Silicon tracking mechanics for CLIC
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1 October 13, 2016 LCUK Silicon Meeting Silicon tracking mechanics for CLIC F. Duarte Ramos on behalf of the CLICdp collaboration
2 Vertex detector ~25 25 μm 2 pixel size (~2 Giga pixels) silicon surface: 0.84 m 2 ; Single point resolution of ~ 3 µm; Radiation level <10 11 n eq cm 2 year 1 (10 4 times lower than LHC): Room temperature operation; 0.2% X 0 material per layer (including 0.11% for silicon): Very thin materials/sensors ; Air (dry) cooling strategy (50 mw/cm 2 ; T operation <40 o C); Low power design, power pulsing; 204 mm 2
3 Tracker Silicon short strips (cell length 1 10 mm) silicon surface: ~90 m 2 ; Single point resolution of ~ 7 µm; Room temperature operation; Inner & Outer Tracker subsystems; ~1 2% X 0 material per layer: Thin materials/sensors; Low power design, power pulsing; 1500 mm ECal OTD1 OTD2 OTD3 OTD4 ECal ITD1 ITD2 ITD3 ITD4 ITD5 ITD6 ITD mm OTB3 OTB2 OTB1 ITB3 ITB2 ITB1 VTX 3
4 Vertex detector
5 Lightweight support structures Development of support structures that fulfil the radiation length req. of ~0.05% X 0 (1.8x26x280 mm 3 ); 2 designs currently being pursued (full sandwich & cross bracing); Using thin prepregs and glue films from NTPT (30 gm/m 2 ). Stave label # CERN #5 CD #7 CD #8 NTPT #5 Material M55J + Rohacell 51 T800 [0 /90 /0 ] + Rohacell 51 T800 [0 /90 /0 ] + Nomex HC M55JB [0 ] + Rohacell 51 Flex. stiff. (Span=180mm) 2.23 N/mm 2.12 N/mm 2.17 N/mm Flex. stiff. (Span=260mm) N/mm N/mm 1.22 N/mm Mass (280mm long) 1.76g 3.17 g 3.45 g 2.07 g X/X % % % % Manuf. difficulty 5
6 Stave support manufacturing at CERN Raw CF prepreg & core Application of adhesive film Application of raw CF prepreg Aluminium support plate x1 Finished staves Oven Vacuum bagging Non stick film 6
7 Thermal studies 1:1 scale mock up Cold air IN Warm air OUT 7
8 Thermal studies Temperature vs. Power (for 17 l/s) Temperature distribution along 50 mw/cm 2 : ΔT L1 15 o C; ΔT L2 14 o C; ΔT L3 10 o C Layer 1 Flow R4 R3 R2 R1 L1 L2 L3 Layer 2 Layer 3 8
9 Thermal studies ongoing work Double sided stave for thermal tests; Realistic materials (Si, kapton flex, CFRP support structure, adhesive layers). Si dummy Layers Kapton flex 3M 9703 conductive tape (50 µm) Silicon dummy module (100 µm) 3M 467MP adhesive tape (50 µm) Support structure 9
10 Vibration studies Outlet Fan Inlet Adjustable angle stave support Adjustable channel height PSD (simply supported) At 5m/s, the out of plane vibrations are below 2.5 µm ( m/s) Amplitude (RMS) Simply supported f n = 119 Hz Clamped f n = 254 Hz 119 Hz
11 Tracker
12 Tracker inner barrel CLIC ALICE ITS Upgrade 965 mm 1410 mm Similar dimensions and requirements as the ALICE ITS OB upgrade: Total radiation length ~1% X 0 (per layer); Room temperature operation. C. Gargiulo et. al. 12
13 Tracker outer barrel 2500 mm Mass=926 gm 2900 mm ECal ECal X/X % per layer 13/10/2016 Silicon tracking mechanics for CLIC 13
14 Tracker OB CFRP nodes 2 node geometries; Wall thickness 1 mm; Tenax IMS 65 plain weave prepreg; Node lay up [0F/±45F] s ; Inner radius Outer radius 14
15 Tracker OB Assembly Flat trusses 3D space frame 15
16 Tracker inner disks X/X % 0.37% per layer 16
17 Summary A minimal material budget per layer is required for the CLIC tracking system 0.2% X 0 (vertex) / 1 2% X 0 (tracker): Lightweight support structures; Air cooling for the vertex detector; Engineering work has so far been focused on the most challenging problems with prototypes and FEA/CFD calculations: Air cooling feasibility (thermal/vibrations); Vertex detector support structures; Tracker support structures; 17
18 With contributions from: M A Bermúdez, F. Boyer, P. Klempt, W. Klempt, F X Nuiry, K. Spindelman, S. Sroka Thank you
19 Spare slides
20 Outer barrel support structure Mass of inner/outer radius modules 60/92 kg; Tube outer diameter/thickness 10/0.5 mm; Structure mass 16.1 kg; Fibres Toray M55J. Sag 67 µm Natural frequency 16 Hz 20
21 Assembly tooling and procedure Flat trusses Araldite 2020 joint 21
22 Assembly tooling and procedure 3D space frame Scotch Weld DP490 joint 22
23 Total deviation: Mean: 274 µm σ: 161 µm Metrology Photogrammetry (EN/ACE SU) R φ deviation of the mating nodes: Mean: 280 µm σ: 128 µm *Method accuracy: ~80 µm 23
24 16 9 Load test Forces on members [N] for m=48kg Load capacity >1000N *Method accuracy: ~80 µm 24
25 Tracker inner disks A: x,y,z = 0 B: y,z = 0 C: z = 0 13/10/2016 Silicon tracking mechanics for CLIC 25
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