MC74LVX32. Quad 2-Input OR Gate. With 5 V Tolerant Inputs
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1 MC4X32 Quad 2-Input OR Gate With 5 Tolerant Inputs The MC4X32 is an advanced high speed CMOS 2 input OR gate. The inputs tolerate voltages up to.0, allowing the interface of 5.0 systems to 3.0 systems. Features igh Speed: t PD = 4.4 ns (Typ) at CC = 3.3 ow Power Dissipation: I CC = 2 A (Max) at T A = 25 C Power Down Protection Provided on Inputs Balanced Propagation Delays ow Noise: OP = 0.5 (Max) Pin and Function Compatible with Other Standard ogic Families atchup Performance Exceeds 300 ma ESD Performance: uman Body Model > 2000 ; Machine Model > 200 These Devices are Pb Free and are RoS Compliant 4 4 SOIC 4 D SUFFIX CASE 5A TSSOP 4 DT SUFFIX CASE 948G 4 4 MARKING DIAGRAMS X32G AWYWW X 32 AYW 4 4 SOEIAJ 4 M SUFFIX CASE 965 X32 AYWG X32 = Specific Device Code A = Assembly ocation W, = Wafer ot Y = Year WW, W = Work Week G or = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Semiconductor Components Industries, C, 20 May, 20 Rev. 3 Publication Order Number: MC4X32/D
2 MC4X32 CC A2 B2 O2 A3 B3 O A0 B0 O0 A B O GND Figure. 4 ead Pinout (Top iew) PIN NAMES Pins An, Bn On Function Data Inputs Outputs A0 B0 A B A2 B2 A3 B O0 6 O O2 8 O3 FUNCTION TABE An INPUTS Bn OUTPUTS On Figure 2. ogic Diagram ORDERING INFORMATION Device Package Shipping MC4X32DR2G SOIC 4 (Pb Free) 2500 Tape & Reel MC4X32DTR2G TSSOP 4* 2500 Tape & Reel MC4X32MG SOEIAJ 4 (Pb Free) 50 Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *This package is inherently Pb Free. 2
3 MC4X32 MAXIMUM RATINGS SymbolÎ Parameter alue Unit CC Î DC Supply oltage 0.5 to +.0 in Î DC Input oltage 0.5 to +.0 out Î DC Output oltage 0.5 to CC +0.5 I IK Î Input Diode Current 20 ma I OK Î Output Diode Current ±20 ma I out Î DC Output Current, per Pin ±25 ma I CC Î DC Supply Current, CC and GND Pins ±50 ma P D Î Power Dissipation 80 mw T stg Î Storage Temperature 65 to +50 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Î Symbol Parameter Min Max Unit CC DC Supply oltage 3.6 in DC Input oltage out DC Output oltage 0 CC Î T A Operating Temperature, All Package Types C Î t/ Input Rise and Fall Time 0 00 ns/ DC EECTRICA CARACTERISTICS ÎÎ T A = 25 C T A = 40 to SymbolÎÎ Parameter Test Conditions CC 85 C Min Typ Max Min Max Unit I ÎÎ igh evel Input oltage.5 Î Î 3.0 ÎÎ I ow evel Input oltage O ÎÎ igh evel Output oltage I O = 50 A.9 ( Î in = I or I ) I O = 50 A I O = 4mA O ÎÎ ow evel Output oltage I O = 50 A ( Î in = I or I ) I O = 50 A 3.0 I O ÎÎ Î = 4mA I in Î Input eakage Current in ÎÎ ÎÎ = 5.5 or GND 3.6 ±0. ±.0 A Quiescent Supply Current in = CC Î or GND I CC A 3
4 MC4X32 AC EECTRICA CARACTERISTICS (Input t r = t f = 3.0ns) ÎÎ T A = 25 C T A = 40 to 85 C SymbolÎÎ Parameter Test Conditions Min Typ Max Min Max Unit t P, ÎÎ Propagation Delay, Input to CC = 2. C = 5pF t P Output C = 50pF ns Î Î CC = 3.3 ± 0.3 C = 5pF Î C = 50pF t OS Output to Output Skew CC = 2. C = t OS ÎÎ (Note ) CC = 3.3 ±0.3 C = 50pF ns. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either IG to OW (t OS ) or OW to IG (t OS ); parameter guaranteed by design. CAPACITIE CARACTERISTICS T Î A = 25 C T A = 40 to 85 C Î Symbol Parameter Min Typ Max Min Max Unit Cin Input Capacitance pf C PD Power Dissipation Capacitance (Note 2) 2. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC / 4 (per gate). C PD is used to determine the no load dynamic power consumption; P D = C PD CC 2 f in + I CC CC. NOISE CARACTERISTICS (Input t r = t f = 3.0ns, C = 50pF, CC = 3.3, Measured in SOIC Package) Symbol Characteristic 4 T A = 25 C OP Quiet Output Maximum Dynamic O O Quiet Output Minimum Dynamic O ID Minimum igh evel Dynamic Input oltage ID Maximum ow evel Dynamic Input oltage 0.8 Typ Max pf Unit TEST POINT A or B 50% t P t P CC GND DEICE UNDER TEST OUTPUT C * O 50% CC *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit 4
5 T SEATING PANE G A 4 8 D 4 P B K P P C 0.25 (0.00) M T B S A S MC4X32 PACKAGE DIMENSIONS SOIC 4 D SUFFIX CASE 5A 03 ISSUE J 0.25 (0.00) M B M NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETER. 3. DIMENSIONS A AND B DO NOT INCUDE MOD PROTRUSION. 4. MAXIMUM MOD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.2 (0.005) TOTA IN EXCESS OF TE D DIMENSION AT MAXIMUM MATERIA CONDITION. MIIMETERS INCES R X 45 F DIM MIN MAX MIN MAX A B C D M J F G.2 BSC BSC J K M 0 0 P R SODERING FOOTPRINT 4X 0.58 X.04 4X.52.2 PITC DIMENSIONS: MIIMETERS 5
6 MC4X32 PACKAGE DIMENSIONS TSSOP 4 DT SUFFIX CASE 948G 0 ISSUE B 0.5 (0.006) T 0.5 (0.006) T 0.0 (0.004) T SEATING PANE U U S 2X /2 PIN IDENT. S D C 4 G 4X K REF A 0.0 (0.004) M T U S S 8 B U N N J J F DETAI E DETAI E 0.25 (0.00) K K M ÇÇÇ ÉÉÉ SECTION N N W NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETER. 3. DIMENSION A DOES NOT INCUDE MOD FAS, PROTRUSIONS OR GATE BURRS. MOD FAS OR GATE BURRS SA NOT EXCEED 0.5 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCUDE INTEREAD FAS OR PROTRUSION. INTEREAD FAS OR PROTRUSION SA NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIMENSION K DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.08 (0.003) TOTA IN EXCESS OF TE K DIMENSION AT MAXIMUM MATERIA CONDITION. 6. TERMINA NUMBERS ARE SOWN FOR REFERENCE ONY.. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PANE W. MIIMETERS INCES DIM MIN MAX MIN MAX A B C D F G 0.65 BSC BSC J J K K BSC BSC M SODERING FOOTPRINT PITC 4X X.26 DIMENSIONS: MIIMETERS 6
7 MC4X32 PACKAGE DIMENSIONS SOEIAJ 4 CASE ISSUE B e 4 8 Z D E A E IEW P M E Q DETAI P NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETER. 3. DIMENSIONS D AND E DO NOT INCUDE MOD FAS OR PROTRUSIONS AND ARE MEASURED AT TE PARTING INE. MOD FAS OR PROTRUSIONS SA NOT EXCEED 0.5 (0.006) PER SIDE. 4. TERMINA NUMBERS ARE SOWN FOR REFERENCE ONY. 5. TE EAD WIDT DIMENSION (b) DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.08 (0.003) TOTA IN EXCESS OF TE EAD WIDT DIMENSION AT MAXIMUM MATERIA CONDITION. DAMBAR CANNOT BE OCATED ON TE OWER RADIUS OR TE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT EAD TO BE 0.46 ( 0.08). MIIMETERS INCES A b A A DIM MIN MAX MIN MAX 0.3 (0.005) M 0.0 (0.004) b c D E e.2 BSC BSC E E M Q Z c ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 802 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC4X32/D
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