Improvement of Electromigration Lifetime in Al-Si-Cu/Ti/TiN/Ti Layered Interconnects
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1 Improvement of Electromigration Lifetime in Al-Si-Cu/Ti/TiN/Ti Layered Interconnects Tomoyuki Yoshida, Shoji Hashimoto, Hideki Hosokawa, Takeshi Ohwaki, Yasuichi Mitsushima, Yasunori Taga ( borophosphosilicate glass ) Al-Si-Cu/Ti/TiN/Ti B Al() B Al()X.63 Ti TiN Al Al() Al-Si- Cu Al()Ti ()Ti () Ti() EM Effect of the exposure of underlying dielectric (borophosphosilicate glass) films to a humid air ambient on crystallographic orientation in Al-Si-Cu/Ti/TiN/Ti layered films has been investigated as a function of the boron content and exposure time of the dielectric films. The Al() orientation in the layered films was found to improve drastically with increasing boron content and exposure time of the dielectric films. The full width at half maximum value of the rocking curve for an Al() x-ray diffraction peak reached.63 degrees, which is the lowest value ever reported for an Al-alloy film on Ti and/or TiN underlayers. It was also found that the Al- Si-Cu surface became smoother and the average grain size increased as the Al() orientation improved. The improved Al() orientation was attributed to the improved Ti() orientation of the bottom Ti film. The cause of the improved Ti() orientation was then investigated. As a result, it was confirmed that the Ti() orientation improved with increasing surface concentration of the water absorbed in the dielectric films. Further, it was demonstrated that interconnects fabricated from the improved layered film had excellent electromigration resistance.
2 LSI ( Large Scale Integration ) Al Al ( EM ) Al EM Al() () Al LSI AlTi TiN Al() Ti ()TiN() Al() Al() EM TiTiN TiTiN Onoda Ti() Ti Al-Si-Cu/Ti/TiN/Ti EM B BPSG ( Borophosphosilicate glass ) BPSGB Ti() TiN()Al() EM Al-Si-Cu/Ti/TiN/Ti Ti ( stti ) Si TiNstTiN ndtin sttinal Si ndtin sttin Ti Al ndti Al() BPSGCVD Si()93 B 4.4wt% P 3wt% ( 36%R. H. ).5 36 TiN/Ti TiN 73 Al-Si-Cu/Ti/TiN Al-Si-Cu ( 8 ( nm ) Dielectric ( 8 nm ) Si Substrate nd Ti ( 5 nm ) nd TiN ( nm ) st TiN ( nm ) st Ti ( 5 nm ) Schematic diagram of Al-Si-Cu/Ti/TiN/Ti interconnect structure.
3 Diffraction Intensity ( cps ) 3 8 Torr DC MRC Eclipse-E4 ) TiTiN35 Al-Si-Cu5 TiN/Ti Al-Si-Cu Ti/TiN/Ti TiN/Tiθ-θX Al-Si-CuAl() XCoKα SEM Al-Si- Cu 365nm ) SIMS ATOMICA A-DIDA3 EM Al-Si-Cu/Ti/TiN/Ti µm.5µm ( N + %H ) 4 95EM µm.5µm 4MA/cm 7MA/cm Ti() B Ti()TiN() TiN() Ti() Ti TiN TiN/TiSEM 4.4wt% B 36 B.5 Ti()TiN() 3 3 Ti() Ti() wt% BPSG. Ti()-% wt% B 3.6 Ti()-3.6% wt% B 4.4 Ti()-4.4% wt% B Ti() B TiN/Ti θ-θx Ti() Ti()TiN() 3 B B Ti() Ti() TiN() TiN() - 3 Exposure Time ( hours ) Ti(), Ti(), and TiN() diffraction peak intensities for TiN/Ti films as a function of air exposure time of dielectric films with,., 3.6, and 4.4 wt. % boron.
4 FWHM ( deg. ) Peak Intensity ( arb. units ) B Al- Si-Cu/Ti/TiN/Tiθ-θX Al Al()Al 3 Ti() Al 3 Ti()Al-Si-Cu Ti Al() Al() Al() B B Al() Al() TiN() B Al 3 Ti()B Al 3 Ti() Al 3 Ti()Ti() Al() sttin() ndtin() ndti()al 3 Ti() Al-Si-Cu() 4 Al() B 4.4wt% Ti TiN Al 5 5 Al() PSG(Inten) wt% B BPSG(,. wt% Inten) B BPSG(3.6, wt% BInten.) BPSG(4.4, wt% BInten.) Exposure Time ( hours ) Typical SEM photographs of (a) highly and (b) less oriented TiN/Ti films. Peak intensity and full width at half-maximum ( FWHM ) value of Al() rocking curve for Al-Si-Cu/Ti/TiN/Ti films as a function of dielectric films with,., 3.6, and 4.4 wt. % boron.
5 Reflectance ( % ) R ( nm ) q Ta-Al Al.5 4 Al-Si-Cu Al() Al() Al-Si-Cu Al() Al-Si-CuSEM B Al-Si-CuAl() Al() Ti() Ti() Ti () () (3) B BPSG B Ti()BPSG B Ti() Ti() BPSGB BPSG SIMS atoms/cm 3 B FWHM ( deg. ) Reflectance and root mean square roughness (R q ) of Al-Si-Cu surfaces as a function of Al() FWHM value for all the samples shown in Fig. 4. SEM photographs of surfaces of Al-Si-Cu films with Al() FWHM values of (a).63 and (b) 4. degrees.
6 Hydrogen Atom Concentration ( atoms/cm ) Hydrogen Atom Concentration ( atoms/cm 3 ) Al() FWHM ( deg. ) B Ti() Ti() Ti() Ti() BPSGTi Ti/TiN/Ti Al-Si-Cu BPSGB 3.6wt% Ti()Al() Ti() Al() Ti()Al() 3cps.65 B4.4wt% 36 BPSG 4 SIMS B3.6wt% BPSG B4.4wt% Ti() Intensity ( 3 cps ) 3 Al() Ti() 3 Immersion Time ( hours ) Ti() diffraction intensity for TiN/Ti fims and Al() FWHM value for Al-Si- Cu/Ti/TiN/Ti films as a function of immersion time of dielectric film ( 3.6 wt. % B ) in hot ( 95 C ) water h. wt% B 3.6 wt% B 4.4 wt% B immersed in hot water for h ( 3.6 wt.% B ) 44 h exposed to air for 36 h ( 4.4 wt.% B ) 9 3 Depth ( nm ) Depth ( nm ) SIMS depth profiles of hydrogen atoms for dielectric films with different SIMS depth profiles of hydrogen atoms for dielectric film with 3.6 wt. % B and h waterimmersion and dielectric film with 4.4 wt. % B and 36 h air-exposure.
7 36 BPSG ( <nm ) TiTi() AlAl() 8 Ti()Al() Yoshimaru 8 3 BPSG SIMS 8 Ti()Al() BPSG Ti BPSG 8 TDS ( Thermal Desorption Spectroscopy ) 35 BPSG 4.4wt% B 5 BPSG 35 TDS5 BPSG 35Ti 5 B 4.4wt% 5 4 BPSGTi 355 Ti BPSG BPSG Ti Ti() B Ti() B Ti() B Ti() BTi Ti() Ti() Si-OH Ti BPSG Ti BPSG Ti TiTi Ti Ti () Ti () () Ti Ti Ti BPSG BPSG Ti Ti() Intensity ( cps ) 8 4 without heating with heating Boron Content ( wt % ) Ti() diffraction intensity as a function of boron content of dielectric films for TiN/Ti films deposited on dielectric films with and without heating at 35 in vacuum.
8 Cumulative Failure ( % ) BPSG35 BPSG BPSG Al() Al-Si-Cu/Ti/TiN/Ti µm.5µm EM Al()4..65 B wt% 5 BPSG B 3.6wt% ( 95 ) BPSG µm.5µmem Al() Al().65 ) Al()4. ) Ta =95 C 4. deg..65 deg µm.5 4. µm Time to Failure ( hours ) Log-normal plots of EM failure time distributions for.5- and.-µm wide Al-Si- Cu/Ti/TiN/Ti lines. These lines were fabricated from two kinds of layered films with Al() FWHM values of 4. and.65 degrees. Al EM Al() Al EM 4 Al() EM µm.5µm EM EMBPSG SEM EM Al Al-Si-Cu/Ti/TiN/TiAl() BPSG X Al().63 Ti Al Al()Al Al()Ti() TiN()Ti() Ti() Ti() BPSG Al()EM EM SEM
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