Thick Film Chip Resistor Array

Transcription

1 STANDARD ELECTRICAL SPECIFICATIONS CRA12E CRA12S Thick Film Chip Resistor Arry POER RATING P 70 C LIMITING ELEMENT VOLTAGE MAX. V FETAURES Convex terminl rry vilble with either sclloped corners (E version) or squre corners (S version) ide ohmic rnge: 10R to 1M0 8 or 10 terminl pckge with isolted resistors Pure tin solder contcts on Ni brrier lyer, provides comptibility with led (Pb)-free nd led contining soldering processes Mteril ctegoriztion: For definitions of complince plese see TEMPERATURE COEFFICIENT ± ppm/k TOLERANCE ± % RESISTANCE RANGE (1) Power rting depends on the mx. temperture t the solder point, the component plcement density nd the substrte mteril. SERIES ; ; to 1M E24; E ; 5 10 to 1M E24 Zero-Ohm-Resistor: R mx. = 50 m, I mx. = 1.5 A TECHNICAL SEPCIFICATIONS PARAMETER UNIT CRA12E AND CRA12S ; ; CRA12E AND CRA12S Rted dissiption t P (1) 70 per element Limiting element voltge U mx. AC/DC V 50 Insultion voltge U ins (1 min) V 100 Insultion resistnce > 10 9 Ctegory temperture rnge C - 55 to PART NUMBER AND PRODUCT DESCRIPTION Prt Number: CRA12E08347K0JTR (2) C R A 1 2 E K 0 J T R TERMINAL STYLE PIN VALUE TOLERANCE PACKAGING SPECIAL CRA12 S 08 1 = R = Deciml F = ± 1 % TR Up to 2 digits E 10 2 = K = Thousnd G = ± 2 % 3 = M = Million J = ± 5 % TL 8 = 0000 = 0 Jumper Z = 0 Jumper Product Description: CRA12E 08 47K 5 % RB8 e3 CRA12E 08 47K 5% RB8 e3 PIN CRA12E CRA12S RESISTANCE VALUE 10R = 10 47K = 47 k 1M = 1M 0R0 = Jumper TOLERANCE PACKAGING LEAD (Pb)-FREE ± 1 % ± 2 % ± 5 % RB8 RD7 e3 = Pure tin termintion finish (2) Preferred wy for ordering products is by use of the PART NUMBER. Revision: 24-Jun-13 1 Document Number: 310 For technicl questions, contct: thickfilmchip@vishy.com THIS DOCUMENT IS SUBJECT TO CHANGE ITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 AVAILABLE TYPES AND RANGES TERMINAL COUNT CRA12S 10 CRA12E TEMPERATURE COEFFICIENT ± 100 ppm/k ± 0 ppm/k TOLERANCE ± 1 %; ± 2 %; ± 5 % PACKAGING TAPE IDTH DIAMETER PITCH PIECES/REEL CRA12E 08 CRA12E 10 CRA12S mm 180 mm/7" 330 mm/13" 8 mm BLISTER TAPE ACC. IEC 686-3, TYPE II PART NUMBER PRODUCT DESCRIPTION TR TL RB8 RD7 Circuit Circuit Pin 1 8 pin 10 pin Pin 1 10 pin Circuit Circuit 8 pin 10 pin Pin 1 Revision: 24-Jun-13 2 Document Number: 310 For technicl questions, contct: thickfilmchip@vishy.com THIS DOCUMENT IS SUBJECT TO CHANGE ITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 DERATING Frction of Rted Dissiption in % Ambient Temperture in C DIMENSIONS S-Version B E-Version B A* P T A* P T B* L B* L A A PIN 1 PIN 1 p p e d c c b e b PIN DIMENSIONS in millimeters NO # L A A* B B* P T CRA12E CRA12E CRA12S TOL. ± 0.15 ± 0.15 ± 0.15 ± 0.25 ± 0.2 ± 0.1 ± 0.15 ± 0.15 SOLDER PAD DIMENSIONS in millimeters c w d p b e AVE REFLO Revision: 24-Jun-13 3 Document Number: 310 For technicl questions, contct: thickfilmchip@vishy.com THIS DOCUMENT IS SUBJECT TO CHANGE ITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 TEST PROCEDURES AND REQUIREMENTS EN CLAUSE IEC TEST METHOD TEST (Td) Solderbility PROCEDURE (1) Figures re given for single element. All tests re crried out in ccordnce with the following specifictions: EN 615-1, generic specifiction EN , sectionl specifiction EN , detil specifiction IEC environmentl test procedures Pckging of components is done in pper or blister tpes ccording to IEC REQUIREMENTS PERMISSIBLE CHANGE ( R) (1) STABILITY CLASS 1 OR BETTER STABILITY CLASS 2 OR BETTER Stbility for product type: CRA12E/CRA12S 10 to 1 M Resistnce - ± 1 % ± 2 %, ± 5 % Voltge proof U = 1.4 x U ins ; 60 s No flshover or brekdown U = 2.5 x P 2 x U Short time overlod 70 x R mx. ; Durtion ccording to style ± (0.25 % R ) ± (0.5 % R ) Solder bth method; Sn60Pb40; Good tinning ( 95 % covered) non-ctivted flux; no visible dmge (235 ± 5) C; (2 ± 0.2) s Solder bth method; Sn96.5Ag3Cu0.5; non-ctivted flux; (245 ± 5) C; (3 ± 0.3) s Good tinning ( 95 % covered) no visible dmge Temperture coefficient (/- 55/) C nd (/125/) C ± 100 ppm/k ± 0 ppm/k (U U3 ) Sher (dhesion) 45 N No visible dmge (U U1 ) Substrte bending Depth 2 mm; 3 times No visible dmge, no open circuit in bent position ± (0.25 % R ) 30 min. t - 55 C; 30 min t 125 C (N) Rpid chnge of temperture 5 cycles 1000 cycles ± (0.25 % R ) ± (0.5 % R ) Dry het (B) Dmp het, cyclic 125 C; 16 h (Db) Cold 55 C; 90 % RH; 24 h; 1 cycle (A) Low ir pressure - 55 C; 2 h ± (2 % R ) (M) - 1 kp; (25 ± 10) C; 1 h (Db) Dmp het, cyclic 55 C; 90 % RH; 24 h; 5 cycle DC lod U = P 70 x R Endurnce t 70 C U = P 70 x R U mx. 1.5 h on; 0.5 h off; 70 C; 1000 h 70 C; 8000 h Solder bth method; (260 ± 5) C; (10 ± 1) s ± (2 % R ) ± (2 % R ) ± (4 % R ) (Td) Resistnce to soldering het ± (0.25 % R ) ± (0.5 % R ) Flmmbility, needle flme test IEC ; 10 s No burning fter 30 s (Cb) Dmp het, stedy stte (40 ± 2) C; (93 ± 3) % RH; 56 dys Endurnce t upper ctegory temperture 155 C; 1000 h ± (2 % R ) Electrosttic dischrge (humn body model) IEC ; 3 positive nd 3 negtive dischrges; ESD voltge: 500 V (XA) Component solvent resistnce Isopropyl lcohol; 50 C; method 2 No visible dmge Isopropyl lcohol; 50 C; method 1; Mrking legible, (XA) Solvent resistnce of mrking toothbrush no visible dmge Vibrtion, endurnce f = 10 Hz to 00 Hz; x, y, z 1.5 mm; (Fc) by sweeping A 0 m/s 2 ± (0.25 % R ) ± (0.5 % R ) ; 10 sweeps per xis U = 15 x P Periodic electric overlod 70 x R 2 x U mx. 0.1 s on; 2.5 s off; 1000 cycles Single pulse high voltge Û = 10 x P x R 2 x U mx. overlod, 10 μs/700 μs 10 pulses Revision: 24-Jun-13 4 Document Number: 310 For technicl questions, contct: thickfilmchip@vishy.com THIS DOCUMENT IS SUBJECT TO CHANGE ITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

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