Hong Young Chang Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea
|
|
- Brook Taylor
- 6 years ago
- Views:
Transcription
1 Hong Young Chang Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea
2 Index 1. Introduction 2. Some plasma sources 3. Related issues 4. Summary -2
3 Why is Large Area Plasma Source important? Flat Panel Display Process glass size increases continuously. (8 G : 2200 mm X 2500 mm) Si thin film Solar Cell Microcrystalline Si deposition using Large Area Very High Frequency(VHF) plasma Semiconductor Dual Frequency CCP (using VHF), wafer size increases continuously. Near future, 450 mm wafer will be used. -3
4 Wafer size change and expected key issues -200 mm / mm / mm / 2012 (?) Expected key issues 1. Uniformity over wafer (Plasma and Radical Distributions) 2. Discharge stability at various pressures 3. Low process damages (Emissive, physical and electrical) 4. High process performance (ER, Sel., DR, etc.)
5 Why is VHF Plasma needed? Plasma frequency dependence of electron density and electron temperature -argon plasma power density: 0.13 W/cm2, pressure : 50 & 20 mtorr. M. Takai et al. J. Non-Cryst. Solids (2000) 90 PIC calculation, at 2.67 Pa S. J. You, et al. J. Appl. Phys. vol. 94 no Driving frequency P i P e Ion bombardment energy Electron density Electron temperature -5
6 Standing Wave Effect -Standing wave : Incident wave + reflected wave x node -Velocity of light = km/s -RF frequency = MHz -Half wave length = 11 m MHz -Strong capacitive E-field at electrode center 2.3 m -6
7 Standing wave effect Strong Capacitive E- field at the electrode center Skin effect - Strong Induced E-field at the electrode edge Capacitive electric field Induced electric field B-field A. Perret, et al Appl. Phys. Lett. 83, 243 (2003) -7
8 -Single Electrode Source
9 Multi-feeding source 1,500 1, MHz MHz 40 MHz E-field (A.U) 500 Non-Uniformity(%) Length single feeding multi feeding -Simulation result -View of multi feeding port Frequency(MHz) -There is little uniformity difference between single feeding and multi feeding concept. -Another concept is needed.
10 Multi electrode source -Conventional single electrode -Electrode -y -x -Newly designed Multi-electrode -Power feeding x-direction : split electrode to reduce the interference of EM wave y-direction : multi-feeding to reject the non-uniformity of RF field distribution
11 MHz MHz -60 MHz -80 MHz
12 -Diagnostic results Plasma uniformity -< 8x8 Probe array> Measured the spatial profile of the J i /J i max J i /J i max ion saturation current with the homemade probe array X (cm) % Y (cm) X (cm) % Y (cm) -< Example of measured result with probe array in Normal CCP>
13 Multi electrode source Non - uniformity 100 min max Multi electrode -4.03% -Non-uniformity MHz - 40 MHz -13
14 -VHF Source Simulation -Single electrode -Multi electrode -Concept of single feeding line -Multi feeding electrode -14
15 -VHF Source Installation -450mm plasma equipment -Power input port -Installed 450mm CCP sources -15
16 -2D Probe Array Installation -Structure -2D probe -Sensor Arrays -- SiO2 coated PCB -Al2O3 anodized -Chamber -Shielding case -ID 700 mm -2D Probe -Powered electrode - ~ 500 mm -Ground -Electrode -Data cable -450 mm -diameter(<23mm) -Vacuum feedthrough -- NW25 -Vacuum port (NW25) -buttress -& -Data cable -Vacuum feedthrough
17 -2D Probe Array Controller -450mm electrode size -Program menu -Captured data -17
18 Measurement of Large area CCP (Ion flux, μa/cm 2 ) Y Axis Y Axis % 15.3% X Axis -Center 50W, Side 200W X Axis -Center 50W, Side 300W Y Axis Y Axis % % X Axis -Center 75W, Side 200W X Axis -Center 75W, side 300W -18
19 -Measurement of Large area CCP (Ion flux, μa/cm 2 ) Y Axis Y Axis % 4.7% X Axis -Center 50W, Side 125W Y Axis % X Axis -Center 125W, Side 125W X Axis -Center 200W, Side 125W -19
20 Dual Power Phase Shift Control 54 MHz Power Phase Shift of Upper electrode & Lower electrode Bera K, Rauf S and Collins K 2008 IEEE Trans. Plasma Sci
21 Uniformity control by Phase Modulation - Solar cell K. Kawamura, et al. Thin Solid Films (2006)
22 Multiple ICP and Helicon Source -Flat Panel Display High Density 1E12 cm -3 Auto-balancing equal power absorption Low Pressure Operation about 10 mtorr Permanent Magnet Helicon tubes -22
23 Pulse modulation -Subramonium, APL 85, Shimatani, et. al., Vacuum 66, Samukawa, et. al., JVST A 14, 199 -These results suggest the possibilities of improvement of plasma uniformity by pulsing the discharge. -But, there s insufficient information regarding this improvement especially in electronegative plasmas.
24 Pulse Modulation of ICP Source Power: Spatial profiles Electron density (cm -3 ) -Temporal evolution at various positions 7E10 6E10 5E10 4E10 3E10 2E10 1E MHz 900W 10kHzPulse mode Duty cycle 50% Ar 20mTorr 000mm 050mm 100mm 150mm 200mm 250mm 300mm 350mm Electron density (cm -3 ) -Spatial profiles at various moments 7E10 6E10 5E10 4E10 3E10 2E10 1E10 11usec 31usec 49usec 71usec 91usec time (usec) -Pulse Off -Pulse On Distance from chamber wall (mm) Uniformity (within 150~350mm area) 11 usec 11.8 % N e profile could be get better during RF off period. 31 usec 7.7 % 49 usec 5.5 % 71 usec 7.3 % 91 usec 6.6 % Max Min Uniformity(%) Mean
25 Pulse modulation -Rising -Decay Electron density [10 10 /cm 3 ] Position [cm] 0 ms 0.1 ms 0.2 ms 0.3 ms 0.4 ms 0.5 ms 1.0 ms 1.5 ms 2.0 ms Electron density [10 10 /cm 3 ] Position [cm] 2.1 ms 2.2 ms 2.3 ms 2.4 ms 2.5 ms 2.6 ms 2.7 ms 2.8 ms 2.9 ms 3.0 ms 3.5 ms 4.0 ms 4.5 ms 5.0 ms 5.5 ms 6.0 ms
26 Parallel Stray Capacitance - CCP Plasma Source Atmosphere -Large Gap for small stray C Matching Box Power electrode Blocking Capacitor Ground electrode Strong electric field in Plasma Generation Region Plasma Generation Region Stray C This is needed to be minimized -26
27 Parallel Stray Capacitance Ground electrode Wafer Matching Box Plasma Blocking Capacitor generation region -Strong E-field Power electrode Plasma Generation Region Stray C This is needed to be minimized Stray Capacitance The use of Thick Dielectric for small parallel Stray Capacitance -27
28 Series Stray Capacitance floating Plasma generation Matching Box Blocking Capacitor ground Plasma Generation Region Stray Capacitance Small stray capacitance High voltage is applied Arcing, undesirable discharge -28
29 Effect of Chamber Wall Asymmetry in CCP Plasma Source Electromagnetic wave Surface current Slot valve distorts field uniformity as well as wall surface current flow Ground strap Slot valve Glass in/out -29
30 CCP source s heating Electron heating in the CCP The electron heating in the rf discharges corresponds to how the electrons gain their energy from the rf electric field energy. e E e e n e-n collsion nonlinear sheath interaction Ohmic Heating Stochastic Heating V. A. Godyak Electron in RF electric field collective interaction with sheath Pressure Heating M. M. Turner
31 EEDF of the CCP CCP source s heating Origion of Bi Maxwellian Electron Distribution Ramsauer gas effect Stochastic heating - Godyak. Pressure heating e - Turner. e Electron non-local property L - Tsendin, Kaganovich. sheath e e sheath
32 CCP source s heating Plasma parameter control with Discharge gap length The bi-maxwellian EEPF approaches to the Maxwellian EEPF, because of enhancement of electric field in the bulk with decreasing gap length. ( Gap length Ne & Te ) 60 mtorr, 1A, Gap-changed J E rf ne rf E rf J / n d 1/ 2 [ S. J. You. et.al, Appl. Phys. Letts, 2005] d 1/ 2 2 E rf 2 D low e T e
33 CCP source s heating Plasma parameter control with Driving frequency Driving frequency Druyvestein to bi-maxwellian distribution (at constant Voltage conditions) Ne & Te Driving frequency bi-maxwellian to Druyvesteyn distribution (at constant Current conditions) 200 mtorr, 1A (fixed current) [ Abdel.et.al, Appl. Phys. Letts, 2003 ] [ S. J. You. et.al, Appl. Phys. Letts, 2006]
34 CCP source s heating Effect of driving frequency on the plasma parameters Effect of the driving frequency at constant discharge power Driving frequency Te & Ne ~ constant or decrease ( at constant power conditions) Enhancement of collisional heating in the bulk plasma with the driving frequency. [ S. K. Ahn. et.al, Appl. Phys. Letts, 2006]
35 CCP source control knob discharge gap length driving frequency gas pressure discharge power
36 -ICP sources -Electron temperature dependence on RF frequency
37 -ICP sources - Problems in high frequency -E-M field structure (f=13.56 MHz) -Antenna current vector -Electric field amplitude
38 -ICP sources - Problems in high frequency -E-M field structure (f=60.00 MHz) -Antenna current vector -Electric field amplitude
39 -ICP sources - C.D.A -Structure of PCB Capacitor Distributed Antenna (40 MHz) -Diameter = 450 mm -Capacitor -Antenna ground -Top plate -Base plate -Cooling fan -Power port -PCB - C.D.A model LX10 base plate -Convection cooling system -Capacitance uncertainty is -Antenna operation 40 MHz 1.6 KW RF -100 pf ± 1 pf for 12 capacitors -Antenna operation 40 MHz 1.6 KW RF
40 1 Antenna coil properties Asymmetry Factors Asymmetry Factors and Uniformity Coil plasma capacitive coupling coil termination impedance azimuth coil current asymmetric E-field Coil E-field asymmetry (1-turn coil 5-turn coil symmetric) Asymmetric E-field ion flux uniformity 2 Reactor Structure Wafer clamp support load-lock bay asymmetry (check) 3 Gas Pumping One-side pumping asymmetric pumping asymmetry Neutral species (ion flux ambipolar transport) 4 Gas Injection Nozzle neutral asymmetry (showerhead radial jet) 5 Wall Reactive Wall reactivity radical wall loss uniformity (gas species) 6 Gas Pressure n D 2 a n iz n t Da 1/2 ~( ) ~5cm iz Neutral species pressure dependence Ion flux pressure Da Da n~ n iz ~ Da Scale length 5cm T 3~5eV P 5mTorr e
41 Summary 1. Standing wave effect and skin effect should be considered in large area plasma source 2. RF phase shift or modulation control uniformity. 3. Multi-feeding is also a method for uniformity control. 4. Multi-plasma sources(multiple helicon or multi-electrode CCP) can be used to increase plasma uniformity. 5. Stray capacitance should be considered in plasma system design. 6. Asymmetry factors be taken into account plasma uniformity. -41
DOE WEB SEMINAR,
DOE WEB SEMINAR, 2013.03.29 Electron energy distribution function of the plasma in the presence of both capacitive field and inductive field : from electron heating to plasma processing control 1 mm PR
More informationPlasma parameter evolution in a periodically pulsed ICP
Plasma parameter evolution in a periodically pulsed ICP V. Godyak and B. Alexandrovich OSRAM SYLVANIA, 71 Cherry Hill Drive, Beverly, MA 01915, USA The electron energy probability function (EEPF) has been
More informationPlasmas rf haute densité Pascal Chabert LPTP, Ecole Polytechnique
Plasmas rf haute densité Pascal Chabert LPTP, Ecole Polytechnique chabert@lptp.polytechnique.fr Pascal Chabert, 2006, All rights reserved Programme Introduction Généralité sur les plasmas Plasmas Capacitifs
More informationPhysique des plasmas radiofréquence Pascal Chabert
Physique des plasmas radiofréquence Pascal Chabert LPP, Ecole Polytechnique pascal.chabert@lpp.polytechnique.fr Planning trois cours : Lundi 30 Janvier: Rappels de physique des plasmas froids Lundi 6 Février:
More informationINTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL
INTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL Prof. Mark J. Kushner Department of Electrical and Computer Engineering 1406 W. Green St. Urbana, IL 61801 217-144-5137 mjk@uiuc.edu http://uigelz.ece.uiuc.edu
More informationMWP MODELING AND SIMULATION OF ELECTROMAGNETIC EFFECTS IN CAPACITIVE DISCHARGES
MWP 1.9 MODELING AND SIMULATION OF ELECTROMAGNETIC EFFECTS IN CAPACITIVE DISCHARGES Insook Lee, D.B. Graves, and M.A. Lieberman University of California Berkeley, CA 9472 LiebermanGEC7 1 STANDING WAVES
More informationNARROW GAP ELECTRONEGATIVE CAPACITIVE DISCHARGES AND STOCHASTIC HEATING
NARRW GAP ELECTRNEGATIVE CAPACITIVE DISCHARGES AND STCHASTIC HEATING M.A. Lieberman, E. Kawamura, and A.J. Lichtenberg Department of Electrical Engineering and Computer Sciences University of California
More information4 Modeling of a capacitive RF discharge
4 Modeling of a capacitive discharge 4.1 PIC MCC model for capacitive discharge Capacitive radio frequency () discharges are very popular, both in laboratory research for the production of low-temperature
More informationEffect of a dielectric layer on plasma uniformity in high frequency electronegative capacitive discharges
Effect of a dielectric layer on plasma uniformity in high frequency electronegative capacitive discharges Emi KawamuraDe-Qi WenMichael A. Lieberman and Allan J. Lichtenberg Citation: Journal of Vacuum
More informationP. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston
P. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston 1 Outline Introduction PIC-MCC simulation of tailored bias on boundary electrode Semi-analytic model Comparison
More informationEffect of Gas Flow Rate and Gas Composition in Ar/CH 4 Inductively Coupled Plasmas
COMSOL CONFERENCE BOSTON 2011 Effect of Gas Flow Rate and Gas Composition in Ar/CH 4 Inductively Coupled Plasmas Keisoku Engineering System Co., Ltd., JAPAN Dr. Lizhu Tong October 14, 2011 1 Contents 1.
More informationEFFECT OF PRESSURE AND ELECTRODE SEPARATION ON PLASMA UNIFORMITY IN DUAL FREQUENCY CAPACITIVELY COUPLED PLASMA TOOLS *
EFFECT OF PRESSURE AND ELECTRODE SEPARATION ON PLASMA UNIFORMITY IN DUAL FREQUENCY CAPACITIVELY COUPLED PLASMA TOOLS * Yang Yang a) and Mark J. Kushner b) a) Department of Electrical and Computer Engineering
More informationPIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma
PIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma Kallol Bera a, Shahid Rauf a and Ken Collins a a Applied Materials, Inc. 974 E. Arques Ave., M/S 81517, Sunnyvale, CA 9485, USA
More information65 th GEC, October 22-26, 2012
65 th GEC, October 22-26, 2012 2D Fluid/Analytical Simulation of Multi-Frequency Capacitively-Coupled Plasma Reactors (CCPs) E. Kawamura, M.A. Lieberman, D.B. Graves and A.J. Lichtenberg A fast 2D hybrid
More informationMODELING OF AN ECR SOURCE FOR MATERIALS PROCESSING USING A TWO DIMENSIONAL HYBRID PLASMA EQUIPMENT MODEL. Ron L. Kinder and Mark J.
TECHCON 98 Las Vegas, Nevada September 9-11, 1998 MODELING OF AN ECR SOURCE FOR MATERIALS PROCESSING USING A TWO DIMENSIONAL HYBRID PLASMA EQUIPMENT MODEL Ron L. Kinder and Mark J. Kushner Department of
More informationPRINCIPLES OF PLASMA DISCHARGES AND MATERIALS PROCESSING
PRINCIPLES OF PLASMA DISCHARGES AND MATERIALS PROCESSING Second Edition MICHAEL A. LIEBERMAN ALLAN J, LICHTENBERG WILEY- INTERSCIENCE A JOHN WILEY & SONS, INC PUBLICATION CONTENTS PREFACE xrrii PREFACE
More informationCHAPTER 8. SUMMARY AND OUTLOOK 90 Under the operational conditions used in the present work the translation temperatures can be obtained from the Dopp
Chapter 8 Summary and outlook In the present work reactive plasmas have been investigated by comparing experimentally obtained densities with the results from a simple chemical model. The studies have
More informationElectron Temperature Modification in Gas Discharge Plasma
Electron Temperature Modification in Gas Discharge Plasma Valery Godyak University of Michigan and RF Plasma Consulting egodyak@comcast.net Workshop: Control of Distribution Functions in Low Temperature
More informationLee Chen, Merritt Funk, and Radha Sundararajan Tokyo Electron America, Austin, Texas 78741
Measurement of electron temperatures and electron energy distribution functions in dual frequency capacitively coupled CF 4 /O 2 plasmas using trace rare gases optical emission spectroscopy Zhiying Chen,
More informationFINAL REPORT. DOE Grant DE-FG03-87ER13727
FINAL REPORT DOE Grant DE-FG03-87ER13727 Dynamics of Electronegative Plasmas for Materials Processing Allan J. Lichtenberg and Michael A. Lieberman Department of Electrical Engineering and Computer Sciences
More informationPARTICLE CONTROL AT 100 nm NODE STATUS WORKSHOP: PARTICLES IN PLASMAS
PARTICLE CONTROL AT 100 nm NODE STATUS WORKSHOP: PARTICLES IN PLASMAS Mark J. Kushner University of Illinois Department of Electrical and Computer Engineering Urbana, IL 61801 mjk@uiuc.edu December 1998
More informationNumerical Simulation: Effects of Gas Flow and Rf Current Direction on Plasma Uniformity in an ICP Dry Etcher
Appl. Sci. Converg. Technol. 26(6): 189-194 (2017) http://dx.doi.org/10.5757/asct.2017.26.6.189 Research Paper Numerical Simulation: Effects of Gas Flow and Rf Current Direction on Plasma Uniformity in
More informationPIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma
PIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma Kallol Bera a, Shahid Rauf a and Ken Collins a a Applied Materials, Inc. 974 E. Arques Ave., M/S 81517, Sunnyvale, CA 9485, USA
More informationPIC-MCC simulations for complex plasmas
GRADUATE SUMMER INSTITUTE "Complex Plasmas August 4, 008 PIC-MCC simulations for complex plasmas Irina Schweigert Institute of Theoretical and Applied Mechanics, SB RAS, Novosibirsk Outline GRADUATE SUMMER
More informationThe Role of Secondary Electrons in Low Pressure RF Glow Discharge
WDS'05 Proceedings of Contributed Papers, Part II, 306 312, 2005. ISBN 80-86732-59-2 MATFYZPRESS The Role of Secondary Electrons in Low Pressure RF Glow Discharge O. Brzobohatý and D. Trunec Department
More informationPlasma Modeling with COMSOL Multiphysics
Plasma Modeling with COMSOL Multiphysics Copyright 2014 COMSOL. Any of the images, text, and equations here may be copied and modified for your own internal use. All trademarks are the property of their
More informationFeature-level Compensation & Control
Feature-level Compensation & Control 2 Plasma Eray Aydil, UCSB, Mike Lieberman, UCB and David Graves UCB Workshop November 19, 2003 Berkeley, CA 3 Feature Profile Evolution Simulation Eray S. Aydil University
More informationI. INTRODUCTION J. Vac. Sci. Technol. A 16 4, Jul/Aug /98/16 4 /2454/9/$ American Vacuum Society 2454
Consequences of three-dimensional physical and electromagnetic structures on dust particle trapping in high plasma density material processing discharges Helen H. Hwang, a) Eric R. Keiter, b) and Mark
More informationOPTIMIZATION OF PLASMA UNIFORMITY USING HOLLOW-CATHODE STRUCTURE IN RF DISCHARGES*
51th Gaseous Electronics Conference & 4th International Conference on Reactive Plasmas Maui, Hawai i 19-23 October 1998 OPTIMIZATION OF PLASMA UNIFORMITY USING HOLLOW-CATHODE STRUCTURE IN RF DISCHARGES*
More informationTwo-dimensional Fluid Simulation of an RF Capacitively Coupled Ar/H 2 Discharge
Two-dimensional Fluid Simulation of an RF Capacitively Coupled Ar/H 2 Discharge Lizhu Tong Keisoku Engineering System Co., Ltd., Japan September 18, 2014 Keisoku Engineering System Co., Ltd., 1-9-5 Uchikanda,
More informationRepetition: Practical Aspects
Repetition: Practical Aspects Reduction of the Cathode Dark Space! E x 0 Geometric limit of the extension of a sputter plant. Lowest distance between target and substrate V Cathode (Target/Source) - +
More informationElectron Density and Ion Flux in Diffusion Chamber of Low Pressure RF Helicon Reactor
WDS'06 Proceedings of Contributed Papers, Part II, 150 155, 2006. ISBN 80-86732-85-1 MATFYZPRESS Electron Density and Ion Flux in Diffusion Chamber of Low Pressure RF Helicon Reactor R. Šmíd Masaryk University,
More informationControl of Ion Energy Distributions on Plasma Electrodes
Control of Ion Energy Distributions on Plasma Electrodes P. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston DOE Plasma Science Center Teleseminar, February
More informationNARROW GAP ELECTRONEGATIVE CAPACITIVE DISCHARGES AND STOCHASTIC HEATING
NARRW GAP ELECTRNEGATIVE CAPACITIVE DISCHARGES AND STCHASTIC HEATING M.A. Lieberman Deartment of Electrical Engineering and Comuter Sciences University of California Berkeley, CA 9472 Collaborators: E.
More informationPlasma Chemistry Study in an Inductively Coupled Dielectric Etcher
Plasma Chemistry Study in an Inductively Coupled Dielectric Etcher Chunshi Cui, John Trow, Ken Collins, Betty Tang, Luke Zhang, Steve Shannon, and Yan Ye Applied Materials, Inc. October 26, 2000 10/28/2008
More informationPlasma properties determined with induction loop probes in a planar inductively coupled plasma source
Plasma properties determined with induction loop probes in a planar inductively coupled plasma source J. A. Meyer, a) R. Mau, and A. E. Wendt b) Engineering Research Center for Plasma-Aided Manufacturing,
More informationEffects of cross field diffusion in a low pressure high density oxygen/silane plasma
Effects of cross field diffusion in a low pressure high density oxygen/silane plasma C. Charles Citation: Journal of Vacuum Science & Technology A 20, 1275 (2002); doi: 10.1116/1.1481042 View online: http://dx.doi.org/10.1116/1.1481042
More informationLecture 6 Plasmas. Chapters 10 &16 Wolf and Tauber. ECE611 / CHE611 Electronic Materials Processing Fall John Labram 1/68
Lecture 6 Plasmas Chapters 10 &16 Wolf and Tauber 1/68 Announcements Homework: Homework will be returned to you on Thursday (12 th October). Solutions will be also posted online on Thursday (12 th October)
More informationA Kinetic Theory of Planar Plasma Sheaths Surrounding Electron Emitting Surfaces
A Kinetic Theory of Planar Plasma Sheaths Surrounding Electron Emitting Surfaces J. P. Sheehan1, I. Kaganovich2, E. Barnat3, B. Weatherford3, H. Wang2, 4 1 2 D. Sydorenko, N. Hershkowitz, and Y. Raitses
More informationChapter 7 Plasma Basic
Chapter 7 Plasma Basic Hong Xiao, Ph. D. hxiao89@hotmail.com www2.austin.cc.tx.us/hongxiao/book.htm Hong Xiao, Ph. D. www2.austin.cc.tx.us/hongxiao/book.htm 1 Objectives List at least three IC processes
More informationInfluence of driving frequency on the metastable atoms and electron energy distribution function in a capacitively coupled argon discharge
Influence of driving frequency on the metastable atoms and electron energy distribution function in a capacitively coupled argon discharge S. Sharma Institute for Plasma Research, Gandhinagar -382428,
More informationThe low-field density peak in helicon discharges
PHYSICS OF PLASMAS VOLUME 10, NUMBER 6 JUNE 2003 Francis F. Chen a) Electrical Engineering Department, University of California, Los Angeles, Los Angeles, California 90095-1597 Received 10 December 2002;
More informationStudy of Electronegativity in Inductively Coupled Radio-Frequency Plasma with Langmuir Probe
Study of Electronegativity in Inductively Coupled Radio-Frequency Plasma with Langmuir Probe International Training Program Queen s University Belfast Dept. Energy Sciences Tokyo Institute of Technology
More informationMODELING AND SIMULATION OF LOW TEMPERATURE PLASMA DISCHARGES
MODELING AND SIMULATION OF LOW TEMPERATURE PLASMA DISCHARGES Michael A. Lieberman University of California, Berkeley lieber@eecs.berkeley.edu DOE Center on Annual Meeting May 2015 Download this talk: http://www.eecs.berkeley.edu/~lieber
More informationElectron Energy Distributions in a Radiofrequency Plasma. Expanded by Permanent Magnets
J. Plasma Fusion Res. SERIES, Vol. 9 (21) Electron Energy Distributions in a Radiofrequency Plasma Expanded by Permanent Magnets Tomoyo SASAKI, Kazunori TAKAHASHI, and Tamiya FUJIWARA Department of Electrical
More informationLow-field helicon discharges
Plasma Phys. Control. Fusion 39 (1997) A411 A420. Printed in the UK PII: S0741-3335(97)80958-X Low-field helicon discharges F F Chen, X Jiang, J D Evans, G Tynan and D Arnush University of California,
More informationSIMULATIONS OF ECR PROCESSING SYSTEMS SUSTAINED BY AZIMUTHAL MICROWAVE TE(0,n) MODES*
25th IEEE International Conference on Plasma Science Raleigh, North Carolina June 1-4, 1998 SIMULATIONS OF ECR PROCESSING SYSTEMS SUSTAINED BY AZIMUTHAL MICROWAVE TE(,n) MODES* Ron L. Kinder and Mark J.
More informationEnhancement of an IEC Device with a Helicon Ion Source for Helium-3 Fusion
Enhancement of an IEC Device with a Helicon Ion Source for Helium-3 Fusion Gabriel E. Becerra*, Gerald L. Kulcinski and John F. Santarius Fusion Technology Institute University of Wisconsin Madison *E-mail:
More informationPlasma Chemistry and Kinetics in Low Pressure Discharges
Plasma Chemistry and Kinetics in Low Pressure Discharges Jón Tómas Guðmundsson Science Institute, University of Iceland, Iceland tumi@hi.is 12o. Encontro Brasileiro de Física de Plasmas Brasilia, Brazil
More informationConsequences of asymmetric pumping in low pressure plasma processing reactors: A three-dimensional modeling study
Consequences of asymmetric pumping in low pressure plasma processing reactors: A three-dimensional modeling study Mark J. Kushner a) University of Illinois, Department of Electrical and Computer Engineering,
More informationNeutron Generators for Detection of Explosives and Illicit Materials
Neutron Generators for Detection of Explosives and Illicit Materials J. Reijonen Lawrence Berkeley National Laboratory, Berkeley, California IAEA Technical Meeting on Neutron Generators Vienna June 13
More informationPlasma Technology September 15, 2005 A UC Discovery Project
1 Feature-level Compensation & Control Plasma Technology September 15, 2005 A UC Discovery Project 9/15/05 - Plasma Technology 2 Plasma Technology Professors Jane P. Chang (UCLA), Michael A. Lieberman,
More informationMODELING OF SEASONING OF REACTORS: EFFECTS OF ION ENERGY DISTRIBUTIONS TO CHAMBER WALLS*
MODELING OF SEASONING OF REACTORS: EFFECTS OF ION ENERGY DISTRIBUTIONS TO CHAMBER WALLS* Ankur Agarwal a) and Mark J. Kushner b) a) Department of Chemical and Biomolecular Engineering University of Illinois,
More informationPIC/MCC Simulation of Radio Frequency Hollow Cathode Discharge in Nitrogen
PIC/MCC Simulation of Radio Frequency Hollow Cathode Discharge in Nitrogen HAN Qing ( ), WANG Jing ( ), ZHANG Lianzhu ( ) College of Physics Science and Information Engineering, Hebei Normal University,
More informationFloating probe for electron temperature and ion density measurement applicable to processing plasmas
JOURNAL OF APPLIED PHYSICS 101, 033305 2007 Floating probe for electron temperature and ion density measurement applicable to processing plasmas Min-Hyong Lee, Sung-Ho Jang, and Chin-Wook Chung a Department
More informationPlasma diagnostics of pulsed sputtering discharge
Plasma diagnostics of pulsed sputtering discharge Vitezslav Stranak Zdenek Hubicka, Martin Cada and Rainer Hippler University of Greifswald, Institute of Physics, Felix-Hausdorff-Str. 6, 174 89 Greifswald,
More informationChapter 7. Plasma Basics
Chapter 7 Plasma Basics 2006/4/12 1 Objectives List at least three IC processes using plasma Name three important collisions in plasma Describe mean free path Explain how plasma enhance etch and CVD processes
More informationEtching Issues - Anisotropy. Dry Etching. Dry Etching Overview. Etching Issues - Selectivity
Etching Issues - Anisotropy Dry Etching Dr. Bruce K. Gale Fundamentals of Micromachining BIOEN 6421 EL EN 5221 and 6221 ME EN 5960 and 6960 Isotropic etchants etch at the same rate in every direction mask
More informationCharacterization of an Oxygen Plasma by Using a Langmuir Probe in an Inductively Coupled Plasma
Journal of the Korean Physical Society, Vol. 38, No. 3, March 001, pp. 59 63 Characterization of an Oxygen Plasma by Using a Langmuir Probe in an Inductively Coupled Plasma Jong-Sik Kim and Gon-Ho Kim
More informationMODELING PLASMA PROCESSING DISCHARGES
MODELING PROCESSING DISCHARGES M.A. Lieberman Department of Electrical Engineering and Computer Sciences University of California Berkeley, CA 94720 Collaborators: E. Kawamura, D.B. Graves, and A.J. Lichtenberg,
More informationA MINI-COURSE ON THE PRINCIPLES OF LOW-PRESSURE DISCHARGES AND MATERIALS PROCESSING
A MINI-COURSE ON THE PRINCIPLES OF LOW-PRESSURE DISCHARGES AND MATERIALS PROCESSING Michael A. Lieberman Department of Electrical Engineering and Computer Science, CA 94720 LiebermanMinicourse07 1 OUTLINE
More informationWave propagation and power deposition in magnetically enhanced inductively coupled and helicon plasma sources
Wave propagation and power deposition in magnetically enhanced inductively coupled and helicon plasma sources Ronald L. Kinder a) and Mark J. Kushner b) Department of Electrical and Computer Engineering,
More informationThe Gaseous Electronic Conference GEC reference cell as a benchmark for understanding microelectronics processing plasmas*
PHYSICS OF PLASMAS VOLUME 6, NUMBER 5 MAY 1999 The Gaseous Electronic Conference GEC reference cell as a benchmark for understanding microelectronics processing plasmas* M. L. Brake, J. Pender, a) and
More informationEffect of Spiral Microwave Antenna Configuration on the Production of Nano-crystalline Film by Chemical Sputtering in ECR Plasma
THE HARRIS SCIENCE REVIEW OF DOSHISHA UNIVERSITY, VOL. 56, No. 1 April 2015 Effect of Spiral Microwave Antenna Configuration on the Production of Nano-crystalline Film by Chemical Sputtering in ECR Plasma
More informationCONTROL OF UNIFORMITY IN CAPACITIVELY COUPLED PLASMAS CONSIDERING EDGE EFFECTS*
CONTROL OF UNIFORMITY IN CAPACITIVELY COUPLED PLASMAS CONSIDERING EDGE EFFECTS* Junqing Lu and Mark J. Kushner Department of Electrical and Computer Engineering at Urbana-Champaign mjk@uiuc.edu, jqlu@uiuc.edu
More informationIn situ electrical characterization of dielectric thin films directly exposed to plasma vacuum-ultraviolet radiation
JOURNAL OF APPLIED PHYSICS VOLUME 88, NUMBER 4 15 AUGUST 2000 In situ electrical characterization of dielectric thin films directly exposed to plasma vacuum-ultraviolet radiation C. Cismaru a) and J. L.
More informationElectron energy distribution function measurements and plasma parameters in inductively coupled argon plasma
INSTITUTE OF PHYSICS PUBLISHING Plasma Sources Sci. Technol. 11 (2002) 525 543 PLASMA SOURCES SCIENCE AND TECHNOLOGY PII: S0963-0252(02)54581-3 Electron energy distribution function measurements and plasma
More informationEffect of wall charging on an oxygen plasma created in a helicon diffusion reactor used for silica deposition
Effect of wall charging on an oxygen plasma created in a helicon diffusion reactor used for silica deposition C. Charles a) and R. W. Boswell Plasma Research Laboratory, Research School of Physical Sciences
More informationMonte Carlo Collisions in Particle in Cell simulations
Monte Carlo Collisions in Particle in Cell simulations Konstantin Matyash, Ralf Schneider HGF-Junior research group COMAS : Study of effects on materials in contact with plasma, either with fusion or low-temperature
More informationMeasurement of electron energy distribution function in an argon/copper plasma for ionized physical vapor deposition
Measurement of electron energy distribution function in an argon/copper plasma for ionized physical vapor deposition Z. C. Lu, J. E. Foster, T. G. Snodgrass, J. H. Booske, and A. E. Wendt a) Engineering
More informationE SC 412 Nanotechnology: Materials, Infrastructure, and Safety Wook Jun Nam
E SC 412 Nanotechnology: Materials, Infrastructure, and Safety Wook Jun Nam Lecture 10 Outline 1. Wet Etching/Vapor Phase Etching 2. Dry Etching DC/RF Plasma Plasma Reactors Materials/Gases Etching Parameters
More informationKeywords. 1=magnetron sputtering, 2= rotatable cathodes, 3=substrate temperature, 4=anode. Abstract
Managing Anode Effects and Substrate Heating from Rotatable Sputter Targets. F. Papa*, V. Bellido-Gonzalez**, Alex Azzopardi**, Dr. Dermot Monaghan**, *Gencoa Technical & Business Support in US, Davis,
More informationContents: 1) IEC and Helicon 2) What is HIIPER? 3) Analysis of Helicon 4) Coupling of the Helicon and the IEC 5) Conclusions 6) Acknowledgments
Contents: 1) IEC and Helicon 2) What is HIIPER? 3) Analysis of Helicon 4) Coupling of the Helicon and the IEC 5) Conclusions 6) Acknowledgments IEC:! IEC at UIUC modified into a space thruster.! IEC has
More informationRobert A. Meger Richard F. Fernster Martin Lampe W. M. Manheimer NOTICE
Serial Number Filing Date Inventor 917.963 27 August 1997 Robert A. Meger Richard F. Fernster Martin Lampe W. M. Manheimer NOTICE The above identified patent application is available for licensing. Requests
More informationHiden EQP Applications
Hiden EQP Applications Mass/Energy Analyser for Plasma Diagnostics and Characterisation EQP Overview The Hiden EQP System is an advanced plasma diagnostic tool with combined high transmission ion energy
More informationLaser ionization and radio frequency sustainment of high-pressure seeded plasmas
JOURNAL OF APPLIED PHYSICS VOLUME 92, NUMBER 2 15 JULY 2002 Laser ionization and radio frequency sustainment of high-pressure seeded plasmas K. L. Kelly, J. E. Scharer, a) E. S. Paller, and G. Ding Department
More informationIntermittent Behavior of Local Electron Temperature in a Linear ECR Plasma )
Intermittent Behavior of Local Electron Temperature in a Linear ECR Plasma ) Shinji YOSHIMURA, Kenichiro TERASAKA 1), Eiki TANAKA 1), Mitsutoshi ARAMAKI 2) and Masayoshi Y. TANAKA 1) National Institute
More informationETCHING Chapter 10. Mask. Photoresist
ETCHING Chapter 10 Mask Light Deposited Substrate Photoresist Etch mask deposition Photoresist application Exposure Development Etching Resist removal Etching of thin films and sometimes the silicon substrate
More informationMAGNETIC DIPOLE INFLATION WITH CASCADED ARC AND APPLICATIONS TO MINI-MAGNETOSPHERIC PLASMA PROPULSION
MAGNETIC DIPOLE INFLATION WITH CASCADED ARC AND APPLICATIONS TO MINI-MAGNETOSPHERIC PLASMA PROPULSION L. Giersch *, R. Winglee, J. Slough, T. Ziemba, P. Euripides, University of Washington, Seattle, WA,
More informationMulti-fluid Simulation Models for Inductively Coupled Plasma Sources
Multi-fluid Simulation Models for Inductively Coupled Plasma Sources Madhusudhan Kundrapu, Seth A. Veitzer, Peter H. Stoltz, Kristian R.C. Beckwith Tech-X Corporation, Boulder, CO, USA and Jonathan Smith
More informationTwo-Dimensional Particle-in-Cell Simulation of a Micro RF Ion Thruster
Two-Dimensional Particle-in-Cell Simulation of a Micro RF Ion Thruster IEPC--7 Presented at the nd International Electric Propulsion Conference, Wiesbaden Germany September 5, Yoshinori Takao, Koji Eriguchi,
More informationSpatially resolved mass spectrometric sampling of inductively coupled plasmas using a movable sampling orifice
Spatially resolved mass spectrometric sampling of inductively coupled plasmas using a movable sampling orifice Xi Li a),b) and Gottlieb S. Oehrlein a),c) Materials Science and Engineering and Institute
More informationGeneration and Acceleration of High-Density Helicon Plasma Using Permanent Magnets for the Completely Electrodeless Propulsion System )
Generation and Acceleration of High-Density Helicon Plasma Using Permanent Magnets for the Completely Electrodeless Propulsion System ) Shuhei OTSUKA, Toshiki NAKAGAWA, Hiroki ISHII, Naoto TESHIGAHARA,
More informationCST EM : Examples. Chang-Kyun PARK (Ph. D. St.) Thin Films & Devices (TFD) Lab.
CST Advanced Training 2004 @ Daedeok Convention Town (2004.03.24) CST EM : Examples TM EM Studio TM Chang-Kyun PARK (Ph. D. St.) E-mail: ckpark@ihanyang.ac.kr Thin Films & Devices (TFD) Lab. Dept. of Electrical
More information2D Hybrid Fluid-Analytical Model of Inductive/Capacitive Plasma Discharges
63 rd GEC & 7 th ICRP, 2010 2D Hybrid Fluid-Analytical Model of Inductive/Capacitive Plasma Discharges E. Kawamura, M.A. Lieberman, and D.B. Graves University of California, Berkeley, CA 94720 This work
More informationApplication of Rarefied Flow & Plasma Simulation Software
2016/5/18 Application of Rarefied Flow & Plasma Simulation Software Yokohama City in Japan Profile of Wave Front Co., Ltd. Name : Wave Front Co., Ltd. Incorporation : March 1990 Head Office : Yokohama
More informationK. Takechi a) and M. A. Lieberman Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720
JOURNAL OF APPLIED PHYSICS VOLUME 90, NUMBER 7 1 OCTOBER 2001 Effect of Ar addition to an O 2 plasma in an inductively coupled, traveling wave driven, large area plasma source: O 2 ÕAr mixture plasma modeling
More informationRetarding Field Analyzer for Ion Energy Distribution Measurement Through a Radio-Frequency or Pulsed Biased Sheath
Full Paper Retarding Field Analyzer for Ion Energy Distribution Measurement Through a Radio-Frequency or Pulsed Biased Sheath David Gahan,* Borislav Dolinaj, Chanel Hayden, Michael B. Hopkins A compact,
More informationEffect of Noble Gas. Plasma Processing Laboratory University of Houston. Acknowledgements: DoE Plasma Science Center and NSF
Ion Energy Distributions in Pulsed Plasmas with Synchronous DC Bias: Effect of Noble Gas W. Zhu, H. Shin, V. M. Donnelly and D. J. Economou Plasma Processing Laboratory University of Houston Acknowledgements:
More informationCharacteristics of Neutral Beam Generated by a Low Angle Reflection and Its Etch Characteristics by Halogen-Based Gases
Characteristics of Neutral Beam Generated by a Low Angle Reflection and Its Etch Characteristics by Halogen-Based Gases Geun-Young Yeom SungKyunKwan University Problems of Current Etch Technology Scaling
More informationarxiv: v1 [physics.plasm-ph] 10 Nov 2014
arxiv:1411.2464v1 [physics.plasm-ph] 10 Nov 2014 Effects of fast atoms and energy-dependent secondary electron emission yields in PIC/MCC simulations of capacitively coupled plasmas A. Derzsi 1, I. Korolov
More informationPlasma Processing in the Microelectronics Industry. Bert Ellingboe Plasma Research Laboratory
Plasma Processing in the Microelectronics Industry Bert Ellingboe Plasma Research Laboratory Outline What has changed in the last 12 years? What is the relavant plasma physics? Sheath formation Sheath
More informationMeasurement of EEDF and Distribution of Primary Electron in a Bucket Ion Source
Fourth IAEA Technical Meeting on "Negative Ion Based NBIs" May 9-11 2005, Padova - Italy Measurement of EEDF and Distribution of Primary Electron in a Bucket Ion Source S. Miyamoto, F. Kanayama, T. Minami,
More informationNanopantography: A method for parallel writing of etched and deposited nanopatterns
Nanopantography: A method for parallel writing of etched and deposited nanopatterns Vincent M. Donnelly 1, Lin Xu 1, Azeem Nasrullah 2, Zhiying Chen 1, Sri C. Vemula 2, Manish Jain 1, Demetre J. Economou
More informationIII. Electromagnetic uniformity: finite RF wavelength in large area, VHF reactors: standing waves, and telegraph effect
III. Electromagnetic uniformity: finite RF wavelength in large area, VHF reactors: standing waves, and telegraph effect IV. Uniformity in time: minimize transients, rapid equilibration to steady-state
More informationTwo-dimensional simulation of a miniaturized inductively coupled plasma reactor
JOURNAL OF APPLIED PHYSICS VOLUME 95, NUMBER 5 1 MARCH 2004 Two-dimensional simulation of a miniaturized inductively coupled plasma reactor Sang Ki Nam and Demetre J. Economou a) Plasma Processing Laboratory,
More informationDEPOSITION AND COMPOSITION OF POLYMER FILMS IN FLUOROCARBON PLASMAS*
DEPOSITION AND COMPOSITION OF POLYMER FILMS IN FLUOROCARBON PLASMAS* Kapil Rajaraman and Mark J. Kushner 1406 W. Green St. Urbana, IL 61801 rajaramn@uiuc.edu mjk@uiuc.edu http://uigelz.ece.uiuc.edu November
More informationINVESTIGATION of Si and SiO 2 ETCH MECHANISMS USING an INTEGRATED SURFACE KINETICS MODEL
46 th AVS International Symposium Oct. 25-29, 1999 Seattle, WA INVESTIGATION of Si and SiO 2 ETCH MECHANISMS USING an INTEGRATED SURFACE KINETICS MODEL Da Zhang* and Mark J. Kushner** *Department of Materials
More informationHelicon Plasma Thruster Experiment Controlling Cross-Field Diffusion within a Magnetic Nozzle
Helicon Plasma Thruster Experiment Controlling Cross-Field Diffusion within a Magnetic Nozzle IEPC-2013-163 Presented at the 33rd International Electric Propulsion Conference, The George Washington University
More informationDual-RadioFrequency Capacitively-Coupled Plasma Reactors. Tomás Oliveira Fartaria nº58595
Dual-RadioFrequency Capacitively-Coupled Plasma Reactors Tomás Oliveira Fartaria nº58595 Index Capacitive Reactors Dual Frequency Capacitively-Coupled reactors o Apparatus for improved etching uniformity
More information