DATA SHEET. 74HC1G125; 74HCT1G125 Bus buffer/line driver; 3-state INTEGRATED CIRCUITS Nov 10

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1 INTEGRATED CIRCUITS DATA SHEET File under Integrated Circuits, IC Nov 10

2 FEATURES Wide operating voltage: 2.0 to 6.0 V Symmetrical output impedance High noise immunity Low power dissipation Balanced propagation delays Very small 5 pins package Output capability: bus driver. DESCRIPTION The 74HC1G/HCT1G125 is a high-speed Si-gate CMOS device. The 74HC1G/HCT1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH at OE causes the output as assume a high-impedance OFF-state. The bus driver output currents are equal compared to the 74HC/HCT125. FUNCTION TABLE See note 1. INPUTS OUTPUT OE ina outy L L L L H H H X Z QUICK REFERENCE DATA GND = 0 V; T amb =25 C; t r =t f 6.0 ns. SYMBOL PARAMETER CONDITIONS t PHL /t PLH Notes 1. C PD is used to determine the dynamic power dissipation (P D in µw). P D =C PD V 2 CC f i + (C L V 2 CC f o ) where: f i = input frequency in MHz; f o = output frequency in MHz; C L = output load capacitance in pf; V CC = supply voltage in V; (C L V 2 CC f o ) = sum of outputs. 2. For HC1G the condition is V I = GND to V CC. For HCT1G the condition is V I = GND to V CC 1.5 V. PINNING propagation delay ina to outy C L = 15 pf; V CC =5V HC1G TYP. HCT1G 9 10 ns C I input capacitance pf C PD power dissipation notes 1 and pf capacitance PIN SYMBOL DESCRIPTION 1 OE output enable input 2 ina data input 3 GND ground (0 V) 4 outy data output 5 V CC DC supply voltage UNIT Note 1. H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF state Nov 10 2

3 ORDERING INFORMATION OUTSIDE NORTH AMERICA TEMPERATURE RANGE PACKAGES PINS PACKAGE MATERIAL CODE MARKING 74HC1G125GW 40 to +125 C 5 SC-88A plastic SOT353 HM 74HCT1G125GW 5 SC-88A plastic SOT353 TM handbook, halfpage OE 1 5 V CC handbook, halfpage 2 ina outy 4 ina GND MNA117 outy 1 OE MNA118 Fig.1 Pin configuration. Fig.2 Logic symbol. handbook, halfpage 2 1 OE MNA119 4 handbook, halfpage ina OE outy MNA120 Fig.3 IEC logic symbol. Fig.4 Logic diagram Nov 10 3

4 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER 74HC1G04 74HCT1G04 MIN. TYP. MAX. MIN. TYP. MAX. UNIT V CC DC supply voltage V V I input voltage 0 V CC 0 V CC V V O output voltage 0 V CC 0 V CC V T amb t r, t f operating ambient temperature input rise and fall times except for Schmitt trigger inputs CONDITIONS C see DC and AC characteristics per device 1000 ns V CC = 2.0 V ns V CC = 4.5 V 400 ns V CC = 6.0 V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CC DC supply voltage V ±I IK DC input diode current V I < 0.5 V or V I >V CC V; note 1 20 ma ±I OK DC output diode current V O < 0.5V or V O >V CC V; note 1 20 ma ±I O DC output source or sink 0.5V < V O <V CC V; note ma current standard outputs ±I CC DC V CC or GND current for note 1 25 ma types with standard outputs T stg storage temperature C P D power dissipation per package temperature range: 40 to +125 C; note mw Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 C the value of P D derates linearly with 2.5 mw/k Nov 10 4

5 DC CHARACTERISTICS Family 74HC1G Additional type data to the recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER Note 1. All typical values are measured at T amb =25 C. T amb ( C) 40 to to +125 MIN. TYP. (1) MAX. MIN. MAX. UNIT V IH HIGH-level input V 2.0 voltage V IL LOW-level input voltage V V OH V OH V OL V OL HIGH-level output voltage; all outputs HIGH-level output voltage; standard outputs LOW-level output voltage; all outputs LOW-level output voltage; standard outputs TEST CONDITIONS V CC (V) OTHER V 2.0 V I =V IH or V IL : I O =20µA V 4.5 V I =V IH or V IL ; I O = 2.0 ma V I =V IH or V IL ; I O = 2.6 ma V 2.0 V I =V IH or V IL ; I O =20µA V 4.5 V I =V IH or V IL ; I O = 2.0 ma V I =V IH or V IL ; I O = 2.6 ma I I input leakage current µa 6.0 V I =V CC or GND I CC quiescent supply current µa 6.0 V I =V CC or GND; I O = Nov 10 5

6 Family 74HCT1G Additional type data to the recommended operating conditions; voltages are referenced to GND (ground = 0 V). SYMBOL V IH V IL V OH V OH V OL V OL PARAMETER HIGH-level input voltage LOW-level input voltage HIGH-level output voltage; all outputs HIGH-level output voltage; standard outputs LOW-level output voltage; all outputs LOW-level output voltage; standard outputs Note 1. All typical values are measured at T amb =25 C. T amb ( C) 40 to to +125 MIN. TYP. (1) MAX. MIN. MAX. UNIT TEST CONDITIONS V CC (V) V 4.5 to V 4.5 to 5.5 OTHER V 4.5 V I =V IH or V IL ; I O =20µA V 4.5 V I =V IH or V IL ; I O = 2.0 ma V 4.5 V I =V IH or V IL ; I O =20µA V 4.5 V I =V IH or V IL ; I O = 2.0 ma I I input leakage current µa 5.5 V I =V CC or GND I CC I CC quiescent supply current additional supply current per input µa 5.5 V I =V CC or GND; I O = µa 4.5 to 5.5 V I =V CC 2.1; I O = Nov 10 6

7 AC CHARACTERISTICS Type 74HC1G125 GND = 0 V; t r =t f 6.0 ns; C L =50pF. SYMBOL t PHL /t PLH t PZH /t PZL t PHZ /t PLZ PARAMETER propagation delay ina to outy 3-state output enable time OE to outy 3-state output disable time OE to outy T amb ( C) TEST CONDITIONS 40 to to +125 UNIT MIN. TYP. (1) MAX. MIN. MAX. V CC (V) WAVEFORMS ns 2.0 see Figs 5 and ns ns ns 2.0 see Figs 6 and ns ns ns 2.0 see Figs 6 and ns ns 6.0 Note 1. All typical values are measured at T amb =25 C. Type 74HCT1G125 GND = 0 V; t r =t f 6.0 ns; C L =50pF. SYMBOL t PHL /t PLH t PZH /t PZL t PHZ /t PLZ PARAMETER propagation delay ina to outy 3-state output enable time OE to outy 3-state output disable time OE to outy T amb ( C) TEST CONDITIONS 40 to to +125 UNIT MIN. TYP. (1) MAX. MIN. MAX. V CC (V) WAVEFORMS ns 4.5 see Figs 5 and ns 4.5 see Figs 6 and ns 4.5 see Figs 6 and 7 Note 1. All typical values are measured at T amb =25 C Nov 10 7

8 AC WAVEFORMS handbook, halfpage V I ina INPUT V M (1) GND t PHL t PLH outy OUTPUT V M (1) MNA121 (1) HC1G V M = 50%; V I = GND to V CC ; HCT1G V M = 1.3 V; V I = GND to 3.0 V. Fig.5 The input (ina) to output (outy) propagation delays. handbook, full pagewidth V I OE INPUT V M (1) GND t PLZ t PZL OUTPUT LOW-to-OFF OFF-to-LOW V CC V OL +0.3 V V M (1) t PHZ t PZH OUTPUT HIGH-to-OFF OFF-to-HIGH GND output enabled V OH 0.3 V output disabled V M (1) output enabled MNA122 (1) HC1G V M = 50%; V I = GND to V CC ; HCT1G V M = 1.3 V; V I = GND to 3.0 V. Fig.6 The 3-state enable and disable times Nov 10 8

9 handbook, halfpage V CC PULSE GENERATOR V I R T D.U.T. V O R L = 1 kω S 1 C L 50 pf V CC open MNA123 Definitions for test circuit; C L = load capacitance including jig and probe capacitance. (See AC characteristics ) R T = termination resistance should be equal to the output impedance Z o of the pulse generator. R T = termination resistance should be equal to the output impedance Z o of the pulse generator. TEST S 1 t PLH /t PHL open t PLZ /t PZL t PHZ /t PZH V CC GND Fig.7 Load circuitry for switching times Nov 10 9

10 PACKAGE OUTLINE Plastic surface mounted package; 5 leads SOT353 D B E A X y H E v M A 5 4 Q A A1 c e1 bp w M B Lp e detail X mm scale DIMENSIONS (mm are the original dimensions) UNIT A A 1 max mm bp c D E (2) e e 1 H E L p Q v w y OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT353 SC-88A Nov 10 10

11 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted IC s, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering IC s can be found in our Data Handbook IC26; Integrated Circuit Packages (order code ). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Nov 10 11

12 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale Nov 10 12

13 NOTES 1998 Nov 10 13

14 NOTES 1998 Nov 10 14

15 NOTES 1998 Nov 10 15

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