Science & Technology

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1 1 I FREIGN BRADCAST INFRMATIN SERVICE JPRS Reprt DISTRIBUTIN STlirR^v ' ' Apprved tr publi rvh-zze-', Distributin Unlimited Siene & Tehnlgy Eurpe EC 'GREEN PAPER' N JESSI PRGRAM REPRDUCED BY U.S. DEPARTMENT F CMMERCE NATINAL TECHNICAL INFRMATIN SERVICE SPRINGFIELD, VA UTIC QUALITY filspbüibd n 1X

2 JPRS-EST JUNE 1989 SCIENCE & TECHNLGY EURPE EC 'GREEN PAPER' N JESS I PRGRAM Itzehe JESSI PRGRAM RESULTS F THE PLANNING PHASE in English 1 Feb 89 pp 0-IV, 1-51 [Text f the "Green Paper" frm the JESSI [Jint Eurpean Submirn Silin] prjet planning mmittee f the EC] CNTENTS Preamble 1 Editrial 5 JESSI: A Eurpean Mireletrni Ativity 6 Subprgrams utline 1 JESSI Prgram Milestnes 7 The Rle f JESSI Partners 9 JESSI rganizatin 42 Manpwer Required fr JESSI 47 Cst Struture 50 List f Partiipants 51 The JESSI Planning Wrk was Supprted by: 54 Aknwledgement 55 - a -

3 PREAMBLE RECMMENDATIN F THE JESSI PLANNING CUNCIL "intelligent mpnents" By the end f this entury hips will be invlved in virtually all industrial presses and prduts and they will affet mst aspets f human life. In sme respets the intrdutin f hips an be mpared t that f eletriity. Befre eletriity was widely intrdued, hwever, it remained fr 50 years a plaything f the sientists. The Planning Cunil f the JESSI-prjet expets the develpment f hips t preed muh faster than that f eletriity sine hips had a muh shrter inubatin time. Chips is the name given t ICs, the arnym fr "Integrated-eletrial-Ciruits". It wuld perhaps be mre apprpriate t say that IC stands fr Intelligent Cmpnent. The IC is the intelligent part f a prdut r press. It steers, regulates, senses, judges, alulates, amplifies, unts et. It des s in a heaper, faster and mre reliable way than any ther knwn devie. ICs have spread at unparalleled speed thrugh man-made items. It is lear that prduts and presses with intelligent mpnents will ultimately replae mst if nt all urrent unterparts, and will at the same time enable "hm faber" t reate new prduts and presses r manufature prduts mre heaply r enmially. The grup, mpany r natin that an intrdue this tehnlgy first will have a tremendus advantage ver mpetitrs, if the latter ntinue t use traditinal methds. The "traditinalists" will be left behind and they will be faed with an unpleasant psitin mparable t that f the less develped untries tday. This is why the prdutin and appliatin f ICs is f majr strategi imprtane. If Eurpe is t funtin as a plitial and enmi entity it annt affrd t rely n the USA and Japan fr its tehnlgy. This des nt mean that Eurpe shuld aim at mplete self-suffiieny. But at least it must bring the 'balane f the hips trade' in equilibrium. The JESSI-prgramme is designed t seure Eurpe's industrial and enmi future. The prgramme is unique sine it addresses the ttal industrial hain. It is vital that Eurpean

4 industry des nt nfine itself t making hips fr existing systems; it must als be able t reate and design new systems that make use f Intelligent Cmpnents. The JESSI-prgramme as desribed in this Green Bk and the appendies is the result f the peratin f a brad range f industries and researh institutes during a ne-year planning phase (1988). The prgramme nsists f fur sub-prgrammes: Tehnlgy, Equipment and Materials, Appliatin, and Basi and Lng-Term Researh. It is regnized that ertain parts f the JESSI-prgramme have fruitful relatins with initiatives f the EC and f natinal gvernments in the stimulatin f mdern mireletrnis. The sub-prgramme Appliatin is t be arried ut jintly by the users and the IC-manufaturers. A strng integratin between these areas is essential. It is mandatry t launh appliatin prgrammes in rder t validate the tls and presses invlved and t establish the needed nnetins t give the Eurpean users advaned aess t the state-f-the-art tehnlgies. Speial materials and equipment are required fr the prdutin f advaned hips. Prgress in the prdutin f suh hips is fully determined by the availability f new prdutin equipment. In this field t Eurpe has lagged behind. Nt surprisingly therefre the prgramme prpses ways f remedying the weakness. If ICs are f strategi imprtane t Eurpe, then Eurpe must have the means t prdue them. In a mpetitive wrld it wuld be unwise t rely slely n freign imprts. A strategi balane has t be reahed whereby ther untries need ur supplies just as muh as we need theirs. The prgramme ntains many useful initiatives. Hwever these need t be elabrated, extended and rdered in pririty. A majr and aelerated effrt is required n many frnts. New investment is needed, inreased wrk fre is required, s are new frms f peratin. The JESSI-prgramme vers these requirements. The prgramme has been drafted by a brad range f Eurpean mpanies and institutes. It is self-ntained and in the view f the unil, if the peratins desribed in the plan are arried ut in peratin, the stated bjetives will be reahed Hwever, the time-fatr is f ruial imprtane. The plan must me int peratin withut delay if Eurpean firms are t ath up with their freign mpetitrs. The Green Bk reflets the views f industry and ther partners as f ultim It must be nted that tehnlgy and markets hange fast. Therefre, the prgramme will be subjet t regular revisins regarding gals and pririties. This implies that at present the partners agree t the general spe and timing. Detailed mmitments will be made at the time f presentatin f definite wrk-plans, the s alled "Blue Bks".

5 The prgramme has t be nsidered as a framewrk. In sme parts the atins and atrs invlved in the implementatin are knwn preisely. In ther parts neessary tasks are listed fr whih new partners have t be reruited. There are even parts where muh rm is left by the framewrk fr a mre detailed definitin f prjets r subprjets. The Planning Cunil expets that in the sueeding phases new partners will enter and new detailed tasks will be inrprated. The priniple deisin abut funding f the ttal prgramme has t be taken by the gvernments and the Eurpean Cmmissin n the basis f the Green Bk. The deisins abut seleting and funding the varius prjets within the framewrk f JESSI will be taken later n the basis f the Blue Bks. Blue Bks an be prepared by partiipants wh were already ative in the planning phase and by partiipants wh are new r partly new. T qualify fr funding a prjet will have t satisfy ertain rigrus riteria. It will have t fit int the verall plan, invlve peratin with partners and divisin f labur; in ther wrds it must be a jint Eurpean initiative. The plan ntains prmising initiatives fr new frms f peratin. Funds will g primarily t thse firms r institutes prepared t strengthen their peratin ativities r bring in new partners. The Planning Cunil will shrtly prepare a prpsal fr the rganizatin f JESSI. A JESSI-bard shuld be frmed nsisting f maximum 8 persns representing the majr atrs wh exeute the prgramme. Bard members shuld have the nfidene f the natinal gvernments, the EC and the majr industrial and researh partiipants. The bard shuld have the assistane f a small ffie with full-time staff. The first task f the bard will be t speak n behalf f JESSI with the gvernments and the EC. In the exeutin phase the bard is respnsible fr the essentially intense herene f the ttal prgramme. It has t apprve the riteria t be applied in the sub-prgrammes fr seleting atual prjets. Befre the JESSI-bard has been frmed the Planning Cunil will assume respnsibility. The extent f the bard's authrity, the way the bard interats with gvernments and partiipants in the plan, and the bard's relatins with management bards f mpanies and institutes, have still t be negtiated and wrked ut. It is likely therefre that the bard's relatins with the sub-prgramme management bards will nt fllw a unifrm pattern. The Planning Cunil herewith endrses the JESSI-prgramme. It is an integral prgramme, i. e. the fur sub-prgrammes are strngly interlinked - withut this linkage

6 sub-prjets will nt be inluded in JESSI - therefre n drasti hanges, redutins r extensins an be amdated withut rrespnding hanges in ther sub-prgrammes. The Cunil presents the plan t the gvernments and the EC, requesting them t take suh measures that JESSI an be started n shrt term. Cmpanies and institutes are urged t express their mmitment in terms f assignment f adequate manpwer and funds in detailed wrk-plans. The prgramme shuld be in peratin in 1989 in its entirety, sine this is in the interest f the future well-being f the untries f Eurpe. ICs are here t stay but they need t be nurtured and prpagated. Munih, 1 February 1989 The JESSI Planning Cunil, UUlf ^fy/0^^-. (Dr. C. le Pair) (Prf. ir. B.P.Th. Veltman) seretary hairman

7 Editrial JESSI is an 8 years researh and develpment prgram n silin based mireletrnis and its integratin int systems. The definitin and planning phase fr the JESSI Prgram started atively n 1st January 1988 and ends n 1th Deember 1988, as the EUREKA Prjet EU 127. It was the task in the definitin phase t desribe the tehnial gals f the JESSI Prgram and t develp a wrkplan and nepts fr the realizatin phase. The exeutin will start in The rganizatin and task allatin during definitin phase was regulated amng the partiipating institutins and mpanies by the Cperatin Agreement f April The riginal number f partners inreased very sn and has reahed finally a level f 29. These researh institutins and mpanies ming frm 6 Eurpean untries (Belgium, Frane, Federal Republi f Germany, Italy, The Netherlands, United Kingdm) were all ntributing t the planning wrk. The planning was arried ut by five teams, f whih fur setin teams were appinted t the fllwing hapters: - that f hip prdutin, in shrt "Tehnlgy", - that f hip making "Equipment and Materials", - that f "Appliatin" f mireletrnis, - and "Basi and Lng-Term Researh". The fifth team is wrking as a mprehensive Cre Team. A Planning Cunil made up f representatives f the partiipating mpanies and institutins attends the planning prjet. The utline f the planning result is ntained in this dument. Itzehe, 1 st Deember 1988

8 1. JESSI: A Eurpean Mireletrni Ativity 1.1 Eurpe needs Mireletrnis The reent develpment f the tehnlgy-driven industries in the Eurpean mmunity shws, that mireletrnis is the key t mpetitiveness in the areas f date pressing and mmuniatin systems, eletrial engineering, preisin mehanis and ptis, autmtive, and mahinery industry. In 1987 mre than 8 millin peple in the EC were wrking in these industries and realized mre than 600 milliard $ f sales. The diffusin f mireletrnis in these fields is a result f its dynami develpment in terms f st, and size redutin and inreasing level f mplexity and it affets strngly the perfrmane and sts f the prduts and systems in whih it is used. Althugh the integrated iruit industry by itself is mperatively small tday, mireletrnis is a strategi weapn that helps t exprt high tehnlgy gds and servies and thus seures jbs and the standard f living in the EC. Within the next deade, the Eurpean eletrnis industry will beme ne f the largest manufaturing industries in Eurpe. In size, mpared t ATT, IBM, NTT and NEC, the Eurpean system huses are mparatively small: as a nsequene the grwth and strength f Japanese and Amerian mireletrnis suppliers and users, whih have large dmesti markets fr mass prdutin, are a threat fr the future f the Eurpean eletrni industry. It plaes the Eurpean IC-prduers and -users in a very diffiult wrld psitin. The wrld market fr mireletrnis will inrease apprx. 14 % per year until the year 2000, reahing apprx. 160 milliard US $ with a 28 milliard US $ share fr Eurpe. The glbal mpetitin between IC-makers is haraterized by the aim t establish market psitin by market share, regardless f adequate rates f returns. It is ntable, that already in 1987, Japanese IC-makers alne laimed nearly 50 % f the wrld market f ICs, fllwed by the US with a shrinking 9 %. Fr example the mirpressrs as the heart f many prduts are still dminated by the US, while the markets fr DRAM's r hips fr Vidererders are dminated by Japanese IC-makers. The Eurpean IC nsumptin is mre than twie as large as the

9 Eurpean prdutin, thus reating a highly dangerus dependane in a key area f Eurpean industry. Espeially, sine the free aess t US supply f advaned mireletrnis may be influened by glbal military aspets, that t Japanese supply by glbal enmi interests. The fear is, that frm a dependeny in mireletrnis, a dependeny in eletrnis will fllw, as the ase f the mputers and Vidererders e. g. shws. Furthermre, the supprt by gvernments and gvernmental bdies in the US (e. g. by the Dep. f Defense r SEMATECH*) and in Japan (e. g. MITI, NTT, NHK) is fussing and strengthening industrial strategies in a way, that has n unterpart in Eurpe. There are mre arguments fr strng Eurpean suppliers f mireletrnis: An inreasing part f the perfrmane f high-teh prduts is realized by the integratin n a single appliatin-speifi r even ustmer-speifi hip. S, a lse and trustful ntat between system manufaturer and hip manufaturer bemes ever mre imprtant: Eurpean users shuld have a healthy advaned Eurpean IC supply alternative. Last but nt least, hips have t be available at mpetitive sts: The highly vlume-dependent st struture f the IC-manufaturing press requires a high-vlume manufaturing apability. The Eurpean eletrnis industry must grw nsiderably t play this imprtant supply rle in the Eurpean Cmmunity. 1.2 Mireletrnis needs Eurpe The Eurpean IC-lndustry is vigrus and innvative, and demnstrates its willingness t keep pae with the rapid tehnlgial advane by enrmus investments in researh and prdutin failities. The same is true fr the systems industry. But in respet t mireletrnis they still require help by well defined Eurpean pliies. This shuld inlude trade pliies and the reatin f Eurpean hme markets. Furthermre, innvatin supprt shuld inlude prmtin f prjets leading t new mireletrnis manufaturing tehnlgies, and t new advaned prduts integrating Eurpean appliatin knw-hw in silin hips. * SEMATECH is a jint R&D ativity f U.S. semindutr and semindutr prdutin equipment manufaturers, whih reeives a subsidy frm the U.S. gvernment vering 50 % f its sts.

10 Natinal supprt f mireletrnis is prvided; hwever, the size f assistane needed exeeds the natinally available funds; it needs t be mplemented by a Eurpean effrt. Further there is supprt within the ESPRIT framewrk, but n submirn CMS tehnlgy is vered in brad, althugh this will be the dminating tehnlgy base f the three large Eurpean IC-makers in the 90s. 1. Tehnial Trends Tehnlgy If tehnlgial develpment wrldwide up t 1995 preeds at the same rate as in the past, the target figures listed in the fllwing table uld be ahieved. Expeted Tehnlgy Data Expeted Tehnlgy Tehnlgy Drivers DRAM SRAM EPRM Transist/hip Memry Lgi max. hip area (mm 2 ) 0,7* 0,5 u. 0,5 v. 4 M 1 M 4 M 16 M 4 M 16 M 64 M 16 M 64 M 6 X 10? x10? 10 6 X 10 5 x The transitin t the mpnent tehnlgy predited fr 1995 in whih, fr example, a 64 Mbit-memry (DRAM) uld be prdued, will require the appliatin f fundamentally new slutins in essential sub-fields, suh as leanrm tehnlgy, lithgraphy, wafer handling, pakaging, bnding tehnlgy, et.

11 At the same time, the st redutin per iruit funtin will have t ntinue, althugh bth the develpment sts per iruit, and the vlume f investment fr a semindutr plant will inrease at even higher rates. In this ase, nly new prdutin tehnlgial nepts an insure the ntinuing innvative strength f mireletrnis. Appliatin As said earlier the use f mdern mireletrnis in the key industries is essential fr the enmi grwth f the Eurpean untries. In the year 2000, n-hip system slutins will represent 50 % f the IC market. The strength f the Eurpean industry is its system knw-hw. In the future, translatin f this knw-hw int prduts by means f standard IC's will gradually be replaed by integratin f the entire system n an appliatin-speifi hip. The grwth dynamis espeially in the fast grwing area f appliatin-speifi iruits and systems will be strngly influened by the questin whether the speifiatin and design press fr the Systemintegratin f mireletrni mpnents, inluding mplex "systems n a hip", an be methdially and instrumental^ mastered and quikly put int peratin. Eurpe is therefre in a diffiult situatin, sine the semindutr industry has available its wn design systems; hwever, the users f ICs (i. e. system and equipment manufaturers) are nt suffiiently invlved in the design press regarding their systems knw-hw. Cnsequently, the IC-users are lking fr design system whih supprt the entire system design press, whih guarantee far-reahing independene frm semindutr manufaturers and whih insure the prtetin f system knw-hw. 1.4 Definitin and Gals f JESSI The main gal f JESSI (Jint Eurpean Submirn Silin) is t seure the availability f wrld-mpetitive mireletrnis fr the Eurpean industry. It is a prpsed EUREKA researh and develpment prgram fr the tehnlgy f system integratin based n silin. The prgram has fur main issues (Fig. 1.1): Tehnlgy: Develpment f the basis and prving f a flexible mpetitive manufaturing tehnlgy fr advaned system appliatins, t be available by the mid-90s. The mst advaned tehnial gal, within the framewrk f the JESSI Prgram, is a

12 CMS-press with minimal strutures in the 0. ^m range. This fine struture range is ahieved thrugh intermediate steps at 0.7 um and 0.5 um. Eah intermediate develpment invlves the verming f tehnial barriers thrugh innvative press steps. Redutin f manufaturing sts will be ne f the mst imprtant targets. Memries (DRAM/ VRAM/SRAM/EPRM) are t be used as the tehnlgy drivers. Appliatin: Building up f flexible mpetitive system-design predures and tls whih are appliable thrughut Eurpe, fr the develpment f highly mplex integrated iruits and their integratin int systems, as well as their verifiatin in advaned jint pilt prjets in majr areas f appliatin. The Eurpean industry has a wrld-wide leading psitin in slutin-riented system knw-hw in a brad range f appliatin fields. The diret knwhw transfer int mireletrni systems realized n silin is f inreasing imprtane in mparisn with the use f standardized integrated iruits. The mpetitiveness - tday and in the future - in standard iruits (e. g. memries) will be determined largely by the smallest struture size, the highest integratin density and prdutin tehnique. The mpetitive strength fr the develpment f appliatin-riented system slutins within this time frame, hwever, is t the largest extent determined by the availability f flexible press apabilities and design tls. Within the framewrk f JESSI, appliatin-riented system-develpment tls will be tested in pilt prjets (Eurprjets), fr example, in infrmatin pressing, industrial eletrnis, autmbile eletrnis and in the nsumer sphere. Equipment and Materials: Develpment f manufaturing equipment and materials fr mireletrnis in seleted areas f the Eurpean supply industry. Wrld mpetitiveness fr the Eurpean semindutr industry requires immediate aess t the mst advaned manufaturing equipment. This an nly be ahieved by the supprt f a strng Eurpean supply in the areas f manufaturing equipment and semindutr materials. The earliest availability f equipment and materials arding t the tehnlgial develpments in the semindutr industry must be seured. 10

13 Clse -peratin between Eurpean IC manufaturers and the Eurpean equipment/material suppliers is essential, as the ase f Japan shws. Effetive frms f -peratin will be develped within the framewrk f the JESSI prgram. Basi and Lngterm Researh: Cmplementary applied researh fr the lng-term future. In rder t seure Eurpe's future enmi interests and t apitalize n its urrent strengths in mireletrnis, JESSI's starting pint must be a wellrganized interatin between industry and researh institutes. Mediumterm gals f the "basi and lngterm researh" are t supprt the industrial develpment f ICs and their appliatin, with feature sizes dwn t 0. um, and t wrk ut alternative slutins. The ntributin t JESSI may vary by untry, depending n industrial and aademi infrastruture and n natinal plitial and finanial strategies. A balane has t be fund in Eurpe between a unifrm apprah fr JESSI fr ail untries and parties, and a partiipatin arding t natinal and setrial interests. 11

14 Q. 2 at CL 55 g ' C CG tz JC H V C ) V D C C 0) re _l QC TJ (0 n C a r 5 "5 T 5 X) E ö 8 C I " C C CL C C *= a) V V V C 111 H- C a < a < < velpment Press De Ü EPRM SRAM s < Q >..8 u u C ) i f C 5 <= C C '> a> 1 u tj JU 0 C * - " a «a m..2? CD C E C a a *^ 11 D C ts CT 111 :> F»*- en n i~ ) U) n _) Q. CJ k. (- C a C1 r CD C CD 5 u if CD > ~ ü u C u. g -1 ü UJ u U. E C l_ D) i 0. ^^ C CT) UJ - 1- T- ) Li. 12

15 2. Subprgrams utline 2.1 Subprgram: Tehnlgy Atual Situatin in Eurpe Develpment and mpetitive manufaturing f state-f-the-art VLSI- and ULSI-iruits demand nt nly adequate press tehnlgies but als refined r nvel manufaturing tehnlgies. Whereas eurpean semindutr manufaturers are exellent in sme areas f press tehnlgies (as demnstrated, e. g., in the MEGA prjet), an verall view f press tehnlgies indiates gaps in mparisn t verseas mpetitrs. The situatin is similar r even wrse fr manufaturing tehnlgies. There is nt muh eurpean experiene when it mes t st-effiient n-time peratin f large wafer-fabs fr submirn tehnlgies. There is, hwever, a grwing nsensus amng experts in the field that the present eurpean ways f manufaturing integrated iruits are t stly and that manufaturing engineering shuld be treated as "true" siene as is dne in Japan and the USA (Semateh). Philips, Siemens and SGS/Thmsn (ST) all have large mireletrnis R&D enters at their dispsal whih are apable f develping the press tehnlgies f the future. Eah mpany exels in a different memry type (SRAM, DRAM, EPRM fr Philips, Siemens r ST, respetively) and uses its memry as tehnlgy-driver fr ther prduts. Press develpment fr future memry generatins therefre relies n the mpany R&D enters. Sine the resures (Investment and Manpwer) needed fr the independent develpment f a new memry generatin are frbiddingly large, peratin n all pssible levels, expliting the large degree f synergy in subum-tehnlgies, uld nt nly redue sts and develpment risks but wuld als aelerate the verall prgram and therefre needs t be established r intensified. Prgress in manufaturing engineering, t, needs dediated large-sale effrts. Again, peratin in as many areas as pssible withut giving up the individual mpany strategy, is mandatry. Equipment-seletin and -engineering, autmatin, lean-rm tehnlgies - inluding waste-management and safety issues - are areas whih lend themselves t a high degree f peratin and burden sharing. 1

16 Mastering memry tehnlgies and the rrespnding manufaturing tehnlgies are the neessary (but nt suffiient) ingredients fr the mpetitive manufaturing f lgi iruits. The strategi value f lgi iruits in general - r ASICs in partiular - fr the eurpean end users is high and expeted t grw. At present the degree f peratin between the three IC manufaturers is nt yet suffiient. Effrts t intensify peratin already are under way; JESSI will be essential t inrease the mmentum twards a lser peratin espeially in lgi-iruit tehnlgy Subprgram Gals There are three majr gals in the tehnlgy subprgram: 1) Develpment f submirn (dwn t 0, ^m) memry generatins (DRAM/VRAM, SRAM, EPRM) inluding the wrk needed t prvide the neessary pressing envirnment. 2) Develpment f lgi tehnlgies starting frm tdays 1,zm tehnlgy-base t utilizatin f the submirn tehnlgies that will be prvided by the memry prjets. This develpment inludes iruits derived as diretly as pssible frm memry presses (e. g. mirpressrs, gate-arrays) and mre advaned iruits that ntain press-mdules nt diretly related t a rrespnding memry generatin (e. g. BICMS r Lgi with E 2 PRMs). ) Develpment f manufaturing engineering methds that assure timely and st-effiient prdutin f present and sub-mirn iruits n 150 mm and 200 mm wafers. The pae f the neessary ativities is set by the wrld-market whih is dminated by verseas mpetitrs. The partiipating mpanies are fred t use the best equipment available, regardless f its rigin r a resulting partial dependene n verseas equipment suppliers. These mpanies, hwever, wuld like the eurpean equipment makers t be mpetitive n the wrld market and therefre are mitted t a lse peratin with the eurpean equipment industry within the framewrk f JESSI. The gal is t derease the dependene n nn-eurpean equipment; interatin with seleted equipment manufaturers is 14

17 therefre a neessary ativity nneted with the tehnlgy subprgram. Researh and develpment f 0.5 um memry presses has already started in all three mpanies. Naturally, they are based n the preeding memry generatins and take plae in the respetive R&D enters. Sine mpany histries are different and the present 0.7 urn CMS presses are different, the 0.5 urn presses annt be fully unified in the future. This is unavidable beause f differing iruit requirements (e. g. very different speifiatins f thin dieletris fr DRAM, SRAM and EPRM). Cperatin n the 0.5 ^m press and in partiular n the 0. urn press, hwever, is intended n pressmdules and rrespnding equipment (e. g. planarized depsitin f intermetal dieletris), n devie and press mdelling, n reliability issues, n pakaging, and n many aspets f manufaturing engineering. Whereas the ptential f this peratin is large, it is nsidered mandatry that eah mpany will retain the ability t press its wafers in its wn R&D enter. Researh and develpment wrk fr 0. um presses is still in its infany. All that an be stated s far is that even strething, many presses and materials t their utmst limits will nt be suffiient; a sizeable number f new press mdules and materials must be fund. A larger degree f peratin appears t be pssible; ideally a mmn "bak-bne" CMS press uld be established that eah mpany uld use fr its wn purpse. By adding speifi press mdules t and by minr mdifiatins f the bak-bne press, eah mpany uld derive its speifi prdut spetrum (inluding Lgi) and thus still remains a mpetitr in the market plae. Lgi iruits fllw the rrespnding memry generatins with a time-lag f 2 - years. In a first step, a memry press that has demnstrated stability, high yield, and high reliability will be used fr the pressing f lgi iruits with as little press mdule mdifiatins and additins as pssible. Fr a SRAM derived Lgi this may imply n mre than anther layer f metallizatin; fr DRAM r EPRM derived Lgi a few speifi press-mdules may have t be added t a simplified memry press beause f different eletrial requirements. The ptential fr peratin is similar t what has been stated abve, with the added pssibility f knw-hw exhange fr lgi-speifi press mdules. 15

18 In a next step, the lgi iruits thus established will serve as a base fr mre sphistiated prduts. These an be envisined as lgi iruits that inrprate "ptins" in the frm f ne r mre speifi funtinal units. Examples uld be biplar transistrs (BICMS) fr, e. g., pwer appliatins r E^PRMs fr, e. g., "smart ards". Whereas these ptins may already exist as stand-alne prduts, their inrpratin int a lgi design and press-flw is nt straight-frward and will require speifi and smetimes extensive wrk. The develpment gals that have been desribed and set int their ntexts might be nsidered t be met as sn as engineering samples f memries r f Lgi-demnstratrs are funtinal n time. Whereas this wuld be true fr the respetive press develpment, the ahievement f nly these gals wuld nt address all bjetives f the Subprgram Tehnlgy. An equally signifiant gal must be t demnstrate in suitable pilt-lines (inluding wafer pressing, assembly, and testing) that prduts an be manufatured in suh a way that milestne and st targets are met. These targets may be widely different, e. g. fr DRAMs, and full-ustm ASICs: Fr DRAMs mass-prdutin at mpetetive sts and therefre high yields are neessary; press yle time and flexibility is f sendary imprtane. In ntrast, full-ustm ASICs require shrt press-yles and high flexibility, whereas yields and st nsideratins beynd a ertain level uld be f sendary imprtane. Addressing these nfliting requirements withut sarifiing a unified apprah t manufaturing engineering is a demanding task that requires new nepts and ideas. Issues that require extensive wrk, espeially beause 200 mm wafers have t be taken int aunt, are, e. g., equipment engineering (starting with translating press requirements int equipment speifiatins and ending with imprving and maintaining wrking equipment); autmatin (starting with mputer - aided lt traking and ending with a mstly autmated fatry) and lean-rm nepts (seleting between radially different apprahes as, e. g., large "super" lean-rms r lalized lean-rm nepts suh as SMIF). Manufaturing must be mpetitive. This means ptimizing st, yield, yle time, press flexibility, equipment utilizatin and labur prdutivity alling fr an apprpriate level f autmatin. This level will be a mving target twards full autmatin whih presumably will never be reahed. Autmatin is limited by equipment reliability and press stability, as well as the need fr flexibility. Pssible benefits als have t be arefully balaned against autmatin-speifi 16

19 sts, as demnstrated by the failure f existing fully autmated failities. Even with ptimal autmatin, the prdutin f integrated iruits will require a sizeable human wrk-fre. This wrk-fre must nt nly be highly trained and willing t wrk in shifts (7 days a week), but must identify itself with the task in an unpreedented way. An integral part f manufaturing engineering is t speify the atins neessary t assure adequately trained human resures Subprgram Struture The Subprgram Tehnlgy nsist f 5 prjets. All prjets are strutured int prjet setins (e. g. Design, Press, and Supprt fr the DRAM/VRAM-prjet) whih are in turn partine'd int subprjets. The subprjets (e. g. Lithgraphy) define the wrk t be dne, the relatin t ther prjets/subprjets and the majr mile-stnes. 1) DRAM/VRAM: This prjet ntains all the wrk neessary t btain engineering samples f 16M and 64M dynami randm-aess.memries and "Vide"-RAMs (whih are DRAMs with a speial design). 2) SRAM: This prjet ntains all the wrk neessary t btain engineering samples f 4M and 16M stati randm-aess memries. ) EPRM: This prjet ntains all the wrk neessary t btain engineering samples f 4M, 16M and 64M eletrially prgramable read-nly memries. 4) LGIC: This prjet ntains all the wrk neessary t btain engineering samples f lgi iruits as demanded e. g. fr the ativities f the subprgram Appliatins. It enmpasses basi memry based lgi as well as Lgi with ptins. It is a prjet in whih Philips, Siemens, and SGS-Thmsn will share resures and burdens as far as pssible by taking int aunt their respetive prdut strategies. 17

20 5) Manufaturing Engineering This prjet ntains all the wrk neessary-t insure timely st-effiient pilt prdutin f memries and lgi leading t prdut qualifiatin and subsequently enmized press. It is a prjet in whih the partners pursue their prdutin strategies while using results and knw-hw generated in jint effrts. 18

21 2.2 Subprgram: Equipment and Materials Atual situatin f the Eurpean Equipment Industry Fr the time being the Eurpean equipment industry shws with a few exeptins a very weak psitin wrldwide. The equipment market is dminated by US-manufaturers with a steadily inreasing market share by Japanese mpanies. In rder t be prfitable in the equipment market shwing a fiere mpetitin, the Eurpeans have t perate wrldwide beause there wn hmebase is muh t small. The prime reasn fr this situatin lies in the relative psitin f the Eurpean IC-industry itself, whih in the past was lagging behind the mst advaned IC-tehnlgy. There was therefre n grund fr having a strng equipment industry arund. All the equipment required was easely available frm utside, beause there was f urse n need t exlude the Eurpean mpanies frm aquiring this equipment neither tehnially nr mmerially. There was n general thrust frm the IC-industry t make a perative effrt in building up a mpetitive equipment industry in Eurpe. The lse peratin hwever is the indispensible prerequisite fr develping high quality prdutin systems fr IC-fabriatin. The strng effrts within ESPRIT and the MEGA-prjet led t a shrinking gap between the US/Japanese and Eurpean mpanies in speifi areas (e.g. memry hips) requiring the mst advaned tehnlgy. With mmerial suess the mpetitin with the Japanese and US-IC-manufaturers will get rugher and the prbability nt t have the mst advaned equpiment available frm thse untries in time will inrease with the prgress f the Eurpean IC-manufaturers. The situatin fr the hme market f equipment makers will hange psitively. First the hmebase will braden and sendly the immediate aess t the mst advaned equipment will gain strategi imprtane with grwing strength f the Eurpean IC industry. The fat, that the equipment industry is ne f the strategi elements bemes evident frm the ativities within the US effrt SEMATECH. In a strategi apprah the Eurpean IC-industry will als have t influene the develpment f innvative equipment. 19

22 Despite the favurable develpment f the equipment market, in Eurpe the base will still remain rather limited, therefre it is a must fr the equipment industry t perate wrldwide. With inreasing mplexity f the advaned equipment the R & D-sts as well as the develpment time will inrease dramatially. This finanial burden an nt be arried by the still relatively small Eurpean mpanies themselves. T pe with the wrldwide mpetitin espeially beause f the strng flutuatin in IC-industry the mpanies have t have adequate finanial and tehnlgial resures. There are nt nly hanes fr the larger equipment makers. There will be als hanes fr smaller manufaturers f R & D-equipment as well as f subsystems (e.g. Rf-pwer supplies and measuring equipment). In judging the atual situatin in Eurpe it turns ut that the researh base is fairly well established in Eurpe. But n R & D-infrastruture is available t test and ptimize innvative prttypes. Als fr the deisive step in equipment develpment, that means the testing and ptimizatin phase f the equipment in an IC-fab-line, the prenditins were nt very favurable in the past. ne f the main issues during the JESSI-prgram has t be therefre the imprvement f the infrastruture fr develping prttypes (strengthening f speifi entres f exellene e.g. AIS/IFA, Leti, Ime) as well as the establishment f a lse peratin between the equipment and the IC-manufaturers fr the develpment f high perfrmane prdutin systems Rle f the "Equipment and Materials" within the JESSI-prgram Deriving frm the prime JESSI gals, the rle f the subprgram "Equipment and Materials" within the JESSI-prgram is twfld: Firstly the subprgram "Tehnlgy" has t be supprted whih aims fr the prdutin f 16 Mbit and 64 Mbit memries respetively. T ensure that the equipment being develped within the JESSI prgram fullfills the tehnlgial requirements fr the 16 Mbit/64 Mbit prdutin the IC-manufaturers have t have a strng influene n the develpment f this kind f equipment. 20

23 Sendly JESSI aims t build up a slid base f Eurpean equipment manufaturers als fr the time beynd the JESSI-prgram. This is speifially valid fr all thse systems whih prmise a ptential f appliatin fr the future (e.g., multi-hamber pressing). In rder t build up a sund equipment industry in Eurpe a lng term strategy shuld exeed the perid f the JESSI-prgram. Frm the present pint f view it desn't make sense t takle the whle equipment market. In rder t take full advantage f the limited resures within Eurpe the develpment f manufaturing equipment shuld be fussed n seleted areas. The strnger peratin between equipment makers and IC-prduers freseen within the JESSI prgram will als reate a better framewrk fr the planing f prdutin and marketing shemes fr the equipment and material makers Subprgram struture Speial attentin has t be given t the prmpt availability f equipment with 200 mm wafer apability. In identifying the imprtant areas in whih the Eurpean equipment manufaturers may be ative the fllwing riteria have been emplyed: strategi imprtane (key systems) urgent need f the IC-industry (n satisfatry systems available yet) wrldwide mpetitive situatin speifi tehnlgial strength in Eurpe fields f new emerging, highly innvative systems The subprgram nsists f 5 prjet grups (e.g. Lithgraphy riented equipment). All the prjet grups are subdivided in prjets (e. g. ptial lithgraphy) whih in turn are partitined int varius subprjets (e. g. ptial lithgraphy: new ptial materials, retile generatin, new DUV-tehnlgy). The prjets as well as the subprjets d nt define the detailed wrk t be dne but rather the imprtant areas t be dealt with in rder t develp a piee f equipment suessfully. 21

24 1. Autmatin/lean rm: This prjet grup ntains autmated press equipment (autmated wafer handling, data interfaes et.), equipment fr autmatin (ratile strage units et.), mputer ntrl systems (CAM/CIM) and lean rm tehnlgy. 2. Nn-lithgraphy equipment: This prjet grup ntains the equipment develpment whih immediately supprts the tehnlgy fr the 16 and 64Mbit generatins (e. g. furnae xidatin, rapid thermal annealing, in implantatin, ething et.) as well as thse equipment develpments whih will prbably nt be used as prdutin equipment within the JESSI framewrk but whih ffer a high ptential fr the future.. Lithgraphy-riented equipment: This prjet grup is als divided in ativities supprting immediately the 16/64Mbit-tehnlgy (ptial lithgraphy, resist pressing, ptial CD metrlgy et.) and in thse prjets whih will supply alternative ptins fr existing lithgraphy tls (X-ray lithgraphy, eletrn beam lithgraphy). 4. Bak end pressing/testing: This prjet grup nsists atually f tw distint prjets (assembly and testing) with a rather large number f subprjets (assembly: diing, die attah et., testing: IC-tests, burn-in et.). The prjets within this prjet grup are primarily direted twards an immediate appliatin in the 16 and 64Mbit tehnlgy. The main issues are the reliability and perfrmane f the equipment, the ntaminatin aused by the materials used (ins, metals, alpha partiles) as well as the flexibility t pe with the upming ASIC- IC-tehnlgy. 5. Materials This prjet grup ntains the develpment f high quality silin base material, f press materials (pht resist, gases, wet pressing hemials), f the pakaging materials (plastis, eramis) as well as f metals and quartz. Develpments in this area are supprting the 16/64Mbit-tehnlgy 22

25 diretly and will therefre be explited within the JESSI framewrk. Within these tpis the ntributins entail the atual state f the art (inluding the mpetitive situatin), the atual tehnial and mmerial prblem areas, the nminatin f tehnial issues t be takled in future prjets. In this state a differentiatin was made between shrt, medium and lngterm strategies. A ranking system 1 t has been applied (either fr the immediate supprt f the IC r fr the suess f the equipment industry) Equipment develpment The develpment f a piee f equipment nrmally exhibits three learly separated phases (material develpment is different). The R & D riented first phase deals mainly with new and innvative nepts leading eventually t a labratry type system fr feasibility studies. In this stage primarily a paratin between R&D failities and equipment manufaturers is required. The IC-industry sets the tehnlgial frame, but nrmally there will be n strng invlvement f the IC-manufaturers in the single prjets. This phase is generally haraterized by a large number f smaller prjets. The bakbne f a suessful equipment develpment prgram is a lse peratin between the equpiment manufaturers and the IC-industry. In the first tw stages f the equipment develpment the invlvement f Eurpean R&D failities (enters f exellene) will supprt this perative effrt. In the send phase prmising equipment nepts will be ntinued twards a first prttype system by the equipment manufaturers. At the end f this engineering phase a mature prttype system whih is able t be implemented in an IC-pilt-line has t be prvided. There will be peratin between R&D (speial subtasks), the IC-industry (prviding the speifiatins and tehnial guidelines) and the equipment manufaturers (develping the tehnial nept and the system design). In this stage there may be still mre than ne nept heading fr the same tehnlgial gal beause it is ften impssible t asses the perfrmane f the speifi nept within this phase. Fr sme strategi imprtant prjets (e.g. DUV-stepper) there may already be a strng mmitment f the IC-manufaturers. In the third phase, hwever, a strng mmitment is the neessary prenditin fr the develpment f a mature piee f prdutin equipment. The evaluatin and the ptimizatin f thse systems required have always t be arried ut in 2

26 diret njuntin with an industrial key ustmer. In this ntext the IC-industry is seleting apprpriate prttype-systems shwing the best prenditins (maturity, speifiatin, et.) fr further ptimizatin twards the final prdutin system Material develpment Beside the silin base material whih has always been regnized as the key fr a suessful fabriatin f integrated iruits the press materials like phtresist, gases and the pakaging materials (plastis, eramis, et.) as well as metals and quartz et. gain rapidly imprtane fr the semindutr press tehnlgy. ne f the main issues fr future VLSI tehnlgy nerns the extreme lw level f ntaminatin and partiulates whih are aeptable fr a reasnable yield. The materials addressed in this setin d nt inlude the materials being used in the equipment (e. g. gas tubes, valves, ntainers, eletrdes) whih f urse have als a very high imprtane fr the press tehnlgy. These materials, hwever, are nsidered as being part f the equipment develpment. Unlike the equipment develpment there is n lear separatin between basi researh and final prdut develpment in the materials setr. Therefre the strng invlvement f the IC-industry in the materials develpment is required right frm the beginning. That means all prjets running in this setin shuld be based n a very lse peratin between the materials manufaturers and the IC-industry. Prviding very pure materials is, hwever, nly the first step in having the leanest material available in the press. There shuld be, therefre, als an intensive peratin between the materials and the equipment manufaturer in rder t analyze the interatin between the press materials and the speifi parts f the equipment (ntainers, tubes et.) and t ptimize thse submpnents fr retaining the high degree f purity f the materials up t the pint f use. Anther strng interatin with the analytial part f the basi researh ativities is required fr develping measuring methds fr very lw ntaminatin levels nt yet available. In rder t prvide the highest pssible quality f the silin material (defets, material inhmgeneities et.) the rystal grwth equipment has t be imprved drastially. The transitin frm 6 t 8 inh whih is likely within the JESSI-prjet alls fr new nepts in the rystal grwth equipment. Therefre the develpment f this piee f equipment has been implemented as a indispensable prerequisit fr prviding high quality silin 24

27 material in this prjet area Rules fr the seletin f prjets Prjet prpsals in the first phase as definited earlier will primarily fus n sub mpnents (in-situ measurements, materials, et.) r n new nepts (pht-indued presses, new press-hemistry et.). The JESSI-prgram prvides the frame fr the prjet. In the send phase a first prttype has t be develped fit fr IC-manufaturers t perate in a pilt-line fr test and evaluatin. nly thse prjets have t be seleted whih fullfill the speifiatin set by the IC-industry r at least fit in the future tehnlgy trends als judged by the IC-industry. There may exist, hwever, different prjet prpsals aiming fr the same gal. In the same way as the IC-industry has t be free t lk fr help utside the Eurpean frame-wrk (in ase f n adäquate Eurpean base t develp the speifi mst advaned equipment) the equipment manufaturers have t have the pprtunity t perate with IC-manufaturers utside the Eurpean mmunity in rder t push a prmising nept whih may nt fit.mpletely in the atual philsphy f the Eurpean IC-manufaturers. In the third phase there are strit seletin rules (may be similar t SEMATECH) whih prmte the best prttype system twards a mature prdutin system. The exat rules fr making a fair seletin have t be established later n. Apart frm the riteria mentined in 2.2., the fllwing general riteria have t be met: 1. Tehnial prerequisites: - high innvative nepts - sund tehnlgial strength within the mpanies suffiient R&D resures within the mpany 2. The mmerial prerequisites: suffiient finanial resures wrldwide servie/marketing limited strength f the mpetitrs wrldwide 25

28 Subprgram Appliatin 2..1 Present situatin in Eurpe T design mplex systems, the user enunters a panrama f islated, nn-mpatible tls. These d nt pe suffiiently with the existing mplexity. Mrever their peratin requires intensive training. Tls f tday are mstly either aptive, i. e. nt available in publi dmain, r me frm US-mpanies. Lng term supprt and maintenane are ften nt guaranteed. And, what makes the situatin wrse, standards and mmn libraries d nt exist. What is laking -abve all- in Eurpe is the spirit f TGETHERNESS whih is typial fr Japan Inrprated. Japanese mpanies mpete strngly amngst eah ther, but nt befre having shared in the effrt t nquer a new market fr Japan. Many semindutr manufaturers, espeially in far east, are integrated int vertially strutured system huses. Therefre, areful attentin must be paid t defining user/prduer interfaes in rder t guarantee prtetin f the users knw-hw Subprgram Gals Fr the develpment f the future design envirnment, it is neessary t align the existing Eurpean ptential and t use it tward ahievement f the user's gals. The design envirnment must exhibit at least enugh strength t realize systems f that mplexity as mentined in the tehnlgy subprgram. This has t be dne frm the neptin phase f the system all the way t the finished prdut. This requires bth the mastering f tehnlgy-based ptins as well as the mpletin f varius system designs, based n different tehnlgies, in as shrt a develpment time and as st effetive äs pssible. JESSI shuld enurage the reatin f a Eurpean CAD sftware supply. Fr the use f design apabilities and the meaningful appliatin f IC's it is neessary t have trained speialists. This is als the ase fr the develpment f appliatin tls. The training aspet, therefre, is an imprtant issue. 26

29 There are tw majr gals f the subprgram "Appliatin". Building up f flexible mpetitive predures and tls fr the develpment f highly mplex integrated iruits and their integratin int systems. Develping prttypes f mireletrni systems whih may serve as vehiles fr speifiatin and evaluatin f CAD systems using advaned tehnlgies in strategi appliatin areas. T ahieve this gal a number f prjets have been defined and are gruped int three main tpis: CAD Tls and Envirnment-Prjets have t prvide a pwerful and mpetitive CAD-System. This system has t be nfigurable in suh a way that big mpanies as well as small and medium sized nes are able t mpse their speial tlbx with mderate sts. The results are suppsed t be evaluated by users, e. g. in Eurprjets Eurprjets aim fr bringing up prttype systems frm whih requirements fr essential new tls beside the general nes frm abve will be derived. They als serve as test vehiles fr tls, envirnments and system design methds. Eduatin and Training will have t prvide an inrease in the number f skilled system design engineers and CAD persnel. Eduatin and training prgrams in universities and tehnial lleges will fus n the needs f small and medium sized mpanies. The prjet JESSInet will be set up t failitate mmuniatin between the partners, and must be set up during start- up prjets. The prjet Eurpean CAD Initiative will yield an rganizatin, that pushes standardizatin, balanes the influenes and rdinates the deentralized atins f the partiipants.,2.. Subprgram Struture Prjet Grup Supprt Besides the tehnial Prjet Grups there exists a set f prjets that handles mre general issues like rganizatin, mmuniatin - eduatin and training. 27

30 Beause f the deentralized realisatin f the subprgram "Appliatin" a tight upling f all ativities is required. An rganizatinal struture ( wrking title ECI = Eurpean CAD Initiative), that balaned the influenes f all partiipating mpanies and institutes, has t ensure the utme f mmerial, pwerful and mpetitive CAD systems, based n wrldwide standards. ECI will be respnsible fr all aspets nerning standardizatin and interfaes (definitin/seletin, prmtin, rdinatin, initiating, and ntrl). The ECI may als give advie t JESSInet, and eduatin and quality. Frm existing experiene in individual mpanies and institutes it has beme lear that a netwrk is essential t imprve a fast and easy aess and distributin f mmn infrmatin (TGETHERNESS). Sme levels f eduatin and training in the area f eletrni system design, VLSI design, tl management and sftware engineering will have t be supprted by the JESSI prgram. Next t regular urses in universities and tehnial lleges training prgrams n JESSI CAD tls and the underlying methdlgies will have t be prvided t the industry, espeially t the small and medium sized mpanies. These ativities shuld result in an inrease f the number f skilled CAD persnel (designers and sftware develpers) and eletrni system engineers Prjet Grup "CAD Tls and Envirnments" The design and develpment f mplete systems must be supprted. This task bemes mre mpliated as systems may be mpsed f different levels f implementatin (physially e. g. bards and integrated iruits), and additinal prblems arise at the interfaes between these levels. Furthermre, system design has t pe with a variety f different target tehnlgies (e. g. fr digital r analg appliatins, fr ptial/ magnet- mehanial interfaes) and target arhitetures (ranging frm multipressr netwrks dwn t glue lgi in a variety f appliatins). Additinally, all levels f abstratin shuld be vered in the design press. System design addresses all these areas. An attempt t verme at least sme f the related prblems requires a mmn tl envirnment. Thereby, 28

31 standardizatin f interfaes is urgently needed as well as an pen design system whih allws the easy integratin f new tls. The diret appliatin f general tls as well as the speifiatin f speial nes within Eurprjets guarantees the neessary feedbak fr tl develpment. Within this Prjet Grup an pen, integrated envirnment and CAD tls will be develped whih - enable enmi, fast, reliable and effiient system design in a design envirnment as independent frm tehnlgy as an be. - are apable t handle 1996 mplexities/tehnlgies in system design. T meet these bjetives standardizatin must be applied as far as pssible. This has t be dne in ardane with the wrld-wide prgress. ne general JESSI envirnment will be develped whih supprts varius design strategies and ntains all majr tls and servies. The base system shuld satisfy several fundamental requirements: - Ability fr integratin f tls via binding standards and pen interfaes. Prtability via standardized referene systems. - penness twards urrent and future tls, available n the market. - User-friendliness, with a generi kernel f a user interfae system and a universal data management. Cnfigurability fr varius levels f implementatin (IC, PCB, systems...), methds and areas f appliatin. The delivered envirnment shuld be a basis fr the develpment f mre speifi envirnments fr partiular appliatins. JESSI CAD systems will have t supprt users in the whle range f appliatin frm small and medium sized mpanies, whih may wrk n the speifiatin level nly, t mpanies r institutes whih make the physial layut by themselves, tuned t the latest state f the art in semindutr tehnlgy. The evaluatin and validatin f this envirnment is perfrmed within "Tls and Envrinment", " Eurprjets" and additinal system design ativities. The wrk t be dne within the area f design tls is nentrated within six prjets, eah strutured int a set f subprjets: 29