UV-LED Module Design with Maximum Power Density
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1 UV-LED Module Design with Maximum Power Density Manfred Scholdt 1, Christian Herbold 1, Marc Schneider 2, Cornelius Neumann 1 1 e 2 Institute for Data Processing and Electronics e (LTI) KIT Universität des Landes Baden-Württemberg und nationales Forschungszentrum in der Helmholtz-Gemeinschaft
2 High Power and UV-LEDs? High Power? LEDs? Wavelength in UV? Manfred Scholdt UV-LED Module Design with Maximum Power Density
3 Outline Motivation Die selection and module parameters Thermal path design Optical Measurements Summary and Outlook Manfred Scholdt UV-LED Module Design with Maximum Power Density
4 Motivation Field of UV application Paints, coatings, adhesives, printing or water treatment LED advantages over mercury discharge lamps: Prevention of IR radiation Narrow spectrum Instant-On Long life rating Reduced power requirements Manfred Scholdt UV-LED Module Design with Maximum Power Density
5 Die selection Which wavelength? gallium nitride band gap LED cluster emitting in UV range λ < 400 nm Market survey: output power sufficient for λ 365 nm Manfred Scholdt UV-LED Module Design with Maximum Power Density
6 Die selection Highest output power density Packing density : Packaged chips Nichia: ~ 2 dice/cm 2 Bare LED chips: Nichia NCSU033A Nichia NCSU034A Semileds SL-V-U40AC Semileds: ~ 44 dice/cm 2 packaged LED chips bare LED chips Manfred Scholdt UV-LED Module Design with Maximum Power Density
7 High Power UV-LED-Module Prototype LED chips: SemiLEDs SL-V-U40AC (395 nm, ma) Most compact layout: narrow rhomboid pattern 98 LED chips on 2.11 cm² Emitting area: 0.92 cm² fill factor = 44% Electrical input power: up to 188 W corresponds to 88 W/cm² thermal management! Manfred Scholdt UV-LED Module Design with Maximum Power Density
8 Thermal management Thermal simulation of the prototype Input power: 134 W* Approx. 150 C *Datasheet value: 3,3 V, 500 ma, 17% efficiency, 98 LED chips Simulation with FloTHERM Manfred Scholdt UV-LED Module Design with Maximum Power Density
9 Thermal Path Thermal model LED junction LED substrate LED bonding Bonding layer PCB Thermal grease Heat sink R th 0.4 K/W R th 8.7 K/W R th 12.1 K/W R th 17.5 K/W 1. Prototype LED junction LED substrate Ag adhesive AgPt thick film printing Al 2 O 3 ceramic conductance paste Heat sink Manfred Scholdt UV-LED Module Design with Maximum Power Density
10 Thermal Path Thermal model LED junction LED substrate LED bonding Bonding layer PCB Thermal grease Heat sink R th 0.4 K/W R th 1.3 K/W R th 12.1 K/W R th 1.4 K/W 2. Prototype LED junction LED substrate Tin solder AgPt thick film printing Al 2 O 3 ceramic Liquid metal Heat sink Manfred Scholdt UV-LED Module Design with Maximum Power Density
11 Prototype Manfred Scholdt UV-LED Module Design with Maximum Power Density
12 Prototype Manfred Scholdt UV-LED Module Design with Maximum Power Density
13 Optical Measurement 1. Prototype Ag adhesive thermal conductance paste Max radiance: 12.9 W/cm 2 Maximum temperature: 160 C Manfred Scholdt UV-LED Module Design with Maximum Power Density
14 Optical Measurement Ag adhesive liquid metal LED junction LED substrate Ag adhesive AgPt thick film printing Al 2 O 3 ceramic Liquid metal Heat sink Max radiance: 17.6 W/cm Manfred Scholdt UV-LED Module Design with Maximum Power Density
15 Optical Measurement Ag adhesive liquid metal Ag adhesive liquid metal Tin solder thermal conductance paste LED junction LED substrate Tin solder AgPt thick film printing Al 2 O 3 ceramic conductance paste Heat sink Max radiance: 17.6 W/cm 2 Max radiance: 14.9 W/cm Manfred Scholdt UV-LED Module Design with Maximum Power Density
16 Optical Measurement 2. Prototype Tin solder liquid metal Max radiance: 24.6 W/cm² Maximum temperature: 82 C Manfred Scholdt UV-LED Module Design with Maximum Power Density
17 Radiance Prototype 400 ma: 12.9 W/cm² Prototype 400 ma: ma: 24.6 W/cm² Manfred Scholdt UV-LED Module Design with Maximum Power Density
18 Optical Efficiency Prototype 250 ma: ma: 17.0 % Prototype 200 ma: ma: 27.9 % η = optical electrical output input [ W ] [ W ] Manfred Scholdt UV-LED Module Design with Maximum Power Density
19 Summary and Outlook Designed and manufactured an UV-LED-Module with: Radiance: 24.6 W/cm 600 ma electrical power density: 88 W/cm 2 Electrical input power: 188 W Efficiency: ma ma Improve efficiency by improving thermal path AlN ceramic and water cooling Manfred Scholdt UV-LED Module Design with Maximum Power Density
20 Summary Manfred Scholdt UV-LED Module Design with Maximum Power Density
21 Questions? Manfred Scholdt UV-LED Module Design with Maximum Power Density
22 Thermal resistances Material λ Thickness Area R (W/mK) (µm) (mm²) (K/W) Ag adhesive Tin solder conductance paste liquid metal Manfred Scholdt UV-LED Module Design with Maximum Power Density
23 Solid angle projection Manfred Scholdt UV-LED Module Design with Maximum Power Density
24 Thermal conductivities Thermal conductance paste: Chemtronics CW7250 Boron nitride filled paste thermal conductivity l = 1.85 W/(m K) Ag adhesive: Zalman ZM-STG1 Silver filled paste thermal conductivity l = 5 W/(m K) Liquid metal: Coollaboratory Liquid Pro Alloy from gallium, indium, rhodium, silver, zinc, tin, bismuth thermal conductivity l = 32.6 W/(m K) Manfred Scholdt UV-LED Module Design with Maximum Power Density
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