MC74HC04A. Hex Inverter. High Performance Silicon Gate CMOS

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1 Hex Inverter High Performance Silicon Gate COS The is identical in pinout to the S04 and the C069. The device inputs are compatible with Standard COS outputs; with pullup resistors, they are compatible with STT outputs. The device consists of six three stage inverters. Features Output Drive Capability: 0 STT oads Outputs Directly Interface to COS, NOS and TT Operating oltage Range: to ow Input Current: High Noise Immunity Characteristic of COS Devices In Compliance With the JEDEC Standard No. 7 Requirements Chip Complexity: 36 FETs or 9 Equivalent Gates Pb Free Packages are vailable* OGIC DIGR PDIP N SUFFIX CSE 646 SOIC D SUFFIX CSE 75 RKING DIGRS N WYYWW HC04 WYWW Y Y2 Y3 TSSOP DT SUFFIX CSE 948G HC 04 YW Y4 Y = = ssembly ocation W or = Wafer ot YY or Y = Year WW or W = Work Week 5 0 Y Y6 FUNCTION TBE Inputs Outputs Pinout: ead Packages (Top iew) CC 6 Y6 5 Y5 4 Y H Y H ORDERING INFORTION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet Y 2 Y2 3 Y3 GND *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and ounting Techniques Reference anual, SODERR/D. Semiconductor Components Industries, C, 2005 ay, 2005 Rev. 0 Publication Order Number: /D

2 XIU RTINGS Symbol Parameter alue ÎÎÎ Unit CC DC Supply oltage (Referenced to GND) 0.5 to ÎÎÎ in DC Input oltage (Referenced to GND) 0.5 to CC ÎÎÎ out DC Output oltage (Referenced to GND) 0.5 to CC + 0.5ÎÎÎ I in DC Input Current, per Pin ± 20 m I out DC Output Current, per Pin ± 25 m ICC DC Supply Current, CC and GND Pins ± 50 Î m P Î D Power Dissipation in Still ir, Plastic DIP 750 mw SOIC Package 500 ÎÎÎ TSSOP Package 450 T stg Storage Temperature 65 to + 50 C T Î ead Temperature, mm from Case for 0 Seconds Î C Plastic DIP, SOIC or TSSOP Package aximum ratings are those values beyond which device damage can occur. aximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, in and out should be constrained to the range GND ( in or out ) CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or CC ). Unused outputs must be left open. Derating Plastic DIP: 0 mw/ C from 65 to 25 C SOIC Package: 7 mw/ C from 65 to 25 C TSSOP Package: 6. mw/ C from 65 to 25 C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High Speed COS Data Book (D29/D). RECOENDED OPERTING CONDITIONS Symbol Parameter in ÎÎÎ ax Unit CC DC Supply oltage (Referenced to GND) ÎÎÎ in, out DC Input oltage, Output oltage (Referenced to GND) 0 CC ÎÎÎ T Operating Temperature, ll Package Types ÎÎÎ ÎÎÎ C t r, t f Input Rise and Fall Time CC = ÎÎ (Figure ) CC = ÎÎÎ ÎÎÎ ÎÎÎ ns CC = ORDERING INFORTION Device Order Number Package Shipping N PDIP 2000 / Rail NG PDIP 2000 / Rail D SOIC 55 / Rail DG SOIC 55 / Rail DR2 SOIC 2500 / Tape & Reel DR2G SOIC 2500 / Tape & Reel DTR2 TSSOP * 2500 / Tape & Reel F SOEIJ 50 / Rail FG SOEIJ 50 / Rail FE SOEIJ 2000 / Tape & Reel FEG SOEIJ 2000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *This package is inherently Pb Free. 2

3 DC CHRCTERISTICS (oltages Referenced to GND) Symbol Parameter Condition IH I OH O I in I CC inimum High evel Input oltage aximum ow evel Input oltage inimum High evel Output oltage aximum ow evel Output oltage aximum Input eakage Current aximum Quiescent Supply Current (per Package) out = 0. or CC 0. I out 20 out = 0. or CC 0. I out 20 in = IH or I I out 20 in = IH or I in = IH or I I out 20 in = IH or I I out 2.4m I out 4.0m I out 5.2m I out 2.4m I out 4.0m I out 5.2m Guaranteed imit CC 55 to 25 C 85 C 25 C Unit in = CC or GND ± 0. ±.0 ±.0 in = CC or GND I out = NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High Speed COS Data Book (D29/D). C CHRCTERISTICS (C = 50pF, Input t r = t f = 6ns) Symbol t PH, t PH t TH, t TH Parameter aximum Propagation Delay, Input or B to Output Y (Figures and 2) aximum Output Transition Time, ny Output (Figures and 2) Guaranteed imit CC 55 to 25 C 85 C 25 C Unit C in aximum Input Capacitance pf NOTE: For propagation delays with loads other than 50 pf, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High Speed COS Data Book (D29/D) C, CC = 5.0 C PD Power Dissipation Capacitance (Per Inverter)* 20 pf * Used to determine the no load dynamic power consumption: P D = C PD 2 CC f + I CC CC. For load considerations, see Chapter 2 of the ON Semiconductor High Speed COS Data Book (D29/D) ns ns 3

4 t f t r INPUT 90% 50% 0% CC GND t PH t PH OUTPUT Y 90% 50% 0% t TH t TH Figure. Switching Waveforms TEST POINT DEICE UNDER TEST OUTPUT C * *Includes all probe and jig capacitance Figure 2. Test Circuit Y Figure 3. Expanded ogic Diagram (/6 of the Device Shown) 4

5 PCKGE DIENSIONS PDIP N SUFFIX CSE ISSUE N T N SETING PNE 8 B 7 F C K H G D P 0.3 (0.005) J NOTES:. DIENSIONING ND TOERNCING PER NSI Y.5, CONTROING DIENSION: INCH. 3. DIENSION TO CENTER OF EDS WHEN FORED PRE. 4. DIENSION B DOES NOT INCUDE OD FSH. 5. ROUNDED CORNERS OPTION. INCHES IIETERS DI IN X IN X B C D F G 0.00 BSC 2.54 BSC H J K N SOIC D SUFFIX CSE ISSUE G T SETING PNE G 8 D P 7 B K P 7 P C 0.25 (0.00) T B S S 0.25 (0.00) B R X 45 J F NOTES:. DIENSIONING ND TOERNCING PER NSI Y.5, CONTROING DIENSION: IIETER. 3. DIENSIONS ND B DO NOT INCUDE OD PROTRUSION. 4. XIU OD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIENSION D DOES NOT INCUDE DBR PROTRUSION. OWBE DBR PROTRUSION SH BE 0.27 (0.005) TOT IN EXCESS OF THE D DIENSION T XIU TERI CONDITION. IIETERS INCHES DI IN X IN X B C D F G.27 BSC BSC J K P R

6 PCKGE DIENSIONS TSSOP DT SUFFIX CSE 948G 0 ISSUE 0.5 (0.006) T 0.5 (0.006) T 0.0 (0.004) T SETING PNE U U S 2X /2 PIN IDENT. S D C X K REF 0.0 (0.004) T U S S N (0.00) B U 7 G H N J J F DETI E K K ÇÇÇ ÉÉÉ ÇÇÇ SECTION N N DETI E W NOTES:. DIENSIONING ND TOERNCING PER NSI Y.5, CONTROING DIENSION: IIETER. 3. DIENSION DOES NOT INCUDE OD FSH, PROTRUSIONS OR GTE BURRS. OD FSH OR GTE BURRS SH NOT EXCEED 0.5 (0.006) PER SIDE. 4. DIENSION B DOES NOT INCUDE INTERED FSH OR PROTRUSION. INTERED FSH OR PROTRUSION SH NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIENSION K DOES NOT INCUDE DBR PROTRUSION. OWBE DBR PROTRUSION SH BE 0.08 (0.003) TOT IN EXCESS OF THE K DIENSION T XIU TERI CONDITION. 6. TERIN NUBERS RE SHOWN FOR REFERENCE ONY. 7. DIENSION ND B RE TO BE DETERINED T DTU PNE W. IIETERS INCHES DI IN X IN X B C D F G 0.65 BSC BSC H J J K K BSC BSC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICTION ORDERING INFORTION ITERTURE FUFIENT: iterature Distribution Center for ON Semiconductor P.O. Box 632, Phoenix, rizona US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2 9 Kamimeguro, eguro ku, Tokyo, Japan Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative. /D

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