BOARD, PACKAGE AND DIE THICKNESS EFFECTS UNDER THERMAL CYCLING CONDITIONS
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1 BOARD, PACKAGE AND DIE THICKNESS EFFECTS UNDER THERMAL CYCLING CONDITIONS APT2 Session: BGA Reliability Sept. 29, 2015, Rosemont, IL Jean-Paul Clech EPSI Inc. Montclair, NJ 2015 EPSI Inc. 1
2 Outline Board thickness problem Model description Validation examples Conclusions Q & A 2015 EPSI Inc. 2
3 Board thickness problem (1) Board thickness varies by > 10 times across the industry Industry standards do not provide scaling factors for board thickness effect 2.37 mm (93 mil) Component 5.08 mm (200 mil) BOARD 0.25 mm 0.4 mm (16 mil) 0.8 mm (31.5 mil) 1.57 mm (62 mil) IPC9701 mandated 2015 EPSI Inc. 3
4 Board thickness problem (2) Board effective CTEs and Young s moduli change with board thickness Contrary to popular belief, there is no typical properties of FR-4 boards 2015 EPSI Inc. 4
5 Board thickness model (1) From strain energy models for SnPb and Pb-free assemblies (Clech et al., 1996, 2004, 2009), and as a first order approximation, cycles to failure N f go as: N f ~ 1 / [K * ( α α) 2 ] where the parameters that control the board thickness effect are: K = assembly stiffness α = Board-to-component CTE mismatch 2015 EPSI Inc. 5
6 Board thickness model (2) Neutral Axis COMPONENT: K 1 PWB: K 2 F F For single-sided assembly, K is the stiffness of three springs in series: K 1 : component stretching stiffness K 2 : board stretching stiffness 2015 EPSI Inc. 6
7 Board thickness model (3) Neutral Axis COMPONENT: d C PWB: d B H M C + F. h C /2 M B + F. h B /2 K 3 : bending stiffness of board and component bi-metallic strip d C and d B are board and component flexural rigidity factors 2015 EPSI Inc. 7
8 Board thickness model (4) For single-sided assemblies: N f = F 1 υ E C h C C + 1 υ 2E B 2 B h B + E α f C h 3 C 2 + f B 3 B ( ) ( 2 υ 6 1 υ ) C H E hc H = + hs + 2 h B h B 2 N 1 from component axial compliance + + N 2 from board axial compliance N 3 from assembly flexural compliance F = model calibration factor (for given component size and thermal cycle) 2015 EPSI Inc. 8
9 Board thickness model (5) Neutral Axis COMPONENT CTE: α c Moduli: E C, E C f Poisson s ratio: ν C PWB X/Y CTEs: α B Moduli: E B, E B f Poisson s ratio: ν B h C h S h B For double-sided assemblies: 2 1 υc 1 υ B + EChC EBhB N f = F 2 α N 1 + N EPSI Inc. 9
10 # 1: Single-sided HiTCE CBGA (1) Fit of model to board thickness data from Shih et al., EPSI Inc. 10
11 # 1: Single-sided HiTCE CBGA (2) Drop in life from 93 to 130 mil board is larger (compared to 62 vs. 93 mil) due to higher board modulus and CTE 2015 EPSI Inc. 11
12 # 1: Single-sided HiTCE CBGA (3) Board axial compliance becomes the controlling factor for very thin boards. Board axial compliance dominant effect Flexural compliance dominant effect 2015 EPSI Inc. 12
13 # 2: Mirrored HiTCE CBGAs Using the same calibration factor as for single-sided boards, the model predicts the life of mirrored assemblies 2015 EPSI Inc. 13
14 # 3: Die Thickness Effect WLCSP on 1 mm (39 mil) board By symmetry, the model applies to bare die assemblies µm die data falls in shoulder area of the curve, giving support to the shape of single-sided model 2015 EPSI Inc. 14
15 # 4: CBGA Thickness Effect Single calibration factor is used to fit model to SAC data of Farooq et al., Life goes as 1/DNP (not 1/DNP 2 ) when pitch is constant 2015 EPSI Inc. 15
16 Summary Model has been validated for: Board thickness: mm ( mil) Single-sided and mirrored assemblies Die thickness: 200 to 775 microns CBGA thickness: 1.5 to 3.7 mm 2015 EPSI Inc. 16
17 Conclusions Strength-of-materials model captures board thickness effect for single-sided and mirrored assemblies Approach can help reduce cost of product reliability assessment Board thickness effect is NOT just about board thickness Effective board properties: CTEs AND Young s moduli matter and change with board thickness 2015 EPSI Inc. 17
18 Acknowledgments Rocky Shih, Jian Miremadi Hewlett-Packard 2015 EPSI Inc. 18
19 Thank You! Jean-Paul Clech +1 (973) EPSI Inc. 19
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