Flexprint Design Studies for the Mu3e Experiment
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1 Flexprint Design Studies for the Mu3e Experiment Jens Kröger on behalf of the Mu3e collaboration DPG Frühjahrstagung Münster 2017 March 28, 2017 Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
2 The Mu3e Experiment - Detector Concept µ + are stopped decay at rest low momentum electrons p e 53 MeV /c 1 T magnetic field Recurl pixel layers 36 cm Scintillator tiles Inner pixel layers μ Beam Target Outer pixel layers Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
3 The Mu3e Experiment - Detector Concept low momentum electrons p e 53 MeV /c multiple Coulomb scattering dominates momentum resolution x Θ rms X 0 tracking in scattering dominated regime consequence: minimize material budget Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
4 Flexprints for the Mu3e Detector Challenge: minimize material budget Solution: thinned pixel chips and flexprints dielectric layers: polyimide film (Kapton) electric layers: copper or aluminium thinned wafer flexprint prototype Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
5 Flexprints for the Mu3e Detector desired material budget: x/x 0 0.1% per layer x/x 0 pixel chip (50 µm) 0.05 % flexprint 0.05 % support + glue (35 µm) 0.01 % per layer 0.11 % Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
6 Flexprints for the Mu3e Detector desired material budget: x/x 0 0.1% per layer x/x 0 pixel chip (50 µm) 0.05 % flexprint 0.05 % support + glue (35 µm) 0.01 % per layer 0.11 % Experiment x/x 0 per layer ATLAS IBL [1] 1.9 % CMS (upgrade) [2] 1.1 % ALICE (upgrade) [3] 0.3 % STAR [4] 0.4 % BELLE II IBL [5] 0.2 % Mu3e 0.1 % Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
7 Flexprints for the Mu3e Experiment Aluminium vs. Copper conductivity radiation length Cu S m cm Al S m cm from wikipedia [6] from wikipedia [7] Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
![5 higher 6 longer from wikipedia [6] Aluminium saves us a factor of](/docs-images/75/72712421/images/8-1.jpg "4 in material!")
8 Flexprints for the Mu3e Experiment Aluminium vs. Copper conductivity radiation length Cu Al 1.5 higher 6 longer from wikipedia [6] Aluminium saves us a factor of 4 in material! from wikipedia [7] Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
9 The Mu3e Experiment - Flexprint Requirements fast data transmission (1.25 Gb/s LVDS) power supply and slow control power 400 mw/cm 2 high voltage O( 100 V) clock, reset, configuration signals Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
10 Flexprint Prototypes - First Steps In-house production with laser platform First flexprint: cm 2 25 µm Kapton + 25 µm Al + glue trace width 120 µm, trace separation 120 µm different lengths up to 1 m Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
11 Flexprint Prototypes - First Steps In-house production with laser platform First flexprint: cm 2 25 µm Kapton + 25 µm Al + glue trace width 120 µm, trace separation 120 µm different lengths up to 1 m Eye diagram at 800 Mb/s, length: 10 cm Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
12 Flexprint Prototypes - First Steps In-house production with laser platform First flexprint: cm 2 25 µm Kapton + 25 µm Al + glue trace width 120 µm, trace separation 120 µm different lengths up to 1 m Problem: structures not small enough! Eye diagram at 800 Mb/s, length: 10 cm Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
13 First LTU Flexprint Prototype manufactured by LTU smallest structure sizes: 63 µm sufficiently small 3 dummy chips glued on flexprint only mechanical test Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
14 Flexprint Study for Outer Layers Feasibility study (Bachelor Thesis by Lars Noehte, 2016 [8]) 9 pixel chips over 18 cm min. number of signal traces power distribution critical size: cm 2 Next step: Design test structure with all critical characteristics Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
15 Flexprint Prototypes - Test Structure Design containing all crucial characteristics for final design top layer bottom layer Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
16 Flexprint Prototypes - Test Structure Time Domain Reflectometry (TDR) measure impedance via reflection of input pulse essential for fast data transmission: Z 0 = 50 Ω, Z diff = 100 Ω Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
17 Flexprint Prototypes - Test Structure Time Domain Reflectometry (TDR) measure impedance via reflection of input pulse essential for fast data transmission: Z 0 = 50 Ω, Z diff = 100 Ω Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
18 Flexprint Prototype - Test Structure Time Domain Reflectometry (TDR) Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
19 Flexprint Prototypes - Test Structure Data Transmission Studies eye diagram analysis bit error rate test transmit pseudo random bit stream BER = # error bits # transmitted bits Eye diagram at 1.25 Gb/s Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
20 Flexprint Prototypes - Test Structure Bit Error Rate Test data rate [Gb/s] line BER upper limit at 95% CL 1.25 Gb/s all Gb/s all Gb/s all short cm fail 4.0 Gb/s all fail Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
21 Flexprint Prototype - Test Structure Power Planes manufacturer: Al thickness 14 µm 1 l R = R 0 + ρ Al t w thickness from resistance measurement: t = 12.3 ± 0.3 µm no significant deviations between flexprints Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
22 Flexprint Prototypes - Summary and Next Steps Summary Next Steps Mu3e: search for clfv improve trace parameters ultra-low material detector operate one pixel chip on a flexprint flexprints for readout and power supply of pixel tracker very promissing operate multiple pixel chips on a flexprint bit error rate tests and power tests Jens Kro ger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
23 References [1] ATL-INDET-PROC [2] CERN-LHCC , CMS-TDR-11 [3] arxiv: v1 [4] talk by G. Contin at PIXEL 2016 [5] talk by C. Koffmane at PIXEL 2016 [6] NatCopper.jpg [7] Aluminium-4.jpg [8] L. Noehte, Flexprint design and characterization for the Mu3e experiment, Bachelor thesis, Heidelberg University, 2016, Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 18
24 Backup Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
25 The Mu3e Experiment - Motivation search for lepton-flavour violating decay µ + e + e e + sensitivity: 1 in decays νsm branching ratio signal would be clear sign for BSM physics SM process SUSY process tree-level LFV process Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
26 The Mu3e Experiment - Signal and Backgrounds signal combinatorial background internal conversion background Detector Requirements: very high vertex resolution excellent momentum reconstruction Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
27 The Mu3e Experiment - Signal and Background Topologies signal commom vertex coincident (in time) Σ p = 0 ΣE = m µ combinatorial background no commom vertex not coincident (in time) Σ p = 0 ΣE = m µ internal conversion background commom vertex coincident (in time) Σ p 0 ΣE m µ Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
28 History of LVF Experiments Updated from W.J. Marciano et al., Ann.Rev.Nucl.Part.Sci. 58, 315 (2008) Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
29 E miss Resolution Requirement for Mu3e R.M. Djilkibaev and R.V. Konoplich, Rphzs.Rev., D , 2009 Jens Kröger (Uni Heidelberg) Flexprint Designs for Mu3e March 28, / 6
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