Pen Tip Position Estimation Using Least Square Sphere Fitting for Customized Attachments of Haptic Device

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1 for Cuomed Ahmen of Hp Deve Mno KOEDA nd Mhko KAO Deprmen of Compuer Sene Ful of Informon Sene nd Ar Ok Elero-Communon Unver Kok 30-70, Shjonwe, Ok, , JAPA {koed, Ar In h pper, mehod for emng he pen p poon of uomed hp deve hmen preened. Le qure phere fng ppled o he qured pon loud d o eme he rdu nd ener of phere. Verfon epermen were ondued nd he epermenl reul how h he propoed mehod h reonle ur. Inroduon Convenonll, denl model [] re ued o mpr hnd kll eduon o denl uden; however, h mehod no lw effeve. Denl pen roo h mule rel humn moon hve een developed [, 3]. However, hee roo re rrel nrodued n eduon eue of her hgh o nd dfful mnenne. We hve een developng HAP-DE [4], ompuered denl rnng mulor Fg.. he developed mulor ue omnon of vrul rel nd hp. A ule omnon of vrul nd rel pe would enle effeve hnd kll eduon for denl uden. Operor wh Hed rker Vrul eeh PC Monor Hlf Mrror Comned Imge Cuomed Ahmen eeh Model Hp Deve Fg.. Sem Overvew of HAP-DE

2 Mno KOEDA nd Mhko KAO Den ue dfferen ool o perform dfferen denl operon, uh drll for grndng or ler for removng denl lulu Fg.. o uld mulor h ree hgh degree of relm, neer o prepre uomed hmen Fg. 3 h hve he me hpe rel denl ool. Addonll, for mulon, neer h he poon of he p of he hmen hould e known. In h pper, we propoe mehod for emng he pen p poon of uomed hp deve hmen. We hve uded lron mehod for mulple hp deve [5]; however, he p poon w hrd-oded n he mehod. he propoed mehod eme he p poon fng he qured pon loud d o phere ung he le qure pproh. Emon Mehod Ung Le Squre Sphere Fng he p of uomed hp deve hmen mnned ern poon, nd he hmen mnpuled n vrou dreon o on pherll rrnged poonng d e. he rdu nd ener of he phere n e emed fng he pon loud d o phere he le qure pproh. he emed rdu equl o he lengh eween he p nd deful orgn pon. Grndng Slng Prong d Rdeom Fg.. pl denl k Deful lu Cuomed hmen Fg. 3. Cuomed hmen for denl mulor

3 for Cuomed Ahmen of Hp Deve 3 Fg. 4 llure he oordnon em. he qured -pon loud d re defned p L. he ener nd rdu of he phere,,, nd r p, repevel, re luled he followng equon [ ] d r 4 where,,, nd d re gven d Epermen nd Reul he epermenl eup on of hp deve {Phnom Omn [6] Fg. 4}, uomed hmen Fg. 5, nd mell lron lok Fg. 6. he lengh of he uomed hmen, meured ung ruler, ppromel 3 [mm]. welve mll dmple A-L, 0 [mm] nervl were pled on he urfe of he lron lok. hee dmple were ued o ur p movemen durng pon-d quon. p p p p Aul meured vlue 3 [mm] Aul meured vlue 3 [mm] Fg. 4. Coordnon em Fg. 5. Cuomed hmen

4 4 Mno KOEDA nd Mhko KAO 0 [mm] 0 [mm] 0 [mm] 0 [mm] A 0 [mm] B C E D F I G J H K L Overvew welve mll dmple on urfe Fg. 6. Clron lok Fg. 7. Snpho of d quon proe Fg. 8. Smple of qured pon loud d le. Epermenl reul Meuremen Pon A B C D Lengh [mm] Meuremen Pon E F G H Lengh [mm] Meuremen Pon I J K L Lengh [mm]

5 for Cuomed Ahmen of Hp Deve 5 Lengh [mm] A B C D E F G H I J K L Meuremen Pon Fg. 9. Epermenl reul Fg. 7 how npho of he epermenon. Pon loud d 000 were qured eh dmple, nd he rdu of he phere w emed ung he propoed mehod. Fg. 8 how mple pon loud d, nd n e een h he pon re pherll rrnged. he reul of he rdu emon epermen re led n le nd Fg. 9. he emed verge rdu.3 [mm], nd h vlue loe o he meured lengh of he uomed hmen. Conluon In h pper, mehod for emng he pen p poon of uomed hp deve hmen w propoed. he propoed mehod w verfed ung uomed hmen, whh modeled grndng drll. I w found h he error w le hn 3% nd h he propoed mehod h reonle ur. Referene. ISSI DEAL PRODUCS IC., SIMPLE MAIKI II: hp:// S. UZUKA e l., Developmen of Pen Smulon Sem: Applon for Clnl Eduon, he IADR/AADR/CADR 85 h Generl Seon nd Ehon, H. AKAOBU e l., Denl Pen Roo, In Proeedng of IEEE/RSJ Inernonl Conferene on Inellgen Roo nd Sem, pp , S. YAMAGUCHI e l. Denl Hp Smulor o rn Hnd Skll of Suden, In Proeedng of he 3 rd MEI Inernonl Smpoum, p.43, M. KOEDA e l. Emon Mehod for Relve Poon nd Aude Beween wo Hp Deve, In Proeedng of h Inernonl Conferene on Humn-Compuer Ineron, pp , SESABLE ECHOLOGIES, IC., Phnom Omn: hp://