STTH5L06. Turbo 2 ultrafast high voltage rectifier. Description. Features
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1 Turbo 2 ultrafast high voltage rectifier Description Datasheet - production data The STTH5L06 is developed using St's Turbo V technology. It is well-suited as a boost diode, especially for use in continuous mode power factor corrections and hard switching conditions. This device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Table 1. Device summary Symbol Value I F(AV) V RRM 5 A 600 V I R (max) 125 µa/ 150 µa T j (max) 175 C V F (typ) t rr (typ) 0.85 V 65 ns Features Ultrafast switching Low reverse recovery current Reduces switching losses Low thermal resistance Insulated package: TO-220FPAC Insulation voltage: 2000 V RMS sine ECOPACK 2 compliant component for DPAK on demand November 2014 DocID8371 Rev 3 1/14 This is information on a product in full production.
2 Characteristics STTH5L06 1 Characteristics Table 2. Absolute ratings (limiting values at 25 C unless otherwise specified) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 600 V I F(RMS) Forward rms current TO-220AC / TO-220FPAC / DO-201AD 20 DPAK 10 A I F(AV) Average forward current δ = 0.5, square wave TO-220AC / DPAK T c = 150 C 5 DO-201AD T I = 50 C 5 TO-220FPAC T c = 135 C 5 A I FRM Repetitive peak forward current t P = 5 µs, F = 5 khz square 65 A I FSM Surge non repetitive forward current t p = 10 ms sinusoidal TO-220AC / TO-220FPAC 90 DO-201AD 110 DPAK 60 T stg Storage temperature range -65 to C T j Maximum operating junction temperature 175 C Table 3. Thermal parameter Symbol Parameter Value Unit A R th(j-c) Junction to case R th(j-l) Junction to lead R th(j-a) Junction to ambient (1) TO-220AC / DPAK 3.5 TO-220FPAC 6 20 L = 10 m, DO-201AD 75 C/W 1. With recommended pad layout (see Figure 15) Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit T j = 25 C V R = 600 V 5 I R (1) Reverse leakage current T j = 150 C V R = 600 V TO-220AC TO-220FPAC DPAK µa DO-201AD V F (2) Forward voltage drop T j = 25 C 1.3 IF = 5 A T j = 150 C V 1. Pulse test: t p = 5 ms, δ < 2% 2. Pulse test: t p = 380 µs, δ < 2% 2/14 DocID8371 Rev 3
3 Characteristics To evaluate the maximum conduction losses use the following equation: P = 0.89 x I F(AV) I F 2 (RMS) Table 5. Dynamic electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit t rr Reverse recovery time T j = 25 C I F = 1 A, di F /dt = -50 A,/µs, V R = 30 V ns I t fr Forward recovery time F = 5 A, di F /dt = 100 A/µs, 150 ns T j = 25 C V FR =1.1xV Fmax V FP Forward recovery voltage I F = 5 A, di F /dt = 100 A/µs 7 V Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current 7 6 P(W) δ = 0.05 δ = 0.1 δ = 0.2 δ = I FM(A) T j=150 C (maximum values) 5 4 δ = T j=150 C (typical values) T j=25 C (maximum values) 3 2 T I F(AV) (A) δ=tp/t tp V FM (V) Figure 3. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK) Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) 1.0 Z th(j-c) /Rth(j-c) 1.0 Z th(j-c) /Rth(j-c) δ = δ = δ = δ = 0.1 Single pulse t (s) p δ=tp/t 1.E-03 1.E-02 1.E-01 1.E+00 T tp δ = 0.2 δ = 0.1 Single pulse t (s) p δ=tp/t 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 T tp DocID8371 Rev 3 3/14 14
4 Characteristics STTH5L06 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD) Figure 7. Reverse recovery time versus di F /dt (typical values) Figure 6. Peak reverse recovery current versus di F /dt (typical values) I RM(A) V R=400V T j=125 C I F=0.25 x IF(AV) I F=0.5 x IF(AV) I=I F F(AV) di /dt(a/µs) F I F=2 x IF(AV) Figure 8. Reverse recovery charges versus di F /dt (typical values) t (ns) rr V R=400V T j=125 C Q (nc) rr V R=400V T j=125 C I F=2 x IF(AV) I F=2 x IF(AV) I=I F F(AV) I F=0.5 x IF(AV) I=I F F(AV) I F=0.5 x IF(AV) di /dt(a/µs) F di /dt(a/µs) F Figure 9. Softness factor versus di F /dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature S factor I=I F F(AV) V R=400V T j=125 C T j( C) I=I F F(AV) V R=400V Reference: T j=125 C 0.4 di F/dt(A/µs) S factor IRM QRR 4/14 DocID8371 Rev 3
5 Characteristics Figure 11. Transient peak forward voltage versus di F /dt (typical values) Figure 12. Forward recovery time versus di F /dt (typical values) V FP(V) I=I F F(AV) T j=125 C t (ns) fr I=I F F(AV) V FR=1.1 x VF max. T j=125 C di /dt(a/µs) F di /dt(a/µs) F Figure 13. Junction capacitance versus reverse voltage applied (typical values) C(pF) V (V) R F=1MHz V OSC=30mV T j=25 C Figure 14. Thermal resistance junction to ambient versus copper surface under tab Figure 15. Thermal resistance junction to ambient versus copper surface under each lead DocID8371 Rev 3 5/14 14
6 Package information STTH5L06 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N m (TO-220FPAC / TO-220AC) Maximum torque value: 0.7 N m (TO-220FPAC / TO-220AC) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Figure 16. TO-220AC dimension definitions H A B Dia L6 L2 L7 L3 F1 D L4 G1 F E G 6/14 DocID8371 Rev 3
7 Package information Ref. Table 6. TO-220AC dimension values Millimeters Dimensions Inches Min. Max. Min. Max. A C D E F F G H L typ typ. L L L L L M 2.6 typ typ. Diam. I DocID8371 Rev 3 7/14 14
8 Package information STTH5L06 Figure 17. TO-220FPAC dimension definitions H A B Dia L6 L2 L7 L3 F1 D L4 G1 F E G 8/14 DocID8371 Rev 3
9 Package information Ref. Table 7. TO-220FPAC dimension values Millimeters Dimensions Inches Min. Max. Min. Max. A B D E F F G G H L2 16 Typ Typ. L L L L Diam DocID8371 Rev 3 9/14 14
10 Package information STTH5L06 Figure 18. DO-201AD dimensions (definitions) B A B E Note 1 Note 1 E ØD Note 2 ØC Table 8. DO-201AD dimensions (values) Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A B C D (1) E Note 2 (2) The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59 ) 10/14 DocID8371 Rev 3
11 Package information Figure 19. DPAK dimension definitions E b4 c2 A E1 L2 Thermal pad H R D D1 D L4 e e1 b A1 c R A2 L 0.25 L1 V2 Gauge plane Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID8371 Rev 3 11/14 14
12 Package information STTH5L06 Ref. Table 9. DPAK dimension values Millimeters Dimensions Inches Min. Typ. Max. Min. Typ. Max. A A A b b c c D D E E e H L L L V Figure 20. Footprint (dimensions in mm) 12/14 DocID8371 Rev 3
13 Ordering information 3 Ordering information Table 10. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH5L06 STTH5L Ammopack DO-201AD 1.16 g STTH5L06RL STTH5L Tape and reel STTH5L06D STTH5L06D TO-220AC 1.9 g 50 Tube STTH5L06B-TR STTH5L06B DPAK 0.32 g 2500 Tape and reel STTH5L06FP STTH5L06FP TO-220FPAC 1.9 g 50 Tube 4 Revision history Table 11. Document revision history Date Revision Changes 16-Nov Last release. 31-Mar Merged with TO-220AC, TO-220FPAC and DPAK version. 26-Nov Updated DPAK and reformatted to current standard. DocID8371 Rev 3 13/14 14
14 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved 14/14 DocID8371 Rev 3
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