Qualification of different materials for heat transfer in module construction
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1 Qualification of different materials for heat transfer in module construction Tobias Barvich, Conny Beskidt, Wim de Boer, Alexander Dierlamm, Dirk Heil, Stefan Maier DPG-Tagung Hamburg, 02. März 2016, T 75.6 Institut für Experimentelle Kernphysik KIT University of the State of Baden-Wuerttemberg and National Research Center of the Helmholtz Association
2 CMS Requirements for HL-LHC Tracker Trigger capability Modules with two sensors sharing a common hybrid allows for signal correlations Higher granularity pixel sensors in inner tracker, Pixel-Strip (PS) modules in inner tracker, Strip-Strip (2S) modules in outer tracker S and 7000 PS modules with a total power of kw How to transfer kw from the modules to the CO 2 cooling (-30 C)? 2
3 Heat conducting materials Viehhauser, 2015 JINST 10 P09001 Carbon fiber (CF) in epoxy matrix (strong, medium heat conductivity Synthetic graphite (SG), double sided adhesive We tried combination: CF sandwich with SG tape to glue hybrids and sensors 3 3
4 Synthetic graphite (SG) Produced simply by sintering polyimide tape above 3000 C (plasma ovens) carbon changes into liquid crystal phase and forms highly conductive graphene layers in x,y directions Graphite covered with adhesive layers on both sides, so components can be directly glued to cooling structure with SG tape Typical thickness 25 or 40 μm graphite with 12 μm adhesive layers Adhesive layers withstand HV of sensor Widely used for cooling in electronics (mobile phones, ) so cheap and many manufacturers (providing precut shapes) 4
5 A module study Support from CF foam sandwich: unidirectional (UD) carbon fiber (0 /90 -layers each side) with Airex R82.60 foam in between Synthetic graphite tape (SGT) folded around support Module construction by simply pressing the parts on the adhesive glue layer (automatization possible) 5
6 PS module Top Bottom Baseplate from synthetic graphite with cooling pipe glued to it Pixel sensor and MPAs at bottom generates 3W, so needs to be directly glued to cooling tube 6
7 Thermal conductivity measurement Problem to measure heat conductivity in thin layer: how much heat goes through the layer? Basic idea: conduct heat via known conductor between heat source, sample and heat sink and determine heat flow from temperature drop in the known conductor. Heat load Sample P = λ CF A ΔT d Styrodur dt dx P ΔT T2 T4 T6 T8 T1 T3 T5 T7 Aluminium Heat sink 7
8 Results CF SGT Mitsubishi* 0 Mits. 0 /90 /0 Granoc** 0 DSN5040 λ x (W/mK) λ y (W/mK) ~ λ z (W/mK) ~1.6 ~ d (μm) 78 ~ ρ (g/cm³) The heat conductivity of SG is in both longitudinal directions more than twice and in transversal direction more than ten times as good as CF *K13D2U **YS-90: E9026A-05S 8
9 Thermal dummy PS module Support Hot press process (4bar, 120 C, 2h) 0 /90 / Airex /90 /0 Dummy module temperature sensors heating resistors (thin PCB with copper on both sides and top shaped as resistor) water cooling (23 C) 9
10 Dummy PS module ΔT measurements Opto link: 800mW Strip sensor: 363 mw MPA/Pixel sensor: 3363 mw 7.6 C 7.6 C 8.4 C 7.6 C 8.0 C 9.7 C 7.7 C 7.3 C 2 x SSA: 500mW DCDC: 2000mW 2 x CIC: 400mW 10
11 Dummy PS module ΔT simulation top bottom Coolant: 23 C top sensor bottom sensor 11
12 Conclusion SG tape interesting material for future module construction Sticks well to metal and CF by pressure sensitive adhesives SG tape allows for easy module construction (no curing time) and excellent thermal performance Proven to work for dummy prototypes 12
13 Backup 13
14 Calculation λ Rohacell P = ΔT = ΔT R R b +R c dt P = λ Al A Al dx R b = R R R CF R R = 1500 K/W λ CF = d R CF A = d R CF b h R c was determined with an aluminium-measurement as 3,3 K/W Problems Heat transfer trough the isolation unable to measure big thermal resistances No ideal setup, a vacuum tank instead of styrodur would be better 14
15 Thermal dummy module cooling setup / 2S Planned (CO 2 ) 3mm Substitute 3mm 15
16 Thermal 2S dummy module - ΔT measurement 1.7 C 4.2 C 3.7 C up 3.2 C down 3.5 C 1.5 C 2.5 C 5.3 C 16
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