Thick Film Resistor Array

Transcription

1 , CRA12S Thick Film Resistor Arry STANDARD ELECTRICAL SPECIFICATIONS CRA12S POER RATING P 70 C LIMITING ELEMENT VOLTAGE MAX. V FEATURES Convex terminl rry vilble with either sclloped corners (E version) or squre corners (S version) ide ohmic rnge: R to 1M0 8 or terminl pckge with isolted resistors Pure tin solder contcts on Ni brrier lyer, provides comptibility with led (Pb)-free nd led contining soldering processes Complint to RoHS Directive /95/EC Hlogen-free ccording to IEC definition TEMPERATURE COEFFICIENT ppm/k TOLERANCE % RESISTANCE RANGE Ω SERIES ; ; 0.0 ± 0 ± 1 E24; E96 50 R to 1M ± 0 ± 2; ± 5 E24 Zero-Ohm-Resistor: R mx. = 50 mω, I mx. = 1.5 A TECHNICAL SPECIFICATIONS PARAMETER UNIT AND CRA12S ; ; AND CRA12S Rted dissiption t P (1) 70 per element Limiting element voltge U mx. AC/DC V 50 Insultion voltge U ins (1 min) V 0 Insultion resistnce Ω > 9 Ctegory temperture rnge C - 55 to (1) Power rting depends on the mx. temperture t the solder point, the component plcement density nd the substrte mteril. PART NUMBER AND PRODUCT DESPRIPTION Prt Number: 347K0JTR (2) C R A 1 2 E K 0 J T R TERMINAL STYLE PIN VALUE TOLERANCE PACKAGING SPECIAL CRA12 S TR Up to 2 digits E TL 1 = 2 = 3 = 8 = Product Description: 47K 5 % RB8 e3 R = Deciml K = Thousnd M = Million 0000 = 0 Ω Jumper (2) Preferred wy for ordering products is by use of the PART NUMBER. F = ± 1 % G = ± 2 % J = ± 5 % Z = 0 Ω Jumper 47K 5 % RB8 e3 PIN RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE CRA12S R = Ω 47K = 47 kω 1M = 1 MΩ 0R0 = Jumper ± 1 % ± 2 % ± 5 % RB8 RD7 e3 = Pure tin termintion finish For technicl questions, contct: thickfilmchip@vishy.com Document Number: Revision: -Dec-

2 Thick Film Resistor Arry, CRA12S AVAILABLE TYPES AND RANGES TERMINAL COUNT CRA12S TEMPERATURE COEFFICIENT ± 0 ppm/k ± 0 ppm/k TOLERANCE ± 1 %; ± 2 %; ± 5 % PACKAGING TAPE IDTH DIAMETER PITCH PIECES/REEL CRA12S 12 mm 180 mm/7" 330 mm/13" 8 mm BLISTER TAPE ACC. IEC 686-3, TYPE II PART NUMBER PRODUCT DESCRIPTION TR TL RB8 RD7 Circuit Circuit Pin 1 8 pin pin Pin 1 pin Circuit Circuit 8 pin pin Pin 1 Document Number: 3 For technicl questions, contct: thickfilmchip@vishy.com Revision: -Dec- 249

3 , CRA12S Thick Film Resistor Arry DERATING Frction of Rted Dissiption in % Ambient Temperture in C DIMENSIONS S-Version B E-Version B A* P T A* P T B* L B* L A A PIN 1 PIN 1 p p e d c c b e b PIN NO # DIMENSIONS in millimeters L A A* B B* P T SOLDER PAD DIMENSIONS in millimeters c w d p b e AVE REFLO CRA12S TOL. ± 0.15 ± 0.15 ± 0.15 ± 0.25 ± 0.2 ± 0.1 ± 0.15 ± For technicl questions, contct: thickfilmchip@vishy.com Document Number: Revision: -Dec-

4 Thick Film Resistor Arry, CRA12S TEST PROCEDURES AND REQUIREMENTS EN CLAUSE IEC TEST METHOD TEST (1) Figures re given for single element. PROCEDURE All tests re crried out in ccordnce with the following specifictions: EN 615-1, generic specifiction EN , sectionl specifiction EN , detil specifiction IEC environmentl test procedures Pckging of components is done in pper or blister tpes ccording to IEC REQUIREMENTS PERMISSIBLE CHANGE (ΔR) (1) STABILITY CLASS 1 OR BETTER STABILITY CLASS 2 OR BETTER Stbility for product type: /CRA12S Ω to 1 MΩ Resistnce - ± 1 % ± 2 %, ± 5 % Voltge proof U = 1.4 x U ins ; 60 s No flshover or brekdown Short time overlod U = 2.5 x P 70 x R 2 x U mx. ; Durtion ccording to style (Td) Solderbility Solder bth method; Sn60Pb40; non-ctivted flux; (235 ± 5) C; (2 ± 0.2) s Solder bth method; Sn96.5Ag3Cu0.5; non-ctivted flux; (245 ± 5) C; (3 ± 0.3) s Good tinning ( 95 % covered) no visible dmge Good tinning ( 95 % covered) no visible dmge Temperture coefficient (/- 55/) C nd (/125/) C ± 0 ppm/k ± 0 ppm/k (U U3 ) Sher (dhesion) 45 N No visible dmge (U U1 ) Substrte bending Depth 2 mm; 3 times No visible dmge, no open circuit in bent position ± (0.25 % R Ω) (N) Rpid chnge of temperture 30 min. t - 55 C; 30 min t 125 C 5 cycles 00 cycles Dry het (B) Dmp het, cyclic 125 C; 16 h (Db) Cold 55 C; 90 % RH; 24 h; 1 cycle (A) Low ir pressure - 55 C; 2 h (M) - 1 kp; (25 ± ) C; 1 h (Db) Dmp het, cyclic 55 C; 90 % RH; 24 h; 5 cycle DC lod U = P 70 x R U = P 70 x R U mx. 1.5 h on; 0.5 h off; Endurnce t 70 C 70 C; 00 h 70 C; 8000 h (Td) Resistnce to soldering het Solder bth method; (260 ± 5) C; ( ± 1) s ± (0.25 % R Ω) ± (0.5 % R Ω) ± (2 % R Ω) ± (2 % R Ω) ± (2 % R Ω) ± (4 % R Ω) Flmmbility, needle flme test IEC ; s No burning fter 30 s (Cb) Dmp het, stedy stte (40 ± 2) C; (93 ± 3) % RH; 56 dys Endurnce t upper ctegory temperture 155 C; 00 h ± (2 % R Ω) Electrosttic dischrge (humn body model) IEC ; 3 positive nd 3 negtive dischrges; ESD voltge: 500 V (XA) Component solvent resistnce Isopropyl lcohol; 50 C; method 2 No visible dmge (XA) Solvent resistnce of mrking Isopropyl lcohol; 50 C; method 1; toothbrush Mrking legible, no visible dmge (Fc) Vibrtion, endurnce by sweeping Periodic electric overlod Single pulse high voltge overlod, µs/700 µs f = Hz to 00 Hz; x, y, z 1.5 mm; A 0 m/s 2 ; sweeps per xis U = 15 x P 70 x R 2 x U mx. 0.1 s on; 2.5 s off; 00 cycles Û = x P 70 x R 2 x U mx. pulses Document Number: 3 For technicl questions, contct: thickfilmchip@vishy.com Revision: -Dec- 251

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