Thermal Interface Material Performance Measurement
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1 Thermal Interface Material Performance Measurement Long Win Science & Technology Co., Ltd /07/16
2 Contents 1. Introduction Heat Transfer 2. Thermal Conductivity Measurement 3. Contact Resistance 4. Thermal Resistance (Impedance) Measurement
3 Contents 1. Introduction Heat Transfer 2. Thermal Conductivity Measurement 3. Contact Resistance 4. Thermal Resistance (Impedance) Measurement
4
5 LED Thermal Flow Path R Ja = TJ- T P a
6 Heat Transfer Mechanism A. Conduction & Q conduction = ka T X B. Convection & Q convection = ha( Ts Ta) C. Radiation & Q radiation = εσa( Ts 4 Ta 4 ) = ha( Ts Ta)
7 h (Heat Transfer Coefficient) Radiation Type Nature convection Force convection Liquid force convection Evaporate and condense h [w/m 2 * ] 2~25 25~250 50~20, ~100,000 Order
8 Thermal Resistance and Ohm s Law Electrical Resistance Thermal Resistance Voltage A Temperature A Current Power Dissipation Voltage B Temperature B R = Voltage A - Voltage B Current θ AB = Temp A - Temp B Power Dissipation Units: Ohm Units: C/Watt
9 Thermal resistance analysis θ j/bk θ bk/hp1 θ hp1/hp2 θ hp2/fin θ fin/amb TIM, Contact Bounding, Pipe Pipe Bounding, Fin 0.23 ~ Fan Tamb Tfin Thp2 Heat Pipe Thp1 Sink TIM Tblock Tjunction
10 Application Components: A. Cooler B. Pad / Grease C. Power supply D. Interface card E. LED thermal module System: A. D/T PC B. N/B PC C. Servo system D. Rack system E. Projector
11 Application
12 Application
13 Thermal Conduction a. Solid state structure, such as metal heat sink. b. Fluid state structure, such as: (a) heat pipe structure (b) compressor coolant structure c. Liquid state structure, such as water cooling structure.
14 Fourier Law Q = K A Q:transferred heat T h L K:thermal conduction coefficient of solid state zone of substance A:effective heat transfer area of solid state zone Th:temperature in high-temperature solid state zone Tc:temperature in low-temperature solid state zone L:sampling distance between high and low temperature solid state zones T c Not Easy for DT & Thickness Measurement
15 Follow ASTM 5470D Standard P FORCE Insulator Guard Heater H T g H Insulator Heater T m H LVDT measure Thickness T1 Upper Meter Bar T2 Specimen T3 Lower Meter Bar T4 T5 Reference Calorimeter T6 Cooling Unit Insulator T A T D ASTM (American Society for Testing and Materials)
16 Longwin TIM Tester Scheme Cylinder with programmable loading Ball joint (Gimble) to make sure contact surface pressure load uniform Water cooling or air cooling module T i1 or Ta Q out T L3 Thermal isolated material T L2 LVDT measure Thickness Td Tc T L1 Tu Specimen pad/grease or grease Thermal isolated material Q in h Heat Source Tm Tl Q in = I Upper and lower block with alignment fixture
17 Longwin TIM Tester- 9091IR
18 Longwin TIM Tester- 9091IR Bond Line Thickness Effect Pressure Effect
19 Longwin TIM Tester- 9091IR Thermal Cycle Test for Reliability
20 Contents 1. Introduction Heat Transfer 2. Thermal Conductivity Measurement 3. Contact Resistance 4. Thermal Resistance (Impedance) Measurement
21 K (Thermal Conductivity)Measurement 1. Laser flash (Transient) 2. Hot disk (Transient) 3. Hot wire (Transient) 4. Heat flux (Steady)
22 K Measurement Transient Steady state α = k ρ C p m s 2 Q& = k T A X α ρ C p = Thermal diffusivity = Density = Heat capacity m s 2 = m s m = Velocity Length α = 1 C V L
23 Laser Flash
24 Hot Disk Thermal Insulation Hot Disk (Transient Plane Source Method, TPS)
25 Heat Flux ASTM 5470D P FORCE Insulator Guard Heater H T g H Insulator Heater T m H LVDT measure Thickness T1 Upper Meter Bar T2 Specimen T3 Lower Meter Bar T4 T5 Reference Calorimeter T6 T A T D Cooling Unit Insulator
26 Follow ASTM-5470 D LW 9021D
27 Longwin TIM Tester- 9091IR
28 Heat Flux ASTM E1530 Tg COLD FACE HEATER d Tu Heat flow (Q) Tl Th HOT FACE HEATER Copper surface plate Guard heater Test sample Heat flow transducer Copper surface plate At thermal equilibrium : Rs = N (Tl-Tu) / Q R0 Where Rs = sample thermal resistance N = proportionality constant Tl = lower surface temperature Tu = upper surface temperature Q = heat flux transducer output R0 = constant thermal resistance
29 Bar Material K Measurement cooling T T 1 2 = T T 5 6 = 3T T 2 3 T 6 T T 2 3 = T 34 = T T 4 5 T 5 T 4 thermal Isolate Material T 3 T 2 T 1 Fourier Law q = KA T X Heat Flux Heat Source
30 Bar Material K Measurement Fourier Law with ASTM-5470 D Thermal Guard concept, For steady state can be got k value.
31 Table of Thermal Conductivity Diamond Silver 429 Copper 386 Gold 317 Aluminium 237 Brass 120 Platinum 71.6 Iron 80.2 Lead 35.3 Quartz (273K) Glass 1.35 Wood 0.04 Styrofoam Wool 0.04 Silica aerogel Air (100 kpa) Water W Ice (273K) Mercury M C (@ 298K)
32 Contents 1. Introduction Heat Transfer 2. Thermal Conductivity Measurement 3. Contact Resistance 4. Thermal Resistance (Impedance) Measurement
33 Contact Resistance Thermal Contact Resistance = Func.( roughness, pressure, temperature, material, TIM ) Thermal Contact Resistance = Rc_upper + Rc_lower
34 Surface Roughness Measurement
35 Surface Roughness Measurement
36 Surface Roughness Measurement
37 Table of Contact Resistance Different Metal Contact Resistance Surface Roughnes s μm Temperature Pressur e MPa Impedance *cm 2 /w SS-Al Polish SS-Al Polish SS-Al Polish SS-Al Polish Al-Cu Polish Al-Cu Polish Al-Cu Polish Al-Cu Polish ~ (From Holman, Ref.12, and Kreith and Bohn, Ref.16)
38 Table of Contact Resistance Same Metal Contact Resistance Surface Roughness μm Temperature Pressure MPa Impedance *cm 2 /w 304 Stainless Steel Polish ~ Stainless Steel Polish ~ ~ Aluminium Polish ~ Copper Polish ~ Copper Polish ~ Copper (vacuum) Polish ~ (From Holman, Ref.12, and Kreith and Bohn, Ref.16)
39 Contact Resistance v.s. Pressure
40 Contact Resistance Measurement
41 Contents 1. Introduction Heat Transfer 2. Thermal Conductivity Measurement 3. Contact Resistance 4. Thermal Resistance (Impedance) Measurement
42 Definition of Thermal Resistance T T Q 1 2 I = T1 A Area = A L Q = K A T h L T T R = 1 2 Q T c T2 T T = Q 1 2 R T T I = 1 2 Q A
43 CPU Cooler Thermal Resistance Ta Fan Cooler Module Tc Tu Air flow rate & flow pattern Q out Meter Bar Q ine = I V Q in Heat Source Tm Tl thermal isolated material Q = R = K A Tc-Ta Q out T h L T c Heat loss
44 Heat Flux Power 1.Meter Bar Size: a mm b mm c mm d. User define 2. Power Supply: a. 180W b. 300W
45 Test Application NB Cooler Module Test DT Cooler Module Test
46 TIM Thermal Resistance P PAD / Grease water cooling or air cooling T i1 Q outh T L3 thermal isolated material specimen /pad or grease thermal isolated material Q ine = I V Td Tc Q inh Heat Source T L2 T L1 Tu Tm T T T Q R c d = = = = T T T l KA X T c u L1 T l X T + T Q d L1 X 3 1 Tu 2 Tu T L2 heat loss
47 TIM Test Section-9091IR
48 LED Thermal Resistance R Ja = TJ- T P a
49 LED Junction Temperature Measurement
50 LED Graphite Heat Spreader Copper Base Mount LED Temperature Sensor Graphite Sheet
51 Thermal Lab Apparatus TIM Research Equipments Liquid state A. Interface material Solid state Phase variation Combined Material LW-9021D LW-9091IR Surface Roughness 3-dimension microscope B. Interface relationship Load Pressure (Load Cell) shape-changing material Non-shape-changing material
52 Thank You
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