistor Low Frequency Noise in MoS Negative Capacitance Field-effect Transistor Sami Alghamdi, Mengwei Si, Lingming Yang, and Peide D. Ye* School of Electrical and Computer Engineering Purdue University West Lafayette,

More information

Continuous, Highly Flexible and Transparent. Graphene Films by Chemical Vapor Deposition for. Organic Photovoltaics

Continuous, Highly Flexible and Transparent. Graphene Films by Chemical Vapor Deposition for. Organic Photovoltaics Supporting Information for Continuous, Highly Flexible and Transparent Graphene Films by Chemical Vapor Deposition for Organic Photovoltaics Lewis Gomez De Arco 1,2, Yi Zhang 1,2, Cody W. Schlenker 2,

More information

Resonant photo-ionization of point defects in HfO 2 thin films observed by second-harmonic generation.

Resonant photo-ionization of point defects in HfO 2 thin films observed by second-harmonic generation. Optics of Surfaces & Interfaces - VIII September 10 th, 2009 Resonant photo-ionization of point defects in HfO 2 thin films observed by second-harmonic generation. Jimmy Price and Michael C. Downer Physics

More information

Electrical Properties

Electrical Properties Electrical Properties Electrical Conduction R Ohm s law V = IR I l Area, A V where I is current (Ampere), V is voltage (Volts) and R is the resistance (Ohms or ) of the conductor Resistivity Resistivity,

More information

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD Chapter 4 DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD 4.1 INTRODUCTION Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering

More information

Moores Law for DRAM. 2x increase in capacity every 18 months 2006: 4GB

Moores Law for DRAM. 2x increase in capacity every 18 months 2006: 4GB MEMORY Moores Law for DRAM 2x increase in capacity every 18 months 2006: 4GB Corollary to Moores Law Cost / chip ~ constant (packaging) Cost / bit = 2X reduction / 18 months Current (2008) ~ 1 micro-cent

More information

Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET

Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET Microelectronics Reliability xxx (2007) xxx xxx www.elsevier.com/locate/microrel Electrical measurements of voltage stressed Al 2 O 3 /GaAs MOSFET Z. Tang a, P.D. Ye b, D. Lee a, C.R. Wie a, * a Department

More information

A comparison study on hydrogen sensing performance of Pt/MoO3 nanoplatelets coated with a thin layer of Ta2O5 or La2O3

A comparison study on hydrogen sensing performance of Pt/MoO3 nanoplatelets coated with a thin layer of Ta2O5 or La2O3 Title Author(s) Citation A comparison study on hydrogen sensing performance of Pt/MoO3 nanoplatelets coated with a thin layer of Ta2O5 or La2O3 Yu, J; Liu, Y; Cai, FX; Shafiei, M; Chen, G; Motta, N; Wlodarski,

More information

Piezoelectric Resonators ME 2082

Piezoelectric Resonators ME 2082 Piezoelectric Resonators ME 2082 Introduction K T : relative dielectric constant of the material ε o : relative permittivity of free space (8.854*10-12 F/m) h: distance between electrodes (m - material

More information

CHAPTER 4: P-N P N JUNCTION Part 2. M.N.A. Halif & S.N. Sabki

CHAPTER 4: P-N P N JUNCTION Part 2. M.N.A. Halif & S.N. Sabki CHAPTER 4: P-N P N JUNCTION Part 2 Part 2 Charge Storage & Transient Behavior Junction Breakdown Heterojunction CHARGE STORAGE & TRANSIENT BEHAVIOR Once injected across the junction, the minority carriers

More information

HYDROGEN SENSOR BASED ON MOS CAPACITOR

HYDROGEN SENSOR BASED ON MOS CAPACITOR U.P.B. Sci. Bull., Series C, Vol. 75, Iss. 4, 2013 ISSN 2286 3540 HYDROGEN SENSOR BASED ON MOS CAPACITOR Bogdan OFRIM 1, Gheorghe BREZEANU 2 A MOS capacitor structure used as hydrogen sensor is defined

More information

Quantification of Trap State Densities at High-k/III-V Interfaces

Quantification of Trap State Densities at High-k/III-V Interfaces Quantification of Trap State Densities at High-k/III-V Interfaces Roman Engel-Herbert*, Yoontae Hwang, and Susanne Stemmer Materials Department, University of California, Santa Barbara *now at Penn State

More information

Creation of DIPOLE (two poles) (distortion of crystal structure by the small displacement of the ion in direction of electric field)

Creation of DIPOLE (two poles) (distortion of crystal structure by the small displacement of the ion in direction of electric field) Dielectricity Dielectric materials: Materials which is generally insulators. Under applied electric field, there is a tiny movement of charge inside the material. Electric field Creation of DIPOLE (two

More information

iclicker A metal ball of radius R has a charge q. Charge is changed q -> - 2q. How does it s capacitance changed?

iclicker A metal ball of radius R has a charge q. Charge is changed q -> - 2q. How does it s capacitance changed? 1 iclicker A metal ball of radius R has a charge q. Charge is changed q -> - 2q. How does it s capacitance changed? q A: C->2 C0 B: C-> C0 C: C-> C0/2 D: C->- C0 E: C->-2 C0 2 iclicker A metal ball of

More information

Capacitance and Dielectrics. Chapter 26 HW: P: 10,18,21,29,33,48, 51,53,54,68

Capacitance and Dielectrics. Chapter 26 HW: P: 10,18,21,29,33,48, 51,53,54,68 Capacitance and Dielectrics Chapter 26 HW: P: 10,18,21,29,33,48, 51,53,54,68 Capacitors Capacitors are devices that store electric charge and energy Examples of where capacitors are used include: radio

More information

The Science & Engineering of Materials Semiconductors. 주요반도체재료에서전자와홀의 mobility 대표적인값은? 어떤 carrier 가빠른지?

The Science & Engineering of Materials Semiconductors. 주요반도체재료에서전자와홀의 mobility 대표적인값은? 어떤 carrier 가빠른지? 18.6 Semiconductors 주요반도체재료에서전자와홀의 mobility 대표적인값은? 어떤 carrier 가빠른지? 18.6 Semiconductors [Fig. 18-16] - + When a voltage is applied to a semiconductor, the electrons move through the conduction band, while

More information

Theory of Electrical Characterization of Semiconductors

Theory of Electrical Characterization of Semiconductors Theory of Electrical Characterization of Semiconductors P. Stallinga Universidade do Algarve U.C.E.H. A.D.E.E.C. OptoElectronics SELOA Summer School May 2000, Bologna (It) Overview Devices: bulk Schottky

More information

Control of the fabrication process for the sensors of the CMS Silicon Strip Tracker. Anna Macchiolo. CMS Collaboration

Control of the fabrication process for the sensors of the CMS Silicon Strip Tracker. Anna Macchiolo. CMS Collaboration Control of the fabrication process for the sensors of the CMS Silicon Strip Tracker Anna Macchiolo Universita di Firenze- INFN Firenze on behalf of the CMS Collaboration 6 th International Conference on

More information

+ V gate M O. Trend: As k, E g. Part 6: High Dielectric Constant (k), Gate Electrode, & Channel Materials. Bandgap versus Dielectric Constant (k) k k

+ V gate M O. Trend: As k, E g. Part 6: High Dielectric Constant (k), Gate Electrode, & Channel Materials. Bandgap versus Dielectric Constant (k) k k Part 6: High Dielectric Constant (k), Gate Electrode, & Channel Materials O 2 gate oxide is approaching physical limits Thickness & Current M O S poly-crystalline V Source W Source Contact Insulator n

More information

Semiconductor Junctions

Semiconductor Junctions 8 Semiconductor Junctions Almost all solar cells contain junctions between different materials of different doping. Since these junctions are crucial to the operation of the solar cell, we will discuss

More information

Quiz #1 Practice Problem Set

Quiz #1 Practice Problem Set Name: Student Number: ELEC 3908 Physical Electronics Quiz #1 Practice Problem Set? Minutes January 22, 2016 - No aids except a non-programmable calculator - All questions must be answered - All questions

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon

More information

Problem Set #4: 4.1,4.7,4.9 (Due Monday, March 25th)

Problem Set #4: 4.1,4.7,4.9 (Due Monday, March 25th) Chapter 4 Multipoles, Dielectrics Problem Set #4: 4.,4.7,4.9 (Due Monday, March 5th 4. Multipole expansion Consider a localized distribution of charges described by ρ(x contained entirely in a sphere of

More information

Chapter 26. Capacitance and Dielectrics

Chapter 26. Capacitance and Dielectrics Chapter 26 Capacitance and Dielectrics Circuits and Circuit Elements Electric circuits are the basis for the vast majority of the devices used in society. Circuit elements can be connected with wires to

More information

Electric displacement as the fundamental variable in electronic-structure calculations

Electric displacement as the fundamental variable in electronic-structure calculations Electric displacement as the fundamental variable in electronic-structure calculations CECAM - Centre Européen de Calcul Atomique et Moléculaire EPF Lausanne, Switzerland Conference UC Davis, 6/23/2009

More information

Conductance and capacitance of bilayer protective oxides for silicon water splitting anodes

Conductance and capacitance of bilayer protective oxides for silicon water splitting anodes Electronic Supplementary Material (ESI) for Energy & Environmental Science. This journal is The Royal Society of Chemistry 2015 Conductance and capacitance of bilayer protective oxides for silicon water

More information

4 Electric Fields in Matter

4 Electric Fields in Matter 4 Electric Fields in Matter 4.1 Parity and Time Reversal: Lecture 10 (a) We discussed how fields transform under parity and time reversal. A useful table is Quantity Parity Time Reversal t Even Odd r Odd

More information

ALD high-k and higher-k integration on GaAs

ALD high-k and higher-k integration on GaAs ALD high-k and higher-k integration on GaAs Ozhan Koybasi 1), Min Xu 1), Yiqun Liu 2), Jun-Jieh Wang 2), Roy G. Gordon 2), and Peide D. Ye 1)* 1) School of Electrical and Computer Engineering, Purdue University,

More information

Lecture 6: 2D FET Electrostatics

Lecture 6: 2D FET Electrostatics Lecture 6: 2D FET Electrostatics 2016-02-01 Lecture 6, High Speed Devices 2014 1 Lecture 6: III-V FET DC I - MESFETs Reading Guide: Liu: 323-337 (he mainly focuses on the single heterostructure FET) Jena:

More information

Quantum Mechanical Simulation for Ultra-thin High-k Gate Dielectrics Metal Oxide Semiconductor Field Effect Transistors

Quantum Mechanical Simulation for Ultra-thin High-k Gate Dielectrics Metal Oxide Semiconductor Field Effect Transistors Mechanical Simulation for Ultra-thin High-k Gate Dielectrics Metal Oxide Semiconductor Field Effect Transistors Shih-Ching Lo 1, Yiming Li 2,3, and Jyun-Hwei Tsai 1 1 National Center for High-Performance

More information

Internal Fields in Solids: (Lorentz Method)

Internal Fields in Solids: (Lorentz Method) Internal Fields in Solids: (Lorentz Method) Let a dielectric be placed between the plates of a parallel plate capacitor and let there be an imaginary spherical cavity around the atom A inside the dielectric.

More information

Effect of parasitic capacitances on impedance measurements in microsensors structures: a numerical study

Effect of parasitic capacitances on impedance measurements in microsensors structures: a numerical study Effect of parasitic capacitances on impedance measurements in microsensors structures: a numerical study Nicolás H. Beltrán a,, Ricardo A. Finger a, Jorge Santiago-Aviles b, Patricio Espinoza-Vallejos

More information

Appendix 1: List of symbols

Appendix 1: List of symbols Appendix 1: List of symbols Symbol Description MKS Units a Acceleration m/s 2 a 0 Bohr radius m A Area m 2 A* Richardson constant m/s A C Collector area m 2 A E Emitter area m 2 b Bimolecular recombination

More information

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation

More information

Electronic Supplementary Information. Recombination kinetics in silicon solar cell under low-concentration: Electroanalytical

Electronic Supplementary Information. Recombination kinetics in silicon solar cell under low-concentration: Electroanalytical Electronic Supplementary Material (ESI) for Physical Chemistry Chemical Physics. This journal is the Owner Societies 2014 Electronic Supplementary Information Recombination kinetics in silicon solar cell

More information

Ferroelectric HfO 2 Thin Films

Ferroelectric HfO 2 Thin Films Ferroelectric HfO 2 Thin Films May 12 th, 2015 JACKSON ANDERSON ELECTRICAL AND MICROELECTRONIC ENGINEERING ROCHESTER INSTITUTE OF TECHNOLOGY Outline Introduction Background Project Objectives Experimental

More information

Electronic Supporting Information

Electronic Supporting Information Characterization of Planar Lead Halide Perovskite Solar Cells by Impedance Spectroscopy, Open Circuit Photovoltage Decay and Intensity-Modulated Photovoltage/Photocurrent Spectroscopy Adam Pockett 1, Giles

More information

Analysis of Band-to-band. Tunneling Structures. Title of Talk. Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012

Analysis of Band-to-band. Tunneling Structures. Title of Talk. Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012 1 Analysis of Band-to-band Title of Talk Tunneling Structures Dimitri Antoniadis and Judy Hoyt (PIs) Jamie Teherani and Tao Yu (Students) 8/21/2012 A Science & Technology Center Vertical Type-II TFET Structure

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006 UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Professor Ali Javey Fall 2006 Midterm 2 Name: SID: Closed book. Two sheets of notes are

More information

Chapter 26. Capacitance and Dielectrics

Chapter 26. Capacitance and Dielectrics Chapter 26 Capacitance and Dielectrics Capacitors Capacitors are devices that store electric charge Examples of where capacitors are used include: radio receivers filters in power supplies to eliminate

More information

Contents. 2. Fluids. 1. Introduction

Contents. 2. Fluids. 1. Introduction Contents 1. Introduction 2. Fluids 3. Physics of Microfluidic Systems 4. Microfabrication Technologies 5. Flow Control 6. Micropumps 7. Sensors 8. Ink-Jet Technology 9. Liquid Handling 10.Microarrays 11.Microreactors

More information