Power Schottky rectifier Main product characteristics I F(V) V RRM T j (max) V F (max) Features and Benefits Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-22FPC insulating voltage = 2V DC capacitance = 12 pf valanche capability specified Description 15 45 V 175 C.57 V Single chip Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in TO-22C, TO-22FPC, I 2 PK or D 2 PK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. K TO-22C STPS1545D I 2 PK STPS1545R K TO-22FPC STPS1545FP K NC K D 2 PK STPS1545G March 27 Rev 6 1/1 www.st.com 1
Characteristics STPS1545 1 Characteristics Table 1. bsolute Ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 45 V I F(RMS) RMS forward voltage 3 I F(V) I FSM verage forward current δ =.5 Surge non repetitive forward current TO-22C I 2 PK, D 2 PK TO-22FPC t p = 1 ms Sinusoidal T c = 155 C T c = 13 C 15 22 t I RRM Peak repetitive reverse current p = 2 µs square 1 F = 1 khz I RSM Non repetitive peak reverse current t p = 1 µs square 3 P RM Repetitive peak avalanche power t p = 1 µs T j = 25 C 6 W T stg Storage temperature range -65 to + 175 C T j Maximum operating junction temperature (1) 175 C dv/dt Critical rate of rise of reverse voltage 1 V/µs dptot 1. --------------- < 1 thermal runaway condition for a diode on its own heatsink dtj Rth ------------------------- ( j a) Table 2. Thermal resistances Symbol Parameter Value Unit R th(j-c) Junction to case TO-22C, I 2 PK, D 2 PK 1.6 TO-22FPC 4. C/W Table 3. Static electrical characteristics (per diode) Symbol Parameter Test Conditions Min. Typ. Max. Unit I R (1) V F (1) Reverse leakage current Forward voltage drop T j = 25 C 2 µ V R = V RRM T j = 125 C 11 4 m T j = 125 C I F = 15.5.57 T j = 25 C I F = 3.84 V T j = 125 C I F = 3.65.72 1. Pulse test: tp = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.42 x I F(V) +.1 I F 2 (RMS) 2/1
Characteristics Figure 1. verage forward power dissipation versus average forward current Figure 2. verage forward current versus ambient temperature (δ =.5) 12 1 8 6 P F(V) (W) δ =.5 δ =.1 δ =.2 δ =.5 δ = 1 18 16 14 12 1 8 I F(V) () R th(j-a) =15 C/W R =R th(j-a) th(j-c) TO-22C TO-22FPC 4 T 2 I F(V) () δ=tp/t tp 2 4 6 8 1 12 14 16 18 6 T 4 2 δ=tp/t tp T amb( C) 25 5 75 1 125 15 175 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature 1 P RM(t p) P RM(1µs) 1.2 P RM(t p) P RM(25 C) 1.1.8.6.1.4.1.1.1 1 t p(µs) 1 1 1.2 T ( C) j 25 5 75 1 125 15 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (TO-22C, I 2 PK D 2 PK) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) ( TO-22FPC) I M() 2 18 16 14 12 T C=75 C 1 8 T C=1 C 6 T C=125 C 4 IM 2 t t(s) δ=.5 1E-3 1E-2 1E-1 1E+ 12 1 8 6 4 2 I () M IM t δ=.5 t(s) T C=75 C T C=1 C T C=125 C 1E-3 1E-2 1E-1 1E+ 3/1
Characteristics STPS1545 Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-22C, I 2 PK D 2 PK) Figure 8. Relative variation of thermal impedance junction to case versus pulse duration ( TO-22FPC) 1. Z th(j-c) /Rth(j-c) 1. Z th(j-c) /Rth(j-c).8.8.6 δ =.5.6 δ =.5.4 δ =.2 T δ =.1.2 t p(s) Single pulse δ=tp/t tp. 1E-4 1E-3 1E-2 1E-1 1E+.4 δ =.2 T δ =.1.2 t p(s) Single pulse δ=tp/t tp. 1E-3 1E-2 1E-1 1E+ 1E+1 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 1. Junction capacitance versus reverse voltage applied (typical values) 5E+4 1E+4 I (µ) R T j=15 C T j=125 C 2 1 C(pF) F=1MHz V OSC=3mVRMS T j=25 C 1E+3 T j=1 C T j=75 C 5 1E+2 T j=5 C 1E+1 T j=25 C 2 V R(V) 1E+ 5 1 15 2 25 3 35 4 45 V R(V) 1 1 2 5 1 2 5 Figure 11. I FM() 1. Forward voltage drop versus forward current (maximum values) T j=125 C (typical values) Figure 12. 8 7 R th(j-a) ( C/W) Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, Cu=35 µm) (D 2 PK) 1. T j=125 C T j=25 C 6 5 4 1. 3 2 V FM(V).1..2.4.6.8 1. 1.2 1.4 1.6 1 S(Cu)(cm²) 5 1 15 2 25 3 35 4 4/1
Package Information 2 Package Information Epoxy meets UL94, V Cooling method: by conduction (C) Recommended torque value:.55 Nm Maximum torque value:.7 Nm Table 4. TO-22FPC dimensions Ref Millimeters Dimensions Inches H B Min. Max. Min. Max. 4.4 4.6.173.181 B 2.5 2.7.98.16 D 2.5 2.75.98.18 Dia E.45.7.18.27 F.75 1.3.39 L6 F1 1.15 1.7.45.67 L2 L7 F2 1.15 1.7.45.67 L3 L4 F1 L5 D G 4.95 5.2.195.25 G1 2.4 2.7.94.16 H 1 1.4.393.49 L2 16 Typ..63 Typ. G1 G F E L3 28.6 3.6 1.126 1.25 L4 9.8 1.6.386.417 L5 2.9 3.6.114.142 L6 15.9 16.4.626.646 L7 9. 9.3.354.366 Dia. 3. 3.2.118.126 5/1
Package Information STPS1545 Table 5. I 2 PK dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. L2 E c2 4.4 4.6.173.181 1 2.49 2.69.98.16 b.7.93.28.37 b1 1.14 1.17.44.46 D b2 1.14 1.17.44.46 c.45.6.18.24 L1 1 c2 1.23 1.36.48.54 L b1 D 8.95 9.35.352.368 e 2.4 2.7.94.16 e e1 b c E 1. 1.4.394.49 L 13.1 13.6.516.535 L1 3.48 3.78.137.149 L2 1.27 1.4.5.55 6/1
Package Information Table 6. D 2 PK Package dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. 4.4 4.6.173.181 L2 E C2 1 2.49 2.69.98.16 2.3.23.1.9 L L3 1 D B.7.93.27.37 B2 1.14 1.7.45.67 C.45.6.17.24 G B2 B C 2 R C2 1.23 1.36.48.54 D 8.95 9.35.352.368 E 1. 1.4.393.49 G 4.88 5.28.192.28 M * V2 * FLT ZONE NO LESS THN 2mm L 15. 15.85.59.624 L2 1.27 1.4.5.55 L3 1.4 1.75.55.69 M 2.4 3.2.94.126 R.4 typ..16 typ. Figure 13. Footprint (dimensions in millimeters) 16.9 1.3 5.8 1.3 8.9 3.7 7/1
Package Information STPS1545 Table 7. TO-22C dimensions Dimensions Ref Millimeters Inches Min. Max. Min. Max. 4.4 4.6.173.181 H2 Ø I C C 1.23 1.32.48.51 D 2.4 2.72.94.17 L5 L7 E.49.7.19.27 F.61.88.24.34 L6 F1 1.14 1.7.44.66 L2 F2 1.14 1.7.44.66 F1 L9 D G 4.95 5.15.194.22 G1 2.4 2.7.94.16 L4 H2 1 1.4.393.49 F G M E L2 16.4 typ..645 typ. L4 13 14.511.551 L5 2.65 2.95.14.116 L6 15.25 15.75.6.62 L7 6.2 6.6.244.259 L9 3.5 3.93.137.154 M 2.6 typ..12 typ. Diam. 3.75 3.85.147.151 In order to meet environmental requirements, ST offers these devices in ECOPCK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPCK is an ST trademark. ECOPCK specifications are available at: www.st.com. 8/1
Ordering Information 3 Ordering Information Ordering type Marking Package Weight Base qty Delivery mode STPS1545D STPS1545D TO-22C 1.86 g 5 Tube STPS1545FP STPS1545FP TO-22FPC 1.9 g 5 Tube STPS1545R STPS1545R I 2 PK 1.7 g 5 Tube STPS1545G STPS1545G D 2 PK 1.48 g 5 Tube STPS1545G-TR STPS1545G D 2 PK 1.48 g 1 Tape & Reel 4 Revision history Date Revision Description of Changes Jul-23 5F Last release. 21-Mar-27 6 Removed ISOWTT package. 9/1
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