YJ-BC-270H-G01 High CRI LED

Transcription

1 YJ-BC-270H-G01 PRODUCT: HIGH CRI CHIP ON BOARD LED FEATURES: 27 mm 27 mm x 0.5 mm chip-on-board LED Φ19 mm light emission surface 120 emission angle 95 min Ra DESCRIPTION Yuji LED s BC270H series high CRI COB provides high CRI, high luminous flux solution. Providing 95 CRI (typical) at lm, this high lumen density LED can be used in a variety of applications demanding high color quality and light output. PARAMETER ELECTRICAL-OPTICAL CHARACTERISTICS (T A = 25 C) SYMBOL VALUE MIN. TYP. MAX. UNIT TOLERANCE CONDITION Forward voltage Vf V ±0.05 If = 12A Thermal resistance* Rth C /W ±0.01 If = 12A Luminous flux Color temperature Φ3200K Φ5600K CCT3200K CCT5600K lm -- If =12A K -- If =12A Color rendering index Ra ±1 If =12A TCS R9 (CRI Red) R If =12A Chromaticity coordinates (X,Y) ± Reverse current Ir μa ±0.1 Vr = 50V Viewing angle 2θ1/ Deg ±5 If = 12A *The definition of Thermal Resistance is between LED junction and COB bottom surface. Junction Temperature Tj = Tb + Power(W) x Rth, where Tb is the temperature at COB bottom surface.

2 YJ-BC-270H-G01 ABSOLUTE MAXIMUM RATING (T A = 25 C) PARAMETER SYMBOL LIMIT UNIT Power Consumption PD 500 W DC Forward Current (pulsed)* IFp ma DC Forward Current** IF ma Reverse Voltage VR 50 V Junction Temperature Tj 150 C Case Temperature*** TC 70 C Operating Temperature Topr -30 ~ +60 C Storage Temperature Tstg -30 ~ +80 C Soldering Temperature Tsol 260 ± 5 C Reflow Cycles Allowed * Pulse width 0.1ms, Duty 1/10. ** The product requires an additional heat dissipation solution at a limit current. *** Theoretical data. ORDERING INFORMATION PART NUMBER CCT CHROMATICITY BINS YJ-BC-270H-G K ± 150K F4-2, F7-2, F5-1, F8-1 YJ-BC-270H-G K ± 300K B8-2, B10-2, C3-1, C5-1 YJ-BC-270H-G01-XX CUSTOM -- CCT 5600K 3200K CHROMATICITY BINS & COORDINATES CIE 1931 COORDINATES BIN X0 Y0 X1 Y1 X2 Y2 X3 Y3 B B C C F F F F

3 YJ-BC-270H-G01 CHROMATICITY BINS & COORDINATES CIE 1931 COORDINATES F4-2 F F7-2 F B8-2 C3-1 C5-1 B

4 YJ-BC-270H-G01 MECHANICAL DIMENSION COB Top View COB Lateral View

5 Baseplate Top View YJ-BC-270H-G01 Baseplate Lateral View T C Measure Point The material of black cover plate is composite stone. All measurements are ±0.5mm unless otherwise indicated.

6 Chromaticity Shift (CIE 1931) Intensity (a.u.) Forward Current (A) Relative Luminous Output (%) ITEM DIE MATERIAL SUBSTRATE ENCAPSULANT RESIN MATERIAL MATERIALS YJ-BC-270H-G01 DESCRIPTION InGaN AlN SILICONE CHARACTERISTIC CURVES ALL CHARACTERISTIC CURVES ARE FOR REFERENCE ONLY AND NOT GUARANTEED FORWARD CURRENT VS FORWARD VOLTAGE (TA = 25 C) FORWARD CURRENT VS RELATIVE LUMINOUS OUTPUT (TA = 25 C) Forward Voltage (V) Forward Current (A) FORWARD CURRENT VS CHROMATICITY SHIFT (5600K, TA = 25 C ) TYPICAL SPATIAL DISTRIBUTION (TA = 25 C, IF = 10A) CIE Y CIE X Forward Current (A) Angle [ ]

7 Relative Emission Intensity (%) Relative Emission Intensity (%) YJ-BC-270H-G01 TYPICAL SPECTRAL DISTRIBUTION GRAPHS 3200K 120% 100% 80% 60% 40% 20% 0% Wavelength (nm) 5600K 120% 100% 80% 60% 40% 20% 0% Wavelength (nm)

8 Cautions: YJ-BC-270H-G01 1. Circuit Protection is recommended during the assembly and operation. i. MOV, TVS, current fuse, thermal fuse, capacitor, resistor are options to avoid unexpected circuit faults. 2. Storage Conditions i. Moisture Controlled environment is recommended to avoid COB damages during storage. Moisture may cause circuit damages and result in brightness reduction or failure in circuit contacts. ii. COB in moisture-proof sealed bags should be stored in ambient conditions of temperature less than 30 C and humidity less than 90%RH. iii. COB in open air should be kept in ambient conditions of temperature less than 30 C and humidity less than 60%RH. iv. COB should be restored in moisture-proof bag with moisture absorbent together. 3. Handling Light Emitting Surface (LES) i. LES is a silicone lens and should not have direct contact with sharp tools and human fingers. 4. Recommendation on Assembly with Heat Sink i. Apply thermal grease over the heatsink contact surface to seal the voids and roughness preexisting on the contact surface. ii. Attach COB onto heatsink contact surface with thermal grease in between. Thermal grease thickness is suggested less than 25.4μm (1 mil) iii. Apply sufficient pressure to secure the COB, and ensure (a) full contact between COB and heatsink, (b) no voids within thermal grease, (c) minimal thermal grease thickness. 5. Operating Conditions i. The wiring mode are labeled + and - to denote positive and negative, respectively. ii. The controlled temperature (TC) measurement point is located in copper prism of black cover plate. iii. TC must be controlled lower than 70 when the COB is performing. 6. YUJI is not responsible to the damages caused by the operation under the parameters exceeding the values described in the specification.

9 Optional Accessory - Radiator YJ-BC-270H-G01 MECHANICAL DIMENSION Copper Aluminum Copper Aluminum Weight = 2.1Kg All measurements are ±0.5mm unless otherwise indicated. The dimension of radiator is only for reference.

10 YJ-BC-270H-G01 PICTURE OF RADIATOR