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1 Ultralow V F Hyperfast Rectifier for Discontinuous Mode PFC, 5 FRED Pt 3 2L TO-22C 2 FETURES Hyperfast recovery time Benchmark ultralow forward voltage drop 75 C operating junction temperature Low leakage current Designed and qualified according to JEDEC -JESD 47 Material categorization: for definitions of compliance please see Base cathode 2 3 Cathode node PRIMRY CHRCTERISTICS I F(V) 5 V R 6 V V F at I F.85 V t rr typ. 6 ns T J max. 75 C Package 2L TO-22C Circuit configuration Single DESCRIPTION State of the art, ultralow V F, soft-switching hyperfast rectifiers optimized for Discontinuous (Critical) Mode (DCM) Power Factor Correction (PFC). The minimized conduction loss, optimized stored charge and low recovery current minimize the switching losses and reduce over dissipation in the switching element and snubbers. The device is also intended for use as a freewheeling diode in power supplies and other power switching applications. PPLICTIONS C/DC SMPS 7 W to 4 W e.g. laptop and printer C adaptors, desktop PC, TV and monitor, games units and DVD C/DC power supplies. BSOLUTE MXIMUM RTINGS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Peak repetitive reverse voltage V RRM 6 V verage rectified forward current I F(V) T C = 54 C 5 Non-repetitive peak surge current I FSM 25 Peak repetitive forward current I FM 3 Operating junction and storage temperatures T J, T Stg -65 to +75 C ELECTRICL SPECIFICTIONS ( unless otherwise specified) PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS Breakdown voltage, blocking voltage V BR, V R I R = μ I F = Forward voltage V F I F = 5, T J = 5 C V R = V R rated -. Reverse leakage current I R T J = 5 C, V R = V R rated μ Junction capacitance C T V R = 6 V pf Series inductance L S Measured lead to lead 5 mm from package body nh V Revision: 23-Nov-7 Document Number: 9675
2 DYNMIC RECOVERY CHRCTERISTICS (T C = 25 C unless otherwise specified) PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS I F =, di F /dt = /μs, V R = 3 V Reverse recovery time t rr I F = 5, di F /dt = /μs, V R = 3 V ns T J = 25 C I F = Peak recovery current I RRM di F /dt = 2 /μs T J = 25 C V R = 39 V Reverse recovery charge Q rr μc T J = 25 C THERML MECHNICL SPECIFICTIONS PRMETER SYMBOL TEST CONDITIONS MIN. TYP. MX. UNITS Maximum junction and storage temperature range T J, T Stg C Thermal resistance, junction-to-case R thjc -..3 Thermal resistance, junction-to-ambient per R leg thj Typical socket mount Mounting surface, flat, smooth, Thermal resistance, case-to-heatsink R thcs and greased Weight Mounting torque C/W g oz. Marking device Case style 2L TO-22C 5ETL6 6. (5.) - 2 () kgf cm (lbf in) I F - Instantaneous Forward Current () T J = 75 C T J = 5 C V FM - Forward Voltage Drop (V) Fig. - Maximum Forward Voltage Drop Characteristics I R - Reverse Current (µ).. T J = 75 C T J = 5 C T J = 25 C T J = C T J = 75 C T J = 5 C V R - Reverse Voltage (V) Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage Revision: 23-Nov-7 2 Document Number: 9675
3 C T - Junction Capacitance (pf) V R - Reverse Voltage (V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage Z thjc - Thermal Impedance ( C/W) D =.5 t. D =.2 D =. t 2 D =.5 Notes: D =.2 Single pulse. Duty factor D = t /t 2. D =. (thermal resistance) 2. Peak T J = P DM x Z thjc + T C t - Rectangular Pulse Duration (s) Fig. 4 - Maximum Thermal Impedance Z thjc Characteristics P DM. llowable Case Temperature ( C) See note () DC Square wave (D =.5) Rated V R applied verage Power Loss (W) DC RMS limit D =. D =.2 D =.5 D =. D =.2 D = I F(V) - verage Forward Current () Fig. 5 - Maximum llowable Case Temperature vs. verage Forward Current I F(V) - verage Forward Current () Fig. 6 - Forward Power Loss Characteristics Note () Formula used: T C = T J - (Pd + Pd REV ) x R thjc ; Pd = forward power loss = I F(V) x V FM at (I F(V) /D) (see fig. 5); Pd REV = inverse power loss = V R x I R ( - D); I R at V R = rated V R Revision: 23-Nov-7 3 Document Number: 9675
4 t rr (ns) I F = 3 I F = 5 Q rr (nc) I F = 3 I F = 5 V R = 39 V T J = 25 C di F /dt (/µs) Fig. 7 - Typical Reverse Recovery Time vs. di F /dt 2 V R = 39 V T J = 25 C di F /dt (/µs) Fig. 8 - Typical Stored Charge vs. di F /dt (3) t rr I F t a tb (2) I RRM (4) Q rr.5 I RRM di (rec)m /dt (5).75 I RRM () di F /dt () di F /dt - rate of change of current through zero crossing (2) I RRM - peak reverse recovery current (3) t rr - reverse recovery time measured from zero crossing point of negative going I F to point where a line passing through.75 I RRM and.5 I RRM extrapolated to zero current. (4) Q rr - area under curve defined by t rr and I RRM t rr x I Q RRM rr = 2 (5) di (rec)m /dt - peak rate of change of current during t b portion of t rr Fig. 9 - Reverse Recovery Waveform and Definitions Revision: 23-Nov-7 4 Document Number: 9675
5 ORDERING INFORMTION TBLE Device code VS- 5 E T L 6 -M product 2 - Current rating (5 = 5 ) 3 - E = single diode 4 - T = TO-22, D 2 PK (TO-263B) 5 - L = ultralow V F hyperfast recovery 6 - Voltage rating (6 = 6 V) 7 - Environmental digit: -M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free ORDERING INFORMTION (Example) PREFERRED P/N QUNTITY PER T/R MINIMUM ORDER QUNTITY PCKGING DESCRIPTION 5 ntistatic plastic tube Dimensions Part marking information SPICE model LINKS TO RELTED DOCUMENTS Revision: 23-Nov-7 5 Document Number: 9675
6 DIMENSIONS in millimeters and inches 2L TO-22C Outline Dimensions Q (6) E Ø P.4 M B M (6) H (7) B (H) (E) Thermal pad 2 D C C D L (2) (6) D c D2 (6) D 2 x b 2 x b2 Detail B 2 Detail B L C E (6) Base metal (b, b2) Plating.5 M B M 2 x e e View - c c (4) (4) b, b3 Section C - C and D - D Lead tip Conforms to JEDEC outline TO-22C SYMBOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMBOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES D E , E b e b e b H , 7 b L c L c Ø P D Q D Notes () Dimensioning and tolerancing as per SME Y4.5M-994 (2) Lead dimension and finish uncontrolled in L (3) Dimension D, D, and E do not include mold flash. Mold flash shall not exceed.27 mm (.5") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b, b3, and c apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H, D2, and E (7) Outline conforms to JEDEC TO-22, except D2 (minimum) Revision: 6-Dec-7 Document Number: 9656
7 Legal Disclaimer Notice Vishay Disclaimer LL PRODUCT, PRODUCT SPECIFICTIONS ND DT RE SUBJECT TO CHNGE WITHOUT NOTICE TO IMPROVE RELIBILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. ll operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 27 VISHY INTERTECHNOLOGY, INC. LL RIGHTS RESERVED Revision: 8-Feb-7 Document Number: 9
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