7WB Bit Bus Switch. The 7WB3306 is an advanced high speed low power 2 bit bus switch in ultra small footprints.

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2-Bit Bus Switch Th WB3306 is an advancd high spd low powr 2 bit bus switch in ultra small footprints. Faturs High Spd: t PD = 0.25 ns (Max) @ V CC = 4.

1 2-Bit Bus Switch Th WB3306 is an advancd high spd low powr 2 bit bus switch in ultra small footprints. Faturs High Spd: t PD = 0.25 ns V CC = 4.5 V 3 Switch Connction Btwn 2 Ports Powr Down Protction Providd on Inputs Zro Bounc TTL Compatibl Control Inputs Ultra Small Pb Fr Packags Ths ar Pb Fr Dvics UDFN MU SUFFIX CSE 5J MRKING DIGRMS NM Micro DM SUFFIX CSE YW TSSOP DT SUFFIX CSE 94L YWW- UDFN.95 x.0 CSE 5C X M = ssmbly Location Y = Yar W = Work Wk M = Dat Cod = Pb Fr Packag (Not: Microdot may b in ithr location) ORDERING INFORMTION S dtaild ordring and shipping information in th packag dimnsions sction on pag of this data sht. Smiconductor Componnts Industris, LLC, 204 Octobr, 204 Rv. 3 Publication Ordr Numbr: WB3306/D

2 OE V CC OE V CC 2 OE2 2 OE2 B 3 6 B2 B 3 6 B2 GND GND Figur 2. Micro/TSSOP (Top Viw) Figur. UDFN (Top Thru Viw) B FUNCTION TBLE OE Input OEn L Function Bn = n 2 B2 H Disconnct OE2 Figur 3. Logic Diagram 2

3 MXIMUM RTINGS Symbol Paramtr Valu Unit V CC DC Supply Voltag 0.5 to +.0 V V IN Control Pin Input Voltag 0.5 to +.0 V V I/O Switch Input / Output Voltag 0.5 to +.0 V I IK Control Pin DC Input Diod Currnt V IN < GND 50 m I OK Switch I/O Port DC Diod Currnt V I/O < GND 50 m I O ON Stat Switch Currnt 2 m Continuous Currnt Through V CC or GND 50 m I CC DC Supply Currnt Pr Supply Pin 50 m I GND DC Ground Currnt pr Ground Pin 50 m T STG Storag Tmpratur Rang 65 to +50 C T L Lad Tmpratur, mm from Cas for 0 Sconds 260 C T J Junction Tmpratur Undr Bias 50 C J Thrmal Rsistanc UDFN (Not ) Micro TSSOP C/W P D Powr Dissipation in Still ir at 5 C UDFN Micro TSSOP MSL Moistur Snsitivity Lvl F R Flammability Rating Oxygn Indx: 2 to 34 UL 94 V 0.25 in V ESD ESD Withstand Voltag (Not 2) Human Body Modl, all pins Human Body Modl, n /B n to Ground Human Body Modl, n /B n to V CC >.5 > 4 > 4 mw kv kv kv I LTCHUP Latchup Prformanc bov V CC and Blow GND at 25 C (Not 3) 00 m Strsss xcding thos listd in th Maximum Ratings tabl may damag th dvic. If any of ths limits ar xcdd, dvic functionality should not b assumd, damag may occur and rliability may b affctd.. Masurd with minimum pad spacing on an FR4 board, using 0 mm by inch, 2 ounc coppr trac no air flow. 2. Tstd to EI / JESD Tstd to EI / JESD. RECOMMENDED OPERTING CONDITIONS Symbol Paramtr Min Max Unit V CC Positiv DC Supply Voltag V V IN Control Pin Input Voltag V V I/O Switch Input / Output Voltag V T Oprating Fr ir Tmpratur C t/ V Input Transition Ris or Fall Rat Control Input Switch I/O Functional opration abov th strsss listd in th Rcommndd Oprating Rangs is not implid. Extndd xposur to strsss byond th Rcommndd Oprating Rangs limits may affct dvic rliability DC ns/v 3

4 DC ELECTRICL CHRCTERISTICS Symbol Paramtr Conditions V CC (V) T = 25 C T = 55 C to +25 C Min Typ Max Min Max V IK Clamp Diod Voltag I I/O = m V V IH High Lvl Input Voltag (Control) 4.0 to 5.5 Unit V V IL Low Lvl Input Voltag (Control) 4.0 to V V OH Output Voltag High S Figur 4 I IN Input Lakag Currnt 0 V IN 5.5 V I OFF Powr Off Lakag Currnt V I/O = 0 to 5.5 V I CC Quiscnt Supply Currnt I O = 0, V IN = V CC or 0 V I CC Incras in Supply Currnt (Control Pin) On input at 3.4 V; Othr inputs at V CC or GND R ON Switch ON Rsistanc V I/O = 0, I I/O = 64 m I I/O = 30 m m 4.5 V I/O = 2.4, I I/O = 5 m V I/O = 2.4, I I/O = 5 m Product paramtric prformanc is indicatd in th Elctrical Charactristics for th listd tst conditions, unlss othrwis notd. Product prformanc may not b indicatd by th Elctrical Charactristics if opratd undr diffrnt conditions. C ELECTRICL CHRCTERISTICS Symbol Paramtr Tst Condition V CC (V) t PD Propagation Dlay, Bus to Bus S Figur to 5.5 t EN Output Enabl Tim S Figur to 5.5 T = 25 C T = 55 C to +25 C Min Typ Max Min Max Unit ns ns t DIS Output Disabl Tim 4.5 to ns C IN Control Input Capacitanc V IN = 5 or 0 V pf C IO(ON) Switch On Capacitanc Switch ON pf C IO(OFF) Switch Off Capacitanc Switch OFF pf 4

5 TYPICL DC CHRCTERISTICS 4.50 V OH, HIGH LEVEL OUTPUT VOLT- GE (V) I OH = 0. m 24 m 2.50 T = +5 C 2.25 V IN = V CC V CC, SUPPLY VOLTGE (V) 6 m 2 m 4.50 V OH, HIGH LEVEL OUTPUT VOLT- GE (V) I OH = 0. m 24 m 2.50 T = +25 C 2.25 V IN = V CC V CC, SUPPLY VOLTGE (V) 6 m 2 m 4.50 V OH, HIGH LEVEL OUTPUT VOLT- GE (V) I OH = 0. m 24 m 6 m 2 m 2.50 T = 40 C 2.25 V IN = V CC V CC, SUPPLY VOLTGE (V) Figur 4. Output Voltag High vs Supply Voltag 5

6 C LODING ND WVEFORMS Paramtr Masurmnt Information From Output Undr Tst 500 S V Opn Tst S C L = 50 pf* 500 GND t PD t PLZ /t PZL t PHZ /t PZH Opn V Opn *C L includs probs and jig capacitanc. Input Output t PLH.5 V.5 V Voltag Wavforms Propagation Dlay Tims t PHL.5 V.5 V 3 V 0 V V OH V OL Output Control t PZL Output Wavform S at V (Not 4) t PZH Output Wavform 2 S at Opn (Not 4).5 V.5 V.5 V 3 V.5 V 0 V tplz 3.5 V V OL V t PHZ V OL V OH V OH 0.3 V 0 V Voltag Wavforms Enabl and Disabl Tims 4. Wavform is for an output with intrnal conditions such that th output is low, xcpt whn disabld by th output control. Wavform 2 is for an output with intrnal conditions such that th output is high, xcpt whn disabld by th output control 5. ll input pulss ar supplid by gnrators having th following charactristics: PRR 0 MHz, Z O = 50, t r 2.5 ns, t f 2.5 ns. 6. Th outputs ar masurd on at a tim, with on transition pr masurmnt.. t PLZ and t PHZ ar th sam as t DIS.. t PZL and t PZH ar th sam as t EN. 9. t PHL and t PLH ar th sam as t PD. Figur 5. t PD, t EN, t DIS Loading and Wavforms 6

7 ORDERING INFORMTION WB3306MUTG Dvic Packag Shipping UDFN (Pb Fr) 3000 / Tap & Rl WB3306DMR2G WB3306DTR2G Micro (Pb Fr) TSSOP (Pb Fr) 4000 / Tap & Rl (In Dvlopmant) 5000 / Tap & Rl WB3306DMUTCG UDFN,.95 x.0, 0.5 mm Pitch (Pb Fr) 3000 / Tap & Rl For information on tap and rl spcifications, including part orintation and tap sizs, plas rfr to our Tap and Rl Packaging Spcifications Brochur, BRD0/D.

8 PCKGE DIMENSIONS UDFN. x.2, 0.4P CSE 5J ISSUE O 0.0 C PIN ONE REFERENCE D ÉÉ 0.0 C TOP VIEW 0.05 C 0.05 C (b2) /2 (3) SIDE VIEW 4 B E DETIL X L C SETING PLNE L DETIL NOTE 5 NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b PPLIES TO PLTED TERMINL ND IS MESURED BETWEEN 0.5 ND 0.30 mm FROM TERMINL TIP. 4. MOLD FLSH LLOWED ON TERMINLS LONG EDGE OF PCKGE. FLSH MY NOT EXCEED 0.03 ONTO BOTTOM SURFCE OF TERMINLS. 5. DETIL SHOWS OPTIONL CONSTRUCTION FOR TERMINLS. MILLIMETERS DIM MIN MX REF b b REF D.0 BSC E.20 BSC 0.40 BSC L L L REF (L2) 5 BOTTOM VIEW X b M M C B C NOTE 3 MOUNTING FOOTPRINT* SOLDERMSK DEFINED X X PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Fr stratgy and soldring dtails, plas download th ON Smiconductor Soldring and Mounting Tchniqus Rfrnc Manual, SOLDERRM/D.

9 PCKGE DIMENSIONS UDFN.95x.0, 0.5P CSE 5C ISSUE O PIN ONE REFERENCE 2X 2X 0.0 C 0.0 C 0.05 C 0.05 C L ÉÉÉ D TOP VIEW SIDE VIEW /2 4 B E 3 X L C SETING PLNE NOTES:. DIMENSIONING ND TOLERNCING PER SME Y4.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b PPLIES TO PLTED TERMINL ND IS MESURED BETWEEN 0.5 ND 0.20 MM FROM TERMINL TIP. 4. PCKGE DIMENSIONS EXCLUSIVE OF BURRS ND MOLD FLSH. MILLIMETERS DIM MIN MX REF b D.95 BSC E.00 BSC 0.50 BSC L L RECOMMENDED SOLDERING FOOTPRINT* X 0.49 X BOTTOM VIEW 5 X b 0.0 M C B 0.05 M C NOTE PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb Fr stratgy and soldring dtails, plas download th ON Smiconductor Soldring and Mounting Tchniqus Rfrnc Manual, SOLDERRM/D. 9

10 PCKGE DIMENSIONS Micro CSE 46 ISSUE H H E D E NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION DOES NOT INCLUDE MOLD FLSH, PROTRUSIONS OR GTE BURRS. MOLD FLSH, PROTRUSIONS OR GTE BURRS SHLL NOT EXCEED 0.5 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLED FLSH OR PROTRUSION. INTERLED FLSH OR PROTRUSION SHLL NOT EXCEED 0.25 (0.00) PER SIDE OBSOLETE, NEW STNDRD PIN ID T SETING PLNE 0.03 (0.005) b PL 0.0 (0.003) M T B S S c L MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E BSC BSC L H E SOLDERING FOOTPRINT*.04 X X X SCLE : mm inchs *For additional information on our Pb Fr stratgy and soldring dtails, plas download th ON Smiconductor Soldring and Mounting Tchniqus Rfrnc Manual, SOLDERRM/D. 0

11 PCKGE DIMENSIONS b TSSOP, 4.4x3 CSE 94L ISSUE O SYMBOL MIN NOM MX b E E c D E E BSC L.00 REF L θ º º TOP VIEW D 2 c SIDE VIEW L END VIEW L Nots: () ll dimnsions ar in millimtrs. ngls in dgrs. (2) Complis with JEDEC MO-53. Micro is a tradmark of Intrnational Rctifir. ON Smiconductor and ar rgistrd tradmarks of Smiconductor Componnts Industris, LLC (SCILLC). SCILLC rsrvs th right to mak changs without furthr notic to any products hrin. SCILLC maks no warranty, rprsntation or guarant rgarding th suitability of its products for any particular purpos, nor dos SCILLC assum any liability arising out of th application or us of any product or circuit, and spcifically disclaims any and all liability, including without limitation spcial, consquntial or incidntal damags. Typical paramtrs which may b providd in SCILLC data shts and/or spcifications can and do vary in diffrnt applications and actual prformanc may vary ovr tim. ll oprating paramtrs, including Typicals must b validatd for ach customr application by customr s tchnical xprts. SCILLC dos not convy any licns undr its patnt rights nor th rights of othrs. SCILLC products ar not dsignd, intndd, or authorizd for us as componnts in systms intndd for surgical implant into th body, or othr applications intndd to support or sustain lif, or for any othr application in which th failur of th SCILLC product could crat a situation whr prsonal injury or dath may occur. Should Buyr purchas or us SCILLC products for any such unintndd or unauthorizd application, Buyr shall indmnify and hold SCILLC and its officrs, mploys, subsidiaris, affiliats, and distributors harmlss against all claims, costs, damags, and xpnss, and rasonabl attorny fs arising out of, dirctly or indirctly, any claim of prsonal injury or dath associatd with such unintndd or unauthorizd us, vn if such claim allgs that SCILLC was nglignt rgarding th dsign or manufactur of th part. SCILLC is an Equal Opportunity/ffirmativ ction Employr. This litratur is subjct to all applicabl copyright laws and is not for rsal in any mannr. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Litratur Distribution Cntr for ON Smiconductor P.O. Box 563, Dnvr, Colorado 02 US Phon: or Toll Fr US/Canada Fax: or Toll Fr US/Canada ordrlit@onsmi.com N. mrican Tchnical Support: Toll Fr US/Canada Europ, Middl East and frica Tchnical Support: Phon: Japan Customr Focus Cntr Phon: ON Smiconductor Wbsit: Ordr Litratur: For additional information, plas contact your local Sals Rprsntativ WB3306/D

NLX2G00. Dual 2-Input NAND Gate

NLX2G00. Dual 2-Input NAND Gate ual 2-Input NN Gat Th NLX2G00 is an advancd high-spd dual 2-input CMOS NN gat in ultra-small footprint. Th NLX2G00 input structurs provid protction whn voltags up to 7.0 volts ar applid, rgardlss of th