EVERLIGHT ELECTRONICS CO.,LTD.

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1 Technical Datasheet EVERLIGHT ELECTRONICS CO.,LTD. XcelLed 1W emitters XcelLED emitters are one of the highest flux LEDs in the world by Everlight to give you total design freedom and unmatched brightness. The emitters are designed to satisfy more and more Solid-State lighting High Power LED applications. For high volume applications, customized XcelLED power light source designs are available upon request to meet your specific demand and also can be purchased in reels for high volume assembly. The XcelLED emitters included all EHP-A08, EHP-AX08, EHP-AY08, EHP-AZ08 etc. series, including power consumption under 1W up to 5W series. Features Various colors Small package with high efficiency Low voltage operated ESD Protection Long operating life Product itself will remain within RoHS compliant Typical Applications General lighting LCD Backlights Contour lighting Decoration lighting Exterior and interior automotive lighting version Materials Items Housing body Encapsulating Resin Lens Electrodes Die attach Description Heat resistant polymer Silicone resin Polymer / Silicone Ag plating copper alloy Silver paste Everlight Electronics Co., Ltd. Rev. Page: 1/25

2 Package Outlines Lambertian I / Lambertian II ( L / LS type ) Notes: 1. All dimensions are in mm. 2. Tolerances unless dimensions ±5mm. 3. Drawings are not to scale. 4. It is strongly recommended that the temperature of heat slug be not higher than 55. (more details can be referred to page 17 or Everlight Design Guide) 5. It is important that the slug can t contact aluminum surface, It is strongly recommended that there should coat a uniform electrically isolated heat dissipation film on the aluminum surface. 6. Lambertian II (LS type) is identical in dimension with Lambertian I (L type) but suitable for SMT process. 7. Some devices also show anode in heat slug at bottom. The part numbers of these devices represents A, S, C, or CE in chip structure, such as EHP-AX08L/DT01S-P01 or EHP-AX08LS/LM01CE-P01. Consult Everlight representative for further assistance. Everlight Electronics Co., Ltd. Rev. Page: 2/25

3 Lambertian III (EL type) Notes: 1. All dimensions are in mm. 2. Tolerances unless dimensions ±5mm. 3. Drawings are not to scale. 4. It is strongly recommended that the temperature of heat slug be not higher than 55. (more details can be referred to page 17 or Everlight Design Guide) 5. It is important that the slug can t contact aluminum surface, It is strongly recommended that there should coat a uniform electrically isolated heat dissipation film on the aluminum surface. 6. Lambertian III (EL type) has lower highness and suitable for SMT process. 7. Some devices also show anode in heat slug at bottom. The part numbers of these devices represents A, S, C, or CE in chip structure, such as EHP-AX08EL/DT01S-P01 or EHP-AX08EL/LM01CE-P01. Consult Everlight representative for further assistance. Everlight Electronics Co., Ltd. Rev. Page: 3/25

4 Batwing ( B type ) Notes: 1. All dimensions are in mm. 2. Tolerances unless dimensions ±5mm. 3. Drawings are not to scale. 4. It is strongly recommended that the temperature of heat slug be not higher than 55. (more details can be referred to page 17 or Everlight Design Guide) 5. It is important that the slug can t contact aluminum surface, It is strongly recommended that there should coat a uniform electrically isolated heat dissipation film on the aluminum surface. 6. Some devices also show anode in heat slug at bottom. The part numbers of these devices represents A, S, C, or CE in chip structure, such as EHP-AX08S/DT01S-P01 or EHP-AX08S/LM01CE-P01. Consult Everlight representative for further assistance. Everlight Electronics Co., Ltd. Rev. Page: 4/25

5 Side Emitting ( S type ) Notes: 1. All dimensions are in mm. 2. Tolerances unless dimensions ±5mm. 3. Drawings are not to scale. 4. It is strongly recommended that the temperature of heat slug be not higher than 55. (more details can be referred to page 17 or Everlight Design Guide) 5. It is important that the slug can t contact aluminum surface, It is strongly recommended that there should coat a uniform electrically isolated heat dissipation film on the aluminum surface. 6. Some devices also show anode in heat slug at bottom. The part numbers of these devices represents A, S, C, or CE in chip structure, such as EHP-AX08S/DT01S-P01 or EHP-AX08S/LM01CE-P01. Consult Everlight representative for further assistance. Everlight Electronics Co., Ltd. Rev. Page: 5/25

6 Focusing Notes: 1. All dimensions are in mm. 2. Tolerances unless dimensions ±5mm. 3. Drawings are not to scale. 4. It is strongly recommended that the temperature of heat slug be not higher than 55. (more details can be referred to page 17 or Everlight Design Guide) 5. It is important that the slug can t contact aluminum surface, It is strongly recommended that there should coat a uniform electrically isolated heat dissipation film on the aluminum surface. 6. Some devices also show anode in heat slug at bottom. The part numbers of these devices represents A, S, C, or CE in chip structure, such as EHP-AX08F/UY01A-P01 or EHP-AX08F//DT01CE-P01. Consult Everlight representative for further assistance. Everlight Electronics Co., Ltd. Rev. Page: 6/25

7 Absolute Maximum Ratings EVERLIGHT ELECTRONICS CO.,LTD. Rating Parameter Symbol White/Warm Red/ Unit white/blue/green Yellow(Amber) DC Forward Current (1) I F 350 ma Pulse Forward Current I F ma Operating Temperature T opr -40 ~ +100 ºC Storage Temperature T stg -40 ~ +100 ºC Junction temperature T j 125 ºC ESD Sensitivity (2) V B 2000 V Manual Soldering Time at 260 (Max) T sol 5 s Notes: 1. Proper current decreasing must be observed to maintain junction temperature below the maximum limits. For more information, consult the Everlight Design Guide, available upon request. 2. LEDs are not designed to be driven in reverse bias. Luminous Flux (2) Bin at I F =350mA Lens Item Color Part Name Min Lambertian I (L) Flux Typ. Max EHP-Ax08t/DT01-P01 (3) White (1) EHP-Ax08t/DT01K-P EHP-Ax08t/DT01CE-P Units Lambertian II (LS) Lambertian III (EL) Batwing (B) Focusing (F) Side Emitting (S) Notes: Warm White EHP-Ax08t/LM01-P Red EHP-Ax08t/SUR01-P Red-Orange EHP-Ax08t/US001-P Amber EHP-Ax08t/UY01-P Green EHP-Ax08t/SUG01-P Blue EHP-Ax08t/UB01-P EHP-Ax08S/DT01-P lm White EHP-Ax08S/DT01K-P EHP-Ax08S/DT01CE-P Warm White EHP-Ax08S/LM01-P Red EHP-Ax08S/SUR Red-Orange EHP-Ax08S/USO Amber EHP-Ax08S/UY01-P Green EHP-Ax08S/SUG01-P Blue EHP-Ax08S/UB01-P White has alternative UT series, which is extra bright device, performs about 10% higher luminous efficacy than DT series but less color uniformity. 2. Flux is measured with an accuracy of ± 10%. 3. x represents different kinds of lead frame types. t represents different kinds of lens types. Everlight Electronics Co., Ltd. Rev. Page: 7/25

8 Forward Voltage (4) Characteristics at I F =350mA Lens Item Color Part Name Min. Lambertian I (L) Lambertian II (LS) Lambertian III (EL) Batwing (B) Side Emitting (S) Focusing (F) White V F Typ. Max. EHP- Ax08t/DT01-P EHP- Ax08t/DT01K-P EHP-Ax08t/DT01CE-P Warm White EHP-Ax08t/LM01-P Red EHP-Ax08t/SUR01-P Red-Orange EHP-Ax08t/USO01-P Amber EHP-Ax08t/UY01-P Green EHP-Ax08t/SUG01-P Blue EHP-Ax08t/UB01-P Units V Dominant Wavelength (5) or Peak wavelength or Color Temperature Characteristics at IF=350mA Lens Item Lambertian I (L) Lambertian II (LS) Lambertian III (EL) Batwing (B) Side Emitting (S) Focusing (F) Color Part Name λd/λp/cct Min. Typ. Max. White EHP-Ax08t/DT01-P K Warm White EHP-Ax08t/LM01-P K Units Red EHP-Ax08t/SUR01-P nm Red-Orange EHP-Ax08t/USO01-P nm Amber EHP-Ax08t/UY01-P nm Green EHP-Ax08t/SUG01-P nm Blue EHP-Ax08t/UB01-P nm Thermal Resistance Junction to Case Characteristics at I F =350mA V F / T R θj-b Lens Item Color Part Name Typ. Units Typ. Units EHP-Ax08t/DT01-P01-2 mv/ 15 /W White EHP-Ax08t/DT01CE-P01-2 mv/ 13 /W Lambertian I (L) Lambertian II (LS) Lambertian III (EL) Batwing (B) Side Emitting (S) Focusing (F) Warm White EHP-Ax08t/LM01-P01-2 mv/ 15 /W Red EHP-Ax08t/SUR01-P01-2 mv/ 17 /W Red-Orange EHP-Ax08t/USO01-P01-2 mv/ 17 /W Amber EHP-Ax08t/UY01-P01-2 mv/ 17 /W Green EHP-Ax08t/SUG01-P01-2 mv/ 15 /W Blue EHP-Ax08t/UB01-P01-2 mv/ 15 /W Everlight Electronics Co., Ltd. Rev. Page: 8/25

9 Emission Angle Characteristics at IF=350mA Part Name Color Lambertian I (L) / II (LS) 2θ 1/2 (Typ.) (6) θ peak (Typ.) (7) III (EL) Batwing (B) Focusing (F) Side Emitting (S) EHP-Ax08t/UT01-P ±85 White EHP-Ax08t/DT01-P ±85 EHP-Ax08t/LM01-P01 Warm White ±85 EHP-Ax08t/SUR01-P01 Red ±85 EHP-Ax08t/USO01-P01 Red- Orange ±85 EHP-Ax08t/UY01-P01 Amber ±85 EHP-Ax08t/SUG01-P01 Green ±80 EHP-Ax08t/UB01-P01 Blue ±80 Notes: 4. Forward Voltage is measured with an accuracy of ± 0.1V 5. Wavelength is measured with an accuracy of ± 1 nm 6. 2θ 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 7. θ peak is the off axis angle from lamp centerline where the luminous intensity reaches the peak value. All white warm white true green and blue emitters are built with InGaN. All red, amber, and yellow emitters are built with AlGaInP. Unit Degrees Everlight Electronics Co., Ltd. Rev. Page: 9/25

10 Electrical & Optical Curves-Spectrum White Warm White Relative Spectral Power Distribution Wavelength (nm) Blue Cyan Green Amber Red- Orange Red Relative Spectral Power Distribution Wavelength (nm) Everlight Electronics Co., Ltd. Rev. Page: 10/25

11 Typical Optical and Electrical Curves Wavelength (nm) VF (V) Forward Current & Wavelength(B/G) 560 Blue (B) 540 Green (G) IF (ma) Operating Current & Forward Voltage 4.8 Blue/Cyan/Green 4.4 White/Warm White 4.0 Amber/Orange/Red IF (ma) Wavelength (nm) Relative Luminous Flux Red (R) Amber (A) Forward Current & Wavelength(R/A) IF (ma) Forward Current & Luminous Flux for all type lens Blue/Cyan/Green Amber/Orange/Red White/Warm White IF (ma) Coordination Forward Current & chromaticity coordinate CIE - Y CIE - X CCT (K) Forward Current & CCT White IF (ma) IF (ma) Everlight Electronics Co., Ltd. Rev. Page: 11/25

12 Relative Power Output Juction Temperature & Relative Light Output for white, warm white, blue, cyan, green White photometric Cyan photometric Blue photometric Green photometric Junction Temperature, T J ( o C) Relative Power Output Juction Temperature & Relative Light Output for amber, red-orange, red Amber 160 Red-Orange Red Juction Temperature,T J ( o C) Dominant Wavelength Shift (nm) 4 Blue 3 Green Red Ambient Temperature & Dominant Wavelength Temperature ( o C) Forward Current (ma) Ambient Temperature & Operating Current Derating based on T JMAX = 125 R thj-a = 30 o C/W R thj-a = 40 o C/W R thj-a = 50 o C/W R thj-a = 60 o C/W Ambient Temperature ( o C) Everlight Electronics Co., Ltd. Rev. Page: 12/25

13 Typical Radiation Pattern for Lambertian I / II / III ( L / LS / EL type ) Relative Luminous Intensity for White Warm white L / LS EL Degree (2θ) Relative Luminous Intensity for Red Amber Yellow L / LS EL Degree (2θ) Relative Luminous Intensity for Blue Green L / LS EL Degree (2θ) Everlight Electronics Co., Ltd. Rev. Page: 13/25

14 Typical Radiation Pattern for Batwing ( B type ) Relative Luminous Intensity for White Warm white Degree (2θ) Relative Luminous Intensity for Red Amber Yellow Degree (2θ) for Blue Green Relative Luminous Intensity Degree (2θ) Everlight Electronics Co., Ltd. Rev. Page: 14/25

15 Typical Radiation Pattern for Side emitting (S type ) Relative Luminous Intensity for White Warm white Degree (2θ) Relative Luminous Intensity for Red Amber Yellow Degree (2θ) Relative Luminous Intensity for Blue Green Degree (2θ) Everlight Electronics Co., Ltd. Rev. Page: 15/25

16 Typical Radiation Pattern for Focusing (F type ) for White Warm white for Red Amber Red Orange Relative Luminous Intensity Degree (2θ) Relative Luminous Intensity Degree (2θ) Relative Luminous Intensity for Blue Green Degree (2θ) Everlight Electronics Co., Ltd. Rev. Page: 16/25

17 How to know the T J in your application? Rθ Junction-Ambient = Rθ Junction-Slug + Rθ Slug-Board + Rθ Board-Ambient (1) Take EHP-AX08L/DT01-P01, Rθ J-S = 15 /W (2) Thermal resistance of board, Rθ S-B, can be defined 1. Standard star heat sink: Rθ S-B = 2 /W 2. Other kinds of heat sinks,rθ S-B = K sub L Area, and k = k t + k ( 1 t ) sub V V I V K V :the via s thermal conductivity K I : the basic s thermal conductivity t V : the area ratio of via s (3) Rθ board ambient, between heat sink and air is mainly based on the total surrounding air. If LED is mounted on secondary heat sink design,the total thermal resistance between heat sink and ambient is defined Rθ B -A = 500 Area ( cm 2 ) Example. 1 Know your difference of Junction and Ambient temperature If end heat dissipation area is 20 cm 2, Rθ B A = 25 /W, Rθ S-B = 2 /W, T Junction-Ambient = ( ) 1 = 42 Example. 2 Know Rθ B-A your board area design T Junction = T Ambient + (Pd) (R Junction-Ambient ) where : T J = 90 (Suggested maximum junction temperature while operating) If T A = 60 and P d = 350mA * 3.5V = W Solving Rθ Junction-Ambient Rθ J-A = = 24.5 /W To obtain your Rθ B-A Rθ B-A = Rθ J-A - Rθ J-B = = 7.5 /W NOTE: It s strongly recommended to keep the junction temperature under 90 Everlight Electronics Co., Ltd. Rev. Page: 17/25

18 For Tube Package Specifications EVERLIGHT ELECTRONICS CO.,LTD. Label explanation CPN: Customer s Production Number P/N : Product Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Tube Packing Specifications 1. Tube 2. Inner Carton Inner carton will be stored in sealed plastic bag. 3. Outer Carton Packing Quantity Pcs / Per Tube Tubes / Inner Carton Inner Cartons / Outside Carton Everlight Electronics Co., Ltd. Rev. Page: 18/25

19 For Reel Package Specifications EVERLIGHT ELECTRONICS CO.,LTD. Reel Dimensions Carrier Tape Dimensions: Loaded quantity 800 PCS per reel. Note: 1. Dimensions are in millimeters 2. The tolerances unless mentioned is ±0.1mm Moisture Resistant Packaging Label Aluminum moistue-proof bag Desiccant Label Everlight Electronics Co., Ltd. Rev. Page: 19/25

20 Reliability Test Items and Results EVERLIGHT ELECTRONICS CO.,LTD. Stress Test Stress Condition Stress Duration Solderability Tsol=230, 5sec 1 times Resistance to Solder Heat / Reflow Tsol=260, 10sec, 6min 3 times Thermal Shock -40 / 110, 20 min dwell 10sec transfer 500 Cycles Temperature Cycle -40 / 110, 30 min dwell 5 min transfer 1000 Cycles High Temperature/Humidity Reverse Bias Ta=85, RH=85% 1000hours High Temperature/Humidity Operation Ta=85, RH=60%, IF=225mA 1000hours High Temperature Storage Ta= hours Low Temperature Storage Ta= hours Intermittent operational Life Ta=25, IF=1000mA 30mS on/ 2500mS off 1000hours High Temperature Operation Life #1 Ta=55, IF=350mA 1000hours High Temperature Operation Life #2 Ta=85, IF=225mA 1000hours High Temperature Operation Life #3 Ta=100, IF=150mA 1000hours Low Temperature Operation Life Ta=-40, IF=350mA 1000hours Power Temperature Cycle -40 / 85, 15 min dwell 5 min transfer, IF=225mA, 2min on/off 1000cycles ESD Human Body Model 2000V, Interval:0.5sec 3 times ESD Machine Model 200V, Interval:0.5sec 3 times *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<50% *VF: FORWARD VOLTAGE DIFFERENCE<20% Everlight Electronics Co., Ltd. Rev. Page: 20/25

21 JEDEC Moisture Sensitivity Level Floor Life Standard Accelerated Equivalent Time Time Time Condition Conditions Conditions (hours) (hours) (hours) %RH 96+2/-0 30 /60% RH /-0 60 /60% RH LEVEL FLOOR LIFE Standard SOAK REQUIREMENTS Accelerated Equivalent TIME CONDITIONS TIME(HOURS) CONDITIONS TIME(HOURS) CONDITIONS 1 Unlimited 30 / 60%RH /-0 85 / 85%RH 2 1 years 30 / 60%RH /-0 85 / 60%RH 2a 4 weeks 30 / 60%RH / 60%RH +5/-0 +1/-0 60 / 60%RH hours 30 / 60%RH / 60%RH +5/-0 +1/-0 60 / 60%RH 4 72 hours 30 / 60%RH / 60%RH +2/ /-0 60 / 60%RH 5 48 hours 30 / 60%RH / 60%RH +2/ /-0 60 / 60%RH 5a 24 hours 30 / 60%RH / 60%RH +2/ /-0 60 / 60%RH 6 Time on Label (TOL) 30 / 60%RH TOL 30 / 60%RH Note 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor s facility. Everlight Electronics Co., Ltd. Rev. Page: 21/25

22 Summary of the laser and LED safety classification: Classes Class 1 Class 1M Class 2 Class 2M Class 3R Class 3B Class 4 Note Potential hazard / meaning Eye safe for longer (intentional) exposure and for exposure when using loupes or telescopes too. Enclosed laser with high power. Due to the entire protective housing any emission is prevented. Eye safe for the un-aided eye, for longer (intentional) exposure also; possible eye injury for exposures when using loupes or telescopes. Visible laser radiation, eye safe for short exposure, even when using loupes or telescopes. Visible laser radiation, eye safe for the un-aided eye for short exposure, possible eye injury for exposures when using loupes or telescopes. Practically no eye hazard for short and unintentional exposure, but dangerous for improper use by untrained personal. Hazardous for eyes by direct beam and specular reflections. Chance for slight skin injury for beam powers near the upper limit. Hazardous for eyes by direct and diffuse reflected beam, hazardous for the skin; fire hazard. Example for maximum output power in the visible range 40 µw for blue spectral region, 400 µw for red spectral region No radiation emission, not even for any single fault like class 1, but different measurement regulation 1 mw (measurement aperture for loupes or telescopes) like class 2, but different measurement regulation 5 mw 500 mw More than 500 mw 1. The brightest XcelLed product has radiation flux less than 1mW under different measurement regulation and is classified as Class 2M. Everlight Electronics Co., Ltd. Rev. Page: 22/25

23 Precautions For Application 1. Over-current-proof Though EHP-A08 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause enormous current shift and burn out failure would happen. 2. Storage i. Do not open the moisture proof bag before the devices are ready to use. ii. Before the package is poened, LEDs should be stored at temperature less than 30 and humidity less than 90%. iii. LEDs should be used within a year. iv. After the package is opened, LEDs should be stored at temperature less than 30 and humidity less than 70%. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following the conditions: pre-curing at 60±5 for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A08 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximate 1W of thermal energy at 350mA operation. ii. iii. iv. Special thermal designs are also recommended to take in heat dissipation management, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies might be over the limit at high current driving condition and LEDs lifetime might be decreases dramatically. For further thermal management suggestions, please consult Everlight Design Guide or local representatives for assistance. Everlight Electronics Co., Ltd. Rev. Page: 23/25

24 4. Soldering Condition 4-1. Soldering pad 4-2. For Reflow process i. Only Reflowable Lambertian lens types (LS and EL), such as EHP-AX08LS/DT01-P01, and EHP-AX08EL/DT01CE-P01 etc, are suitable for SMT process. ii. Lead reflow soldering temperature profile iii. Reflow soldering should not be done more than two times. iv. In soldering process, stress on the LEDs during heating should be avoided. v. After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Rev. Page: 24/25

25 4-3. For Hot Bar process 5. Soldering Iron i. For prototype builds or small series production runs, it is possible to place and solder the LED manually. ii. Dispense thermal conductive glue or grease on heat sinks. Press LED cases to closely connect LEDs and heat sinks. Solder at terminal of leads. iii. It is recommended to hand solder the leads with a solder tip temperature of 280 C for less than 3 seconds within one time and the soldering iron capacity should be less than 25W. At least two seconds and more intervals are recommended during each soldering. iv. The LED Lens must not be touched by any soldering iron. v. The damage of LED is often occurred at improper hand solder. Everlight Electronics Co., Ltd. Rev. Page: 25/25

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